TWL6032_16 TI1 | Alldatasheet
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Sample & Buy T echnical Documents Tools & Software Support & Community TWL6032 SWCS076B – DECEMBER 2011– REVISED AUGUST 2014 TWL6032FullyIntegratedPowerManagementwithPowerPathandBatteryCharger
1 Device Overview
1.1 Features
- Five Highly Efficient Buck Converters • Control: – One 3 MHz, 0.6 to 2.1 V at 5.0 A, DVS-Capable – Configurable Power-Up and Power-Down Sequences (OTP Memory)– One 6 MHz, 0.6 to 2.1 V at 2.5 A, DVS-Capable – Configurable Sequences Between SLEEP and– Three 6 MHz, 0.6 to 2.1 V at 1.1 A, One Is DVS- ACTIVE States (OTP Memory)Capable – Three Digital Output Signals that can be– Extended Mode for Higher Output Voltages Included in the Startup Sequence to Control• 11 General-Purpose Low-Dropout Voltage External DevicesRegulators (LDOs) – Two Inter-Integrated Circuit (I2C) Interfaces– Six 1.0 to 3.3 V at 0.2 A With Battery or – All Resources Configurable by I2CPreregulated Supply:
- System Voltage Regulator and Battery Charger• One Can be Used as Vibrator Driver With Power Path From USB:• One 1.0 to 3.3 V at 50 mA With Battery or – Input Current Limit to Comply With USBPreregulated Supply Standard• One Low-Noise 1.0 to 3.3 V at 50 mA With – 3-MHz Switched-Mode Regulator WithBattery or Preregulated Supply Integrated Power FET for up to 2.0-A Current• One 3.3 V at 100 mA USB LDO – Dedicated Control Loop for Battery Current and• Two LDOs for TWL6032 Internal Use Voltage• USB OTG Module: – External Low-Ohmic FET for Power Path and– ID Detection, Accessory Charger Adapter (ACA) Battery ChargingSupport – Boost Mode Operation for USB OTG– Accessory Detection Protocol (ADP) Support – Supplement Mode to Deliver Current From• Backup Battery Charger Battery During Power Path Operation• 12-Bit Sigma-Delta Analog-to-Digital Converter – Charger for Single-Cell Li-Ion and Li-Polymer(ADC) With 19 Input Channels: Battery Packs– Seven External Input Channels – Safety Timer and Reset Control• 13-Bit Coulomb Counter With Four Programmable – Thermal ProtectionIntegration Periods – Input/Output Overvoltage Protection• Low-Power Consumption: – Charging Indicator LED Driver– 8 µA in BACKUP State – Compliant With:– 20 µA in WAIT-ON State • USB 2.0– 110 µA in SLEEP State, With Two DC-DC • OTG and EH 2.0Converters Active
- USB Battery Charging 1.2• Real-Time Clock (RTC) With Timer and Alarm
- YD/T 1591-2006Wake-Up:
- Japanese Battery Charging Guidelines– Three Buffered 32-kHz Outputs (JEITA)• SIM and SD/MMC Card Detections
- Battery Voltage Range From 2.5 to 5.5 V• Two Digital PWM Outputs
- Package 5.21-mm × 5.36-mm 155-Pin WCSP• Thermal Monitoring: – High-Temperature Warning – Thermal Shutdown An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.
SWCS076B – DECEMBER 2011– REVISED AUGUST 2014 www.ti.com
1.2 Applications
- Mobile Phones and Smart Phones • Portable Media Players
- Tablets • Portable Navigation Systems
- Gaming Handsets • Handheld Devices
1.3 Description
The TWL6032 device is an integrated power-management integrated circuit (PMIC) for applications powered by a rechargeable battery. The device provides five configurable step-down converters with a current capability of up to 5.0 A for memory, processor core, I/O, auxiliary, preregulation for LDOs, and so forth. The device also contains nine LDO regulators for external use that can be supplied from a battery or a preregulated supply. The power-up and power-down controller is configurable and can support any power-up or power-down sequence (programmed in OTP memory). The RTC provides three 32-kHz clock outputs: seconds, minutes, hours, day, month, and year information; as well as alarm wakeup and timer. The TWL6032 device supports 32-kHz clock generation based on a crystal oscillator. The device integrates a switched-mode system supply regulator from a USB connector. The switched- mode regulator includes power paths from the USB and battery with supplemental mode for immediate startup, even with an empty battery. The battery switch uses an external low-ohmic PMOS transistor allowing minimal serial resistance during fast charging and when operating from battery. The device can also be used without the external PMOS transistor; in this case, the battery is always tied to the system supply and the switched-mode regulator is used for battery charging. The TWL6032 device is available in a 155-pin WCSP package, 5.21 mm × 5.36 mm with a 0.4-mm ball pitch. Figure 1-1 shows the TWL6032 device block diagram. Table 1-1. Device Information(1) PART NUMBER PACKAGE BODY SIZE TWL6032A1Bx YFF (155) 5.21 mm × 5.36 mm TWL6032A2Bx YFF (155) 5.21 mm × 5.36 mm (1) For more information, see Section 3, Mechanical Packaging and Orderable Information.
