TW0341A TAI-SAW | Alldatasheet
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TAI-SAW TECHNOLOGY CO., LTD. 2 TST DCC Release document TAI-SAW TECHNOLOGY CO., LTD. SMD 7.0x5.0 125MHz Crystal Oscillator MODEL NO.: TW0341A REV. NO.: 1 Revise:
1 N/A Initial release 03/02/12’ N/A Naco Kuo
TAI-SAW TECHNOLOGY CO., LTD. 3 TST DCC Release document TAI-SAW TECHNOLOGY CO., LTD. No. 3, Industrial 2nd Rd., Ping-Chen Industrial District, Taoyuan, 324, Taiwan, R.O.C. TEL: 886-3-4690038 FAX: 886-3-4697532 E-mail: tstsales@mail.taisaw.com W e b : www.taisaw.com SMD 7.0x5.0 125MHz Crystal Oscillator MODEL NO.: TW0341A REV. NO: 1 Features: z Surface Mount Seam Weld Package z Excellent Reliability Performance z Good Frequency Perturbation and Stability over temperature Application: z 3.3 V Supply Voltage Operati on / Complementary PECL Output z Option-able stand-by function for output (Tri-state output). z 3 Overtone Crystal application. Electrical Characteristics: TW0341A Specifications Nominal Frequency, Fo 125.000000 MHz Storage Temperature Range -55°C to +125°C Operating Temperature Range 0°C to +70°C Power Supply Voltage, Vcc 3.3 V +/- 10% Load 50ohm (LVPECL Output) “0” Level “1” Level
1.68 V max
2.275 V min
Power Supply Current, Icc 90 mA max Frequency Accuracy1 +/-20 ppm max Duty Cycle 45% ~ 55% Start - Up Time 1.0ps max Rise Time ( 10% -> 90% of final RF level in Vp-p ) Fall Time ( 90% -> 10% of final RF level in Vp-p ) 5 nsec max. 5 nsec max. Enable/Disable Function PIN 1: High or Open, PIN 3:Enable PIN 1: Low, PIN 3:Disable #Note 1: Frequency accuracy includes 25C tolerance, operating temperature range -20 to 70 deg C, aging and voltage or load change RoHS Compliant Lead free Lead-free soldering
TAI-SAW TECHNOLOGY CO., LTD. 4 TST DCC Release document Mechanical Dimensions: (Unit: mm) Marking: Line 1 : Frequency Line 2 : T WDX (TST logo + Product Code + Data Code + TST Internal Code) Product Code Table 2008 2009 2010 2011 Year 2012 2013 2014 2015 Product code w W w W Date Code Table 125.000 T WDX WK01 WK02 WK03 WK04 WK05 WK06 WK07 WK08 WK09 WK10 WK11 WK12 WK13 ABCDEFGH I JKLM WK14 WK15 WK16 WK17 WK18 WK19 WK20 WK21 WK22 WK23 WK24 WK25 WK26 NOPQRSTUVWXYZ WK27 WK28 WK29 WK30 WK31 WK32 WK33 WK34 WK35 WK36 WK37 WK38 WK39 abcde f gh i j k lm WK40 WK41 WK42 WK43 WK44 WK45 WK46 WK47 WK48 WK49 WK50 WK51 WK52 nopqrs t uvwxyz
TAI-SAW TECHNOLOGY CO., LTD. 5 TST DCC Release document Packing: Reel Dimension (Unit: mm) Tape Dimension (Unit: mm) [NOTE]: 1. Unless otherwise specified tolerance on dimension +/-0.1 mm. 2. Material: conductive po lystyrene with color black 3. 10 pitch cumulative tolerance +/-0.2 mm. 4. Packing Direction: dot or the logo of marking should be close to the hole of tape. PACKING DIRECTION:
TAI-SAW TECHNOLOGY CO., LTD. 6 TST DCC Release document Packing Quantity/Packing: 1K pcs maximum per reel Reflow Profile: Note: 1.Max peak temperature: 260+/-5 deg C; Time: 10+/-2 sec 2. Temperature: 217+/-5 deg C; Time: 90~100 sec
TAI-SAW TECHNOLOGY CO., LTD. 7 TST DCC Release document Reliability Specifications Reference standard resistance to Temp./ Duration : 260°C /10sec ×2 times EIAJED-4701 Soldering heat Total time : 4min.(IR-reflow) (IR reflow) -300(301)M(II) Vibration Total peak amplitude : 1.5mm MIL-STD 202F Vibration frequency : 10 to 55 Hz method 201A Sweep period : 1.0 minute Vibration directions : 3 mutually perpendicular Duration : 2 hr / direc. Mechanical directions : 3 impacts per axis MIL-STD 202F Shock Acceleration : 3000g's, +20/-0 % method 213C Duration : 0.3 ms (total 18 shocks) Waveform : Half-sine Solderability Solder Temperature:265±5°C MIL-STD 883G Duration time: 5±0.5 seconds. method 2003 Thermal Shock Heat cycle conditions MIL-STD 883G -55 ℃ (30min) ←→ 125 ℃ (30min) method 1010.7 * cycle time : 10 times Humidity test Temperature : 70 ± 2 °C MIL-STD 202F Relative humidity : 90~95% method 103B Duration : 96 hours Dry heat Temperature : 125 ± 2 °C MIL-STD 883G ( Aging test ) Duration : 168 hours method 1008.2 condition C PCT test Pressure: 2.06kg/cm 2 (2.03*105 pa) EIAJED-4701-3 Temperature : 121 ± 2 °C B-123A Relative humidity : 100% Duration : 24 hours Environmental characteristics Mechanical characteristics Test name Test process / method