TX0460A TAI-SAW | Alldatasheet
Document overview
- Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
- PDF pages: 7
Technical content
TAI-SAW TECHNOLOGY CO., LTD. 2 TST DCC Release document TAI-SAW TECHNOLOGY CO., LTD. SMD 7.0x5.0 32MHz Crystal Oscillator MODEL NO.: TX0460A REV. NO.: 1 Revise: N/A Initial release 08/05/11’ N/A Ann Liu
TAI-SAW TECHNOLOGY CO., LTD. 3 TST DCC Release document TAI-SAW TECHNOLOGY CO., LTD. No. 3, Industrial 2nd Rd., Ping-Chen Industrial District, Taoyuan, 324, Taiwan, R.O.C. TEL: 886-3-4690038 FAX: 886-3-4697532 E-mail: tstsales@mail.taisaw.com Web: www.taisaw.com 7.0x5.0 VCXO 32 MHz MODEL NO.: TX0460A REV. NO.:1 Features: 1. SMD type Voltage Controlled Crystal Oscillator. 2. 3.3V Supply Voltage 3. Optionable stand-by function for output (Tri-state output). Electrical Specifications: Measurement shall be made under room temperature and humidity at below conditions. Temperature: 25+/-3 ℃ Humidity: Below 70% RH Operating Temperature:-20 °C to +90 °C Storage Temperature: -55 °C to +125 °C Characteristics Units Minimum Typical Maximum Center Frequency MHz 32 Frequency Stability (#note 1) ppm -30 - 30 Input V oltage (Operating Vdd) VDC - 3.3+/-5% - Power Supply Current mA - - 20 Control V oltage (Vt) VDC 0.15 1.65 3.15 Frequency Pullability ppm +/-100 - - Frequency stability Vs. Supply V oltage varied 3.3V+/-5% ppm - 1.0 2.0 Load pF 15 Linearity % -10% - +10% Output Output Level CMOS “0” Level VDC - - 0.33 “1” Level VDC 2.97 - - Symmetry (TW/T*100%) Duty Cycle % 40% 50% 60% Rise Time (10%->90% VDD) nSec - - 10 Fall Time (90%->10% VDD) nSec - - 10 Phase Noise dBc/Hz -115dBc @100Hz -140dBc @ 1K -155dBc @ 10K Enable/Disable Function PIN#2: High or Open, PIN#4:Enable PIN#2: Low, PIN#4:Disable
TAI-SAW TECHNOLOGY CO., LTD. 4 TST DCC Release document #Note 1: Frequency stability includes 25℃ tolerance, operating te mperature range, aging and voltage or load change. Mechanical Dimensions (mm): Marking: Line 1: Customer Frequency (32.000) Line 2: (pin #1 dot) + TST Logo + Product Code + Date Code Product Code Table Date Code Table WK01 WK02 WK03 WK04 WK05 WK06 WK07 WK08 WK09 WK10 WK11 WK12 WK13 ABCDEFGH I JKLM WK14 WK15 WK16 WK17 WK18 WK19 WK20 WK21 WK22 WK23 WK24 WK25 WK26 NOPQRSTUVWXYZ WK27 WK28 WK29 WK30 WK31 WK32 WK33 WK34 WK35 WK36 WK37 WK38 WK39 abcde f gh i j k lm WK40 WK41 WK42 WK43 WK44 WK45 WK46 WK47 WK48 WK49 WK50 WK51 WK52 nopqr s t uvwxyz 2008 2009 2010 2011 2012 2013 2014 2015 Product Code x XxX Ye a r 32.000 ○Tx DA
TAI-SAW TECHNOLOGY CO., LTD. 5 TST DCC Release document Tape & Reel: Packing Quantity: 1k /Reel REEL DIMENSION (unit: mm) TAPE DIMENSION (unit: mm) 3. PACKING DIRECTION:
TAI-SAW TECHNOLOGY CO., LTD. 6 TST DCC Release document Packing Quantity/Packing: 1K pcs maximum per reel Reflow Profile: Note: 1.Max peak temperature: 260+/-5 deg C; Time: 10+/-2 sec 2. Temperature: 217+/-5 deg C; Time: 90~100 sec
TAI-SAW TECHNOLOGY CO., LTD. 7 TST DCC Release document Reliability Specifications Reference standard resistance to Temp./ Duration : 260°C /10sec ×2 times EIAJED-4701 Soldering heat Total time : 4min.(IR-reflow) (IR reflow) -300(301)M(II) Vibration Total peak amplitude : 1.5mm MIL-STD 202F Vibration frequency : 10 to 55 Hz method 201A Sweep period : 1.0 minute Vibration directions : 3 mutually perpendicular Duration : 2 hr / direc. Mechanical directions : 3 impacts per axis MIL-STD 202F Shock Acceleration : 3000g's, +20/-0 % method 213C Duration : 0.3 ms (total 18 shocks) Waveform : Half-sine Solderability Solder Temperature:265±5°C MIL-STD 883G Duration time: 5±0.5 seconds. method 2003 Thermal Shock Heat cycle conditions MIL-STD 883G -55 ℃ (30min) ←→ 125 ℃ (30min) method 1010.7 * cycle time : 10 times Humidity test Temperature : 70 ± 2 °C MIL-STD 202F Relative humidity : 90~95% method 103B Duration : 96 hours Dry heat Temperature : 125 ± 2 °C MIL-STD 883G ( Aging test ) Duration : 168 hours method 1008.2 condition C PCT test Pressure: 2.06kg/cm 2 (2.03*105 pa) EIAJED-4701-3 Temperature : 121 ± 2 °C B-123A Relative humidity : 100% Duration : 24 hours Environmental characteristics Mechanical characteristics Test name Test process / method