TX0430A

TX0430A TAI-SAW | Alldatasheet

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TAI-SAW TECH NOLOGY CO., LTD. 2 TST DCC Release document TAI-SAW TECHNOLOGY CO., LTD. TCXO 3.2x2.5mm 50.00MHz MODEL NO.: TX0430A REV. NO.: 2.0 Revise: N/A Initial release Modify marking Code 04/26/12’ 07/24/12’ N/A N/A JieAn Huang JieAn Huang

TAI-SAW TECH NOLOGY CO., LTD. 3 TST DCC Release document TAI-SAW TECHNOLOGY CO., LTD. No. 3, Industrial 2nd Rd., Ping-Chen Industrial District, Taoyuan, 324, Taiwan, R.O.C. TEL: 886-3-4690038 FAX: 886-3-4697532 E-mail: tstsales@mail.taisaw.com Web: www.taisaw.com TCXO 3.2x2.5mm 50.000MHz MODEL NO.: TX0430A REV. NO.: 2.0 Features: /circle6 Good Frequency Stability /circle6 Ultra Miniature SMD Package /circle6 Good Phase Noise Response Description and Applications: Surface mount 3.2x2.5 mm TCXO for use in wireless communications devices Electrical Specifications: TX0430A Specifications Nominal Frequency, Fo 50.000000 MHz Storage Temperature Range -40°C to +85 °C Operating Temperature Range -30 °C to +80 °C Power Supply Voltage, Vcc 3.0V +/- 5% Output Voltage with Load 10pF//10K Ω, Vout 0.8 Vp-p min Output Waveform Clipped Sinewave Power Supply Current, Icc 2.0 mA max Frequency Tolerance as receive (Vcon=1.5V) +/- 1.0 ppm max @ 25 °C +/- 2 °C Frequency Stability a. Vs. Temperature (-30~80 °C) b. Vs. Load varied 10pF//10K Ω+/-10% c. Vs. Supply Voltage varied 3.0V+/-5% +/- 2.5 ppm reference to 25 +/- 0.3 ppm +/- 0.3 ppm Start Up Time (90% of final RF level in Vp-p) 2.0 m sec max. Aging +/-1.0 ppm/year @25 °C SSB Phase Noise (@1KHz Carrier Offset) -130 dBc/Hz max RoHS Compliant Lead free Lead-free soldering

TAI-SAW TECH NOLOGY CO., LTD. 4 TST DCC Release document Dimensions (mm): Marking : Line 1: Customer Frequency (50.00) Line 2: TST Logo + Crystal Product Code + Date Code +Traceability code Crystal Product Code Table 2009 2010 2011 2012 Year 2013 2014 2015 2016 2017 2018 2019 2020 Code X x X x Date Code Table

TAI-SAW TECH NOLOGY CO., LTD. 5 TST DCC Release document WK01 WK02 WK03 WK04 WK05 WK06 WK07 WK08 WK09 WK10 WK11 WK12 WK1 3 A B C D E F G H I J K L M WK14 WK15 WK16 WK17 WK18 WK19 WK20 WK21 WK22 WK23 WK24 WK25 WK2 6 N O P Q R S T U V W X Y Z WK27 WK28 WK29 WK30 WK31 WK32 WK33 WK34 WK35 WK36 WK37 WK38 WK3 9 a b c d e f g h i j k l m WK40 WK41 WK42 WK43 WK44 WK45 WK46 WK47 WK48 WK49 WK50 WK51 WK5 2 n o p q r s t u v w x y z Traceability date code Month Jan Feb Mar Apr May Jun code A B C D E F Month July Aug Sep Oct Nov Dec code G H J K L M Recommended Circuit Packing (mm):

TAI-SAW TECH NOLOGY CO., LTD. 6 TST DCC Release document 1. Reel Dimension A B C D E F H G T2 T1 T3 2. Tape Dimension Unit: mm A0 B0 W F E P0 P1 P2 D1 D K0 t Packing Quantity/Packing:

TAI-SAW TECH NOLOGY CO., LTD. 7 TST DCC Release document Reflow Profile: 100 150 200 250 300 0 60 120 180 240 300 360 Time (seconds) Temperature (deg C) Notes of the Usage: 1. Touch the solder iron at 260+/-5 deg C onto the leads for 10+/-2 sec max or touch the solder at 350+/-5 deg C onto the leads for 3+/-0.5 sec. 2. In the customer’s reflow process, if it will remain s ome mechanical stress at the soldering terminals, also make some cracks on the soldering terminat ion. Some cracks will cause open or short circuit and cause of thermal increasing o r smoking. Don’t make any excess mechanical stress to soldering points. 3. In case of giving a heavy shock to the products, it may make an open or short circuit and cause of thermal increasing and smoking. To avoid heavy s hock impact applying to products is strictly required. Notes of the Storage: 1. To keep products under the condition at the room te mperature (-5~35 deg C) with normal humidity (45~75%). Absorption of moisture and dewdrop may make inferiority of characteristics and a short circuit. 2. Oxidization of terminals shall make the solderability more inferior. Dusts and corrosive gas will make a cause of the open or short circuit. Keep it in the clean place where is not in dusty and no corrosive gas. 3. Use the unti-static material to the storage package. 4. Don’t put any excess weight to the TCXO in the storag e process. Rising Area Preheat Area Forced Cooling Area Max peak temperature: 260 deg C Reflow Area

TAI-SAW TECH NOLOGY CO., LTD. 8 TST DCC Release document 5. Don’t move the product from the cold place to the hot place in the short time, otherwise it may make some dew-drop, then a short circuit may happen in case. 6. Storage periods should be maximum 6 months under con dition of above item 1 after delivery from TST factory. 7. Once open the bag, there is possibility of electrica l characteristics deterioration due to absorption of moisture. So, please use parts within 7 days after opening the bag. 8. If you have to keep parts without using after openin g the bag, please put the drying agent in the bag, fold the bag and keep it in the place wh ere temperature and humidity are controlled (nitrogen atmosphere box etc.)