TVSA02V05C004 COOPER | Alldatasheet
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Technical content
Features
Silicon based chip Low capacitance to meet the needs for high speed single transient voltage protection Provides ESD