TWL6030_13 TI1 | Alldatasheet
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www.ti.com SWCS051B –AUGUST 2010–REVISED DECEMBER 2012 FullyIntegratedPowerManagementwithSwitchModeCharger 1FEATURES • Control – Configurablepower-up and power-down• Seven highlyefficient6-MHz buck converters sequences (OTP memory)– Two 0.6to2.1V @ 1.5A (up to2.0A with – Three outputsignalsthatcan be includedsome limitations) inthestart-upsequence– Five0.6to2.1V @ 0.8A (up to1.0A with – Two I2C ™ interfacessome limitations) – Allresourcesconfigurableby I2C• 11 General-purposeLDOs
- Clock management– Six1.0to3.3V @ 0.2A withbatteryor preregulatedsupply (One can be used as a 32-kHz output vibratordriver.) • Batterycharger1.5A – One 1.0to3.3V @ 50 mA withbatteryor – Charger forsingle-cellLi-Ionand preregulatedsupply Li-Polymerbatterypacks – One low noise1.0to3.3V @ 50 mA with – Switched mode chargerwithintegrated batteryor preregulatedsupply power FET forup to1.5-Acurrent – 3.3V @ 35 mA USB LDO – High-accuracyvoltageand current – One LDO forTWL6030 internaluse regulation – One LDO forinternaland externaluse – Safetytimerand resetcontrol
- USB OTG module – Thermal regulationprotection
- Backup batterycharger – Input/outputovervoltageprotection
- 10-bitADC with17 inputchannels – Charging indicatorLED driver
- 13-bitCoulomb counterwithfour – Boost mode operationforUSB OTG programmable integrationperiods – Compliant with:
- Low power consumption – USB 2.0 – 5 µA inbackup mode – OTG and EH 2.0 – 20 µA inwait-onmode – YD/T 1591-2006 – 110 µA indeep sleep,withtwo DCDCs – USB batterycharging1.2 active – Japanese batterychargingrequirements
- RTC withalarm wake-up mechanism (JEITA)
- SIM and MMC card detections • Package 7 mm x 7 mm 187-pinnFBGA
- Two digitalPWM outputs APPLICATIONS• Thermal monitoring – High-temperaturewarning • Mobilephones and smart phones – Thermal shutdown • Gaming handsets
- Portablemedia players
- Portablenavigationsystems
- Handheld devices
- Tablets Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsofTexas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 2010–2012,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.
SWCS051B –AUGUST 2010–REVISED DECEMBER 2012 www.ti.com
DESCRIPTION
The TWL6030 deviceisan integratedpower-management integratedcircuit(IC)forapplicationspowered by a rechargeablebattery.The deviceprovidesseven configurablestep-downconverterswithup to2.0-Acapability formemory, processorcore,I/O,auxiliary,preregulationforLDOs, etc.The devicealso contains11 LDO regulatorsthatcan be suppliedfrom a batteryor a preregulatedsupply.Power-up/power-downcontrolleris configurableand can supportany power-up/power-downsequences (programmed in OTP memory). The real-timeclock(RTC) providesa 32-kHz outputbuffer,second/minute/hour/day/month/yearinformation,and alarm wake up. The TWL6030 supports32-kHz clockgenerationbased on a crystaloscillator.The device integratesa switched-modechargerallowingfasterbatterycharge,higherefficiency,and lesspower dissipation. The TWL6030 devicegeneratespower suppliesforOMAP ™ 4 processorsand operatestogetherwiththe TWL6040 device,which includesallaudio and relateddetectionfeatures.For audio IC parameters,see the TWL6040 datasheet.The TWL6030 isavailableinan nFBGA package,7.0mm x 7.0mm, witha 0.4-mm ball pitch. Figure1 shows theTWL6030 blockdiagram.
