TX08D TI | Alldatasheet
Document overview
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Technical content
TX08D 8-Channel Ultrasound Transmitter
1 Features
- 8-Channel transmitter, each channel includes: – 5-level pulser with on-chip beamforming – Active T/R switch – Integrated floating supplies
- 5-Level Pulser supports: – Maximum output voltage: ±100V – Minimum output voltage: ±1V – Maximum output current: 2A – Support 4A output current mode – True return to zero to discharge to ground – Second harmonic of –45dBc at 5MHz – –3dB Bandwidth with 220Ω || 240pF load
- –20MHz for a ±100V supply
- 35MHz for a ±100V supply in 4A – Integrated jitter: 100fs from 100Hz to 20kHz – CW mode close-in phase noise: –154dBc/Hz at 1kHz offset for 5MHz signal
- Active T/R switch with: – Turn ON resistance: 8Ω – Turn ON and OFF time: 300ns – Channel based T/R switch on and off controls
- On-chip beamformer for pulser with: – Channel based T/R switch on and off controls – Delay resolution: Half beamformer clock period, minimum 1.56ns – Maximum delay: 214 beamformer clock period – Per channel 960 × 32 bits memory to store waveform and delay values.
- High-speed (400MHz maximum), 2-lane LVDS serial programming interface – Very low programming time: < 500ns for delay profile update – 32-bit Checksum feature to detect wrong SPI writes
- Internal temperature sensor and automatic thermal shutdown
- No specific power sequencing requirement
- Error flag register to detect multiple faulty condition
- Integrated passives for the floating supplies and bias voltages
- Small package: FCCSP-196 (12mm × 12mm) with 0.8mm pitch
2 Applications
- Ultrasound pulser imaging system
- Piezoelectric driver
3 Description
The TX08D is a transmitter solution for ultrasound imaging systems. The device supports eight channels with each channel consisting of pulser transmit/ receive (T/R) switches.
Package Information
PART NUMBER PACKAGE(1) PACKAGE SIZE(2) TX08D ACP (FCCSP, 196) 12mm × 12mm (1) For all available packages, see the orderable addendum at the end of the data sheet. (2) The package size (length × width) is a nominal value and includes pins, where applicable. ADVANCE INFORMATION TX08D SBASAW7A – OCTOBER 2023 – REVISED JANUARY 2024 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. ADVANCE INFORMATION for preproduction products; subject to change without notice.
6 Mechanical, Packaging, and Orderable Information....3 TX08D SBASAW7A – OCTOBER 2023 – REVISED JANUARY 2024 www.ti.com ADVANCE INFORMATION
2 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated
Product Folder Links: TX08D
4 Device and Documentation Support
TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device, generate code, and develop solutions are listed below.
4.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Notifications to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.
4.2 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.
4.3 Trademarks
TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners.
4.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
4.5 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.
5 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision * (October 2023) to Revision A (January 2024) Page
- Changed data sheet title from: TX08D 8-Channel Transmitter to: TX08D 8-Channel Ultrasound Transmitter.. 1
6 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. www.ti.com TX08D SBASAW7A – OCTOBER 2023 – REVISED JANUARY 2024 ADVANCE INFORMATION Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 3 Product Folder Links: TX08D
www.ti.com PACKAGE OUTLINE12.111.9 12.111.9 1.321 MAX0.3930.293 196X 0.50.410.4 TYP
10.4 TYP
0.8 TYP0.8 TYP (0.8)(0.8) (0.448) FCBGA - 1.321 mm max heightACP0196ABALL GRID ARRAY BALL A1CORNER0.1 C 0.2 CSEATING PLANE0.2 C 0.15C A B0.08C SYMM SYMM 1A23456 7891011 12 13BCDEFGHJKLMN P SCALE 1.200 AB C TX08D SBASAW7A – OCTOBER 2023 – REVISED JANUARY 2024 www.ti.com ADVANCE INFORMATION
4 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated
Product Folder Links: TX08D
www.ti.com EXAMPLE BOARD LAYOUT 0.07 MAXALL AROUND0.07 MINALL AROUND (0.8) TYP(0.8) TYP196X (0.4) (0.4)METAL EDGE(0.4)SOLDER MASKOPENING FCBGA - 1.321 mm max heightACP0196ABALL GRID ARRAY LAND PATTERN EXAMPLEEXPOSED METAL SHOWNSCALE: 8XSYMM SYMM A1234567 8910 111213 14BCDEFGHJKLMNP EXPOSED METALSOLDER MASKOPENINGMETAL UNDERSOLDER MASKEXPOSED METALNOT TO SCALESOLDER MASK DETAILSNON-SOLDER MASKDEFINED(PREFERRED)SOLDER MASKDEFINED www.ti.com TX08D SBASAW7A – OCTOBER 2023 – REVISED JANUARY 2024 ADVANCE INFORMATION Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 5 Product Folder Links: TX08D
www.ti.com EXAMPLE STENCIL DESIGN (0.8) TYP(0.8) TYP196X (0.4) FCBGA - 1.321 mm max heightACP0196ABALL GRID ARRAY 4226793/B 07/2021NOTES: (continued) 4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. SOLDER PASTE EXAMPLEBASED ON 0.125 mm THICK STENCILSCALE: 8XSYMM SYMM A1234567 8910 111213 14BCDEFGHJKLMNP TX08D SBASAW7A – OCTOBER 2023 – REVISED JANUARY 2024 www.ti.com ADVANCE INFORMATION
6 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated
Product Folder Links: TX08D
www.ti.com 23-May-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) TX08DACP Active Production FCCSP (ACP) | 196 160 | JEDEC TRAY (5+1) - Call TI | Snagcu Level-3-260C-168 HR 0 to 70 (TX08D, TX7364) TX08DACP.B Active Production FCCSP (ACP) | 196 160 | JEDEC TRAY (5+1) - Call TI Level-3-260C-168 HR 0 to 70 (TX08D, TX7364) (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1
PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2025 TRAY L - Outer tray length without tabs KO - Outer tray height W - Outer tray width P1 - Tray unit pocket pitch CW - Measurement for tray edge (Y direction) to corner pocket center CL - Measurement for tray edge (X direction) to corner pocket center Text Chamfer on Tray corner indicates Pin 1 orientation of packed units. *All dimensions are nominal Device Package Name Package Type Pins SPQ Unit array matrix Max temperature (°C) L (mm) W (mm) (µm) (mm) CL (mm) CW (mm) TX08DACP ACP FCCSP 196 160 8 x 20 150 315 135.9 7620 15.4 11.2 19.65 Pack Materials-Page 1
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