2 Device Overview Copyright © 2011–2014, Texas Instruments Incorporated
Submit Documentation Feedback Product Folder Links: TWL6032
LDOUSB LDO7LDO6LDO5LDO4LDO3LDO2LDO1LDOLN Grounds Reference and bias Detectors USB ACA VSYS C1 C2 C18 C23 VSYS C24 VSYS VSYS I/O voltage MSECURE NRESWARM CTLI2C_SCL CTLI2C_SDA DVSI2C_SCL DVSI2C_SDA NRESPWRON INT BATREMOVAL REGEN1 REGEN2 SYSEN PWM1 PWM2 OSC32KIN OSC32KOUT OSC32KCAP CLK32KAO CLK32KG CLK32KAUDIO GPADC_IN0 GPADC_IN1 GPADC_IN2 GPADC_IN3 GPADC_IN4 GPADC_IN5 GPADC_IN6 GPADC_VREF GPADC_START MMC SIM ID IREF VBG REFGND PBKG GND_ANA GND_DIG_VIO GND_DIG_VRTC LDOLN_IN LDOLN LDO1 LDO1_IN LDO2_IN LDO2 LDO3_IN LDO3 LDO4_IN LDO4 LDO5_IN LDO5 LDO6_IN LDO6 LDO7_IN LDO7 LDOUSB Test and program C44 System voltage monitoring TWL6032 www.ti.com SWCS076B – DECEMBER 2011– REVISED AUGUST 2014
1.4 Functional Block Diagram
Figure 1-1. TWL6032 Device Block Diagram For the complete TWL6032 data sheet (SWCS057), contact your TI sales representative. Copyright © 2011–2014, Texas Instruments Incorporated Device Overview 3 Submit Documentation Feedback Product Folder Links: TWL6032
SWCS076B – DECEMBER 2011– REVISED AUGUST 2014 www.ti.com
2 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision A (September 2012) to Revision B Page
4 Revision History Copyright © 2011–2014, Texas Instruments Incorporated
Submit Documentation Feedback Product Folder Links: TWL6032
www.ti.com SWCS076B – DECEMBER 2011– REVISED AUGUST 2014
3 Mechanical Packaging and Orderable Information
3.1 Packaging Information
The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Copyright © 2011–2014, Texas Instruments Incorporated Mechanical Packaging and Orderable Information 5 Submit Documentation Feedback Product Folder Links: TWL6032
www.ti.com 23-Feb-2016 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples TWL6032A1B4YFFR ACTIVE DSBGA YFF 155 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 TWL6032 A1B4 TWL6032A1B4YFFT ACTIVE DSBGA YFF 155 250 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 TWL6032 A1B4 TWL6032A1B6YFFR ACTIVE DSBGA YFF 155 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 TWL6032 A1B6 TWL6032A2B0YFFR ACTIVE DSBGA YFF 155 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 TWL6032 A2B0 TWL6032A2B0YFFT ACTIVE DSBGA YFF 155 250 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 TWL6032 A2B0 TWL6032A2B4YFFR ACTIVE DSBGA YFF 155 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 TWL6032 A2B4 TWL6032A2B4YFFT ACTIVE DSBGA YFF 155 250 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 TWL6032 A2B4 TWL6032A2B6YFFR ACTIVE DSBGA YFF 155 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 TWL6032 A2B6 TWL6032A2B7YFFR ACTIVE DSBGA YFF 155 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 TWL6032 A2B7 TWL6032A2B7YFFT ACTIVE DSBGA YFF 155 250 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 TWL6032 A2B7 TWL6032A2B8YFFR ACTIVE DSBGA YFF 155 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 TWL6032 A2B8 TWL6032A2B8YFFT ACTIVE DSBGA YFF 155 250 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 TWL6032 A2B8 TWL6032A2BEYFFT ACTIVE DSBGA YFF 155 250 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 TWL6032 A2BE (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
www.ti.com 23-Feb-2016 Addendum-Page 2 (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 5-Dec-2015 Pack Materials-Page 1
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TWL6032A1B4YFFR DSBGA YFF 155 3000 367.0 367.0 35.0 TWL6032A1B4YFFT DSBGA YFF 155 250 182.0 182.0 20.0 TWL6032A1B6YFFR DSBGA YFF 155 3000 367.0 367.0 35.0 TWL6032A2B0YFFR DSBGA YFF 155 3000 367.0 367.0 35.0 TWL6032A2B0YFFT DSBGA YFF 155 250 182.0 182.0 20.0 TWL6032A2B4YFFR DSBGA YFF 155 3000 367.0 367.0 35.0 TWL6032A2B4YFFT DSBGA YFF 155 250 182.0 182.0 20.0 TWL6032A2B6YFFR DSBGA YFF 155 3000 367.0 367.0 35.0 TWL6032A2B7YFFR DSBGA YFF 155 3000 367.0 367.0 35.0 TWL6032A2B7YFFT DSBGA YFF 155 250 182.0 182.0 20.0 TWL6032A2B8YFFR DSBGA YFF 155 3000 367.0 367.0 35.0 TWL6032A2B8YFFT DSBGA YFF 155 250 182.0 182.0 20.0 TWL6032A2BEYFFT DSBGA YFF 155 250 182.0 182.0 20.0 PACKAGE MATERIALS INFORMATION www.ti.com 5-Dec-2015 Pack Materials-Page 2
D: Max = E: Max = 5.394 mm, Min = 5.244 mm, Min = 5.334 mm 5.184 mm
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