2 Copyright© 2010–2012,Texas InstrumentsIncorporated
3 MHz
Control, data, and test logic Events bus Card detect and PWM Xtal 32K RC 32K RC USB SRP I2C control I2C SmartReflex Events detect SR bus SRI2C_SDA SRI2C_SCL ID CTLI2C_SDA CTLI2C_SCL SIM MMC BATREMOVAL PWM1 BOOT0 BOOT1 BOOT2 BOOT3 RESPWRON NRESWARM PWRON RPWRON PREQ1 PREQ2A PREQ3 INT SYSEN REGEN1 REGEN2 MSECURE CLK32KG CLK32KAO CLK32KAUDIO OSC32KOUT OSC32KIN VAC CHRG_CSIN CHRG_CSOUT CHRG_EXTCHRG_ENZ CHRG_EXTCHRG_STATZ USB charger and VBUS OTG CHRG_PMID CHRG_SW VBUS CHRG_AUXPWR CHRG_GND VANA VANA_IN VRTC_IN VRTC V1V29_SW V1V29_IN V1V29_FDBK V1V29_GND V2V1_SW V1V2_IN V2V1_FDBK V2V1_GND V1V8_SW V1V8_IN V1V8_FDBK V1V8_GND VMEM_SW VMEM_IN VMEM_FDBK VMEM_GND VCORE3_SW VCORE3_IN VCORE3_FDBK VCORE3_GND VCORE2_SW VCORE2_IN VCORE2_FDBK VCORE2_GND VCORE1_SW VCORE1_IN VCORE1_FDBK VCORE1_GND REFS TESTEN TESTV PWM2 10-bit ADC GPADC_IN0 GPADC_IN1 GPADC_VREF1 GPADC_IN2 GPADC_IN3 GPADC_IN4 GPADC_VREF4 GPADC_IN5 GPADC_IN6 GPADC_START Digital filter 13-bit ADC /c83/c68GGAUGE_RESP GGAUGE_RESN OCP bus PREQ2B PREQ2C OSC32KCAP GND_DIG_VRTC VBAT VDD_B4VDD_B2VDD_B1 GND_ANA_B7GND_ANA_B6GND_ANA_B5GND_ANA_B4GND_ANA_B3GND_ANA_B2GND_ANA_B1 VAUX3_IN VAUX3 VCXIO_IN VCXIO VDAC_IN VDAC CHRG_PMID VDD_B3 VUSB CHRG_LED_IN CHRG_LED_TEST CHRG_VREFCHRG_DET_N REFGNDIREFVBGVAUX2VAUX2_INVAUX1VAUX1_INVUSIMVUSIM_IN1VMMCVMMC_IN1VPPVPP_INVIOGND_DIG_VIO Control Ols VPP VMMC VUSIM VAUX1 VAUX2 VAUX3VCXIOVDACVUSB MUXScalers Auto calib TWL6030 www.ti.com SWCS051B –AUGUST 2010–REVISED DECEMBER 2012 Figure1. TWL6030 Block Diagram Copyright© 2010–2012,Texas InstrumentsIncorporated 3
SWCS051B –AUGUST 2010–REVISED DECEMBER 2012 www.ti.com space For the complete TWL6030 data sheet,contactyour TI salesrepresentative.The document isinternally availablefordownload on ESP under the corresponding TWL6030 product foldersand can be shared withcustomers.
4 Copyright© 2010–2012,Texas InstrumentsIncorporated
www.ti.com 15-Jun-2013 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples TWL6030B107CMR ACTIVE FCBGA CMR 187 260 Green (RoHS & no Sb/Br) Call TI Level-3-260C-168 HR -40 to 85 6030B107 TWL6030B107CMRR ACTIVE FCBGA CMR 187 2500 Green (RoHS & no Sb/Br) Call TI Level-3-260C-168 HR -40 to 85 6030B107 TWL6030B1A0CMR ACTIVE FCBGA CMR 187 260 TBD Call TI Call TI 6030B1A0 TWL6030B1A0CMRR ACTIVE FCBGA CMR 187 2500 Green (RoHS & no Sb/Br) Call TI Level-3-260C-168 HR 6030B1A0 TWL6030B1A4CMR ACTIVE FCBGA CMR 187 260 Green (RoHS & no Sb/Br) Call TI Level-3-260C-168 HR -40 to 85 6030B1A4 TWL6030B1A4CMRR ACTIVE FCBGA CMR 187 2500 Green (RoHS & no Sb/Br) Call TI Level-3-260C-168 HR -40 to 85 6030B1A4 TWL6030B1AACMR ACTIVE FCBGA CMR 187 260 TBD Call TI Call TI 6030B1AA TWL6030B1AACMRR ACTIVE FCBGA CMR 187 2500 TBD Call TI Call TI 6030B1AA (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
www.ti.com 15-Jun-2013 Addendum-Page 2 (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 19-Jun-2013 Pack Materials-Page 1
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TWL6030B107CMRR FCBGA CMR 187 2500 336.6 336.6 31.8 TWL6030B1A0CMRR FCBGA CMR 187 2500 336.6 336.6 31.8 TWL6030B1A4CMRR FCBGA CMR 187 2500 336.6 336.6 31.8 TWL6030B1AACMRR FCBGA CMR 187 2500 336.6 336.6 31.8 PACKAGE MATERIALS INFORMATION www.ti.com 19-Jun-2013 Pack Materials-Page 2
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