TWL6040_V02 TI | Alldatasheet
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PRODUCT□PREVIEW Product Folder Sample & Buy T echnical Documents Tools & Software Support & Community TWL6040 SWCS052B –AUGUST 2010–REVISED AUGUST 2014 TWL60408-ChannelLow-PowerAudioCodecforPortableApplications
1 Device Overview
1.1 Features
- Four Audio Digital-to-Analog Converter (DAC) • Dual Phase-Locked Loops (PLLs) for Flexible Channels Clock Support:
- Stereo Capless Headphone Drivers: – 32-kHz Sleep Clock Input for System Low- Power Playback Mode– Up to 104-dB DR – 12-, 19.2-, 26-, and 38.4-MHz System Clock– Power Tune for Performance and Power InputConsumption Tradeoff
- Accessory Plug and Unplug Detection, Accessory• Stereo 8 Ω, 1.5 W per Channel Speaker Drivers Button Press Detection• Differential Earpiece Driver
- Integrated Power Supplies:• Stereo Line-Out – Negative Charge Pump for Capless Headphone• Two Audio Analog-to-Digital Converter (ADC) DriverChannels: – Two Low Dropout Voltage Regulators (LDOs)– 96-dBA SNR for High Power Supply Rejection Ratio (PSRR)• Four Audio Inputs: • I2C Control– Three Differential Microphone Inputs • Thermal Protection:– Stereo Line-In and FM Input – Host Interrupt• Two Vibrator and Haptics Feedback Channels: • Power Supplies:– Differential H-Bridge Drivers – Analog: 2.1 V• Two Low-Noise Analog Microphone Bias Outputs – Digital I/O: 1.8 V• Two Digital Microphone Bias Outputs – Battery: 2.3 to 5.5 V• Analog Low-Power Loop from Line-in to • Package 6-mm × 6-mm 120-Pin PBGAHeadphone and Speaker Outputs
1.2 Applications
- Mobile and Smart Phones • Handheld Devices
- MP3 Players
1.3 Description
The TWL6040 device is an audio coder/decoder (codec) with a high level of integration providing analog audio codec functions for portable applications, as shown in Figure 1-1. The device contains multiple audio analog inputs and outputs, as well as microphone biases and accessory detection. The device is connected to the OMAP™ 4 host processor through a proprietary PDM interface for audio data communication enabling partitioning with optimized power consumption and performance. Multichannel audio data is multiplexed to a single wire for downlink (PDML) and uplink (PDMUL). The OMAP4 device provides the TWL6040 device with five PDM audio-input channels (DL0–DL4). Channels DL0–DL3 are connected to four parallel DAC channels multiplexed to stereo headphone (HSL, HSR), stereo speaker (HFL, HFR), and earpiece (EAR) or stereo line outputs (AUXL, AUXR). The stereo headphone path has a low-power (LP) mode operating from a 32-kHz sleep clock to enable more than 100 hours of MP3 playback time. Very-high dynamic range of 104 dBA is achieved when using the system clock input and DAC path high-performance (HP) mode. Class-AB headphone drivers provide a 1-Vrms capability output and are ground centered for capless connection to a headphone, thus enabling system size and cost reduction. The earpiece driver is a differential class-AB driver with 2 Vrms capability to a typical 32-Ω load or 1.4 Vrms to a typical 16-Ω load. An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCT PREVIEW Information. Product in design phase of development. Subject to change or discontinuance without notice.
PRODUCT□PREVIEW TWL6040 SWCS052B –AUGUST 2010–REVISED AUGUST 2014 www.ti.com Stereo speaker path has filterless class-D outputs with 1.5-W capability per channel. Output power maximization supply connections to an external boost is supported. Speaker drivers also support hearing aid coil loads. For vibrator and haptic feedback support, the TWL6040 has two PWM channels with independent input signals from DL4 or inter-integrated circuit (I2C). Vibrator drivers are differential H-bridge outputs, enabling fast acceleration and deceleration of vibrator motor. An external driver for a hearing aid coil or a piezo speaker requiring high voltage can be connected to line outputs. The TWL6040 supports three differential microphone inputs (MMIC, HMIC, and SMIC) and a stereo line- input (AFML, AFMR) multiplexed to two parallel ADCs. The PDM output from the ADCs is transmitted to the OMAP4 processor through UL0 and UL1. AFML, AFMR inputs can also be looped to analog outputs (LB0, LB1). Two LDOs provide a voltage of 2.1 V to bias analog microphones (MBIAS and HBIAS). The maximum output current is 2 mA for each analog bias, allowing up to two microphones on one bias. Two LDOs provide a voltage of 1.8 V/1.85 V to bias digital microphones (DBIAS1 and DBIAS2). One bias generator can bias several digital microphones at the same time, with a total maximum output current of 10 mA. The TWL6040 has an integrated negative charge pump (NCP) and two LDOs (HS LDO and LS LDO) for high PSRR. The only external supply needed is 2.1 V, which is available from the 2.1-V DC-DC of the TWL6030 power-management IC (PMIC) in the OMAP4 system. By powering audio from low-noise 2.1-V DC-DC of low power consumption, high dynamic range and high output swing at headset output are achieved. All other supply inputs can be directly connected to battery or system 1.8-V I/O. Two integrated PLLs enable operation from a 12-, 19.2-, 26-, and 38.4-MHz system clock (MCLK) or, in LP playback mode, from a 32-kHz sleep clock (CLK32K). The frequency plan is based on a 48-kS/s audio data rate for all channels, and host processor uses sample-rate converters to interface with different sample rates (for example, 44.1 kHz). In the specific case of low-power audio playback, the TWL6040 supports the 44.1-kS/s and 48-kS/s rates. Transitions between sample rates or input clocks are seamless. Accessory plug and unplug detections are supported (PLUGDET). Some headsets have a manual switch for submitting send/end signal to the terminal through the microphone input pin. This feature is supported by a periodic accessory button press detection to minimize current consumption in sleep mode. Detection cycle properties can be programmed according to system requirements. Table 1-1. Device Information(1) PART NUMBER PACKAGE BODY SIZE (NOM) TWL6040A2 ZQZ (120) 6.00 mm × 6.00 mm TWL6040A3 ZQZ (120) 6.00 mm × 6.00 mm (1) For more information, see Section 3, Mechanical Packaging and Orderable Information.
2 Device Overview Copyright © 2010–2014, Texas Instruments Incorporated
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PRODUCT□PREVIEW SWCS044-001 ADCL MMICP MMICN HMICP HMICN ADCR SMICP SMICN AFMR AFML HSL HSR HFLP HFLN HFRP HFRN EARP EARN AUXLP AUXLN AUXRP AUXRN VIBLP VIBLN PDM to PCM PCM to PWM VIBRP VIBRN PDM interface I2C registers HS LDO LS LDO Negative charge pump GNDHFR VDDHFR GNDHFL VDDHFL GNDHS VSSHS VDDHS VDDEAR VSSEAR GNDVIBL VDDVIBL PDMCLK PDMCLKLB PDMFRAME PDMDN PDMUP HP PLL LP PLL VSSLDO VDDLDO MCLK CLK32K Reference temp sense REF GNDREF SDA SCL Accessory connector detection HMBIAS DMBIAS1 MBIAS DMBIAS2 MMBIAS DBIAS1 DBIAS2 UL0 UL1 DL0 DL1 DL2 DL3 DL4 0:30 dB VDDREGNCP CFLYP NCPOUT –52:6 dB –52:6 dB –30:0 dB –24:6 dB –30:0 dB –18:24 dB AAFL AAFR MicAmpL MicAmpR LineInAmpR LineInAmpL EarDrv HSLDrv HSRDrv HFLDrv HFRDrv VIBLDrv VIBRDrv PGAL PGAR HFDACL HFDACR HSDACR HSDACL HBIAS Osc Uplink Downlink Clock system Power Interface CFLYN GNDNCP VSSPLL VDDPLL VDDUL VSSUL GNDVCM VDDAMBIAS VDDDMBIAS VDDDL VSSDL LB0 LB1 GNDAMIC GNDDMIC VSSLDOIN ACCONN GNDVIBR VDDVIBR GNDLDO VDDV2V1 PBKG GPO1(2,3) VDDVIO PCM to PWM NCPFB 1 1 PLUGDET 0:30 dB REFP REFN TWL6040 www.ti.com SWCS052B –AUGUST 2010–REVISED AUGUST 2014
1.4 Functional Block Diagram
Figure 1-1 shows the system block diagram of the TWL6040 device. Figure 1-1. Simplified Block Diagram Copyright © 2010–2014, Texas Instruments Incorporated Device Overview 3 Submit Documentation Feedback Product Folder Links: TWL6040
PRODUCT□PREVIEW TWL6040 SWCS052B –AUGUST 2010–REVISED AUGUST 2014 www.ti.com For the complete TWL60xx data sheet (SWCS044), contact your TI sales representative.
4 Device Overview Copyright © 2010–2014, Texas Instruments Incorporated
Submit Documentation Feedback Product Folder Links: TWL6040
PRODUCT□PREVIEW TWL6040 www.ti.com SWCS052B –AUGUST 2010–REVISED AUGUST 2014
2 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision A (January 2012) to Revision B Page Copyright © 2010–2014, Texas Instruments Incorporated Revision History 5 Submit Documentation Feedback Product Folder Links: TWL6040
PRODUCT□PREVIEW TWL6040 SWCS052B –AUGUST 2010–REVISED AUGUST 2014 www.ti.com
3 Mechanical Packaging and Orderable Information
3.1 Packaging Information
The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
6 Mechanical Packaging and Orderable Information Copyright © 2010–2014, Texas Instruments Incorporated
Submit Documentation Feedback Product Folder Links: TWL6040
www.ti.com 23-Feb-2023 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead finish/ Ball material (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples TWL6040A2GZQZR OBSOLETE BGA MICROSTAR JUNIOR ZQZ 120 TBD Call TI Call TI TWL6040A2G TWL6040A2ZQZ OBSOLETE BGA MICROSTAR JUNIOR ZQZ 120 TBD Call TI Call TI TWL6040A2 TWL6040A2ZQZR OBSOLETE BGA MICROSTAR JUNIOR ZQZ 120 TBD Call TI Call TI TWL6040A2 TWL6040A3SRSZQZR OBSOLETE BGA MICROSTAR JUNIOR ZQZ 120 TBD Call TI Call TI TWL6040A3 TWL6040A3ZBHR ACTIVE NFBGA ZBH 120 2500 RoHS & Green SNAGCU Level-3-260C-168 HR -40 to 85 6040A3ZBH Samples TWL6040A3ZQZ OBSOLETE BGA MICROSTAR JUNIOR ZQZ 120 TBD Call TI Call TI TWL6040A3 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. Addendum-Page 1
www.ti.com 23-Feb-2023 (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2
PACKAGE MATERIALS INFORMATION www.ti.com 8-Jun-2022 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION www.ti.com 8-Jun-2022 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TWL6040A3ZBHR NFBGA ZBH 120 2500 336.6 336.6 31.8 Pack Materials-Page 2
NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. NanoFree is a trademark of Texas Instruments. PACKAGE OUTLINE 4225681/A 02/2020 www.ti.com NFBGA - 1 mm max height PLASTIC BALL GRID ARRAY ZBH0120A A 0.08 C
0.15 C A B
0.05 C B SYMM SYMM 6.1 5.9 6.1 5.9 BALL A1 CORNER
1 MAX
0.25 0.19 SEATING PLANE C A B C TYP
0.5 TYP
(0.5) TYP (0.5) TYP5 TYP BALL TYP 2 3 4 5 6 7 8 9 10 11 D E F G H J K L 120X Ø0.35 0.25
NOTES: (continued) 3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. Refer to Texas Instruments Literature number SNVA009 (www.ti.com/lit/snva009). EXAMPLE BOARD LAYOUT 4225681/A 02/2020 www.ti.com NFBGA - 1 mm max heightZBH0120A PLASTIC BALL GRID ARRAY SYMM SYMM LAND PATTERN EXAMPLE SCALE: 10X (0.5) TYP (0.5) TYP A 1 SOLDER MASK DETAILS NOT TO SCALE
0.05 MAX
0.05 MIN
(PREFERRED) SOLDER MASK DEFINED (Ø 0.25) SOLDER MASK OPENING (Ø 0.25) METAL B C D E F G H J K L 2 3 4 5 6 7 8 9 10 11 120X (Ø0.25)
NOTES: (continued) 4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. EXAMPLE STENCIL DESIGN 4225681/A 02/2020 www.ti.com NFBGA - 1 mm max heightZBH0120A PLASTIC BALL GRID ARRAY SOLDER PASTE EXAMPLE BASED ON 0.100 mm THICK STENCIL SCALE: 10X SYMM SYMM (0.5) TYP (0.5) TYP A 1 B C D E F G H J K L 2 3 4 5 6 7 8 9 10 11 120X ( 0.25) METAL TYP (R0.05)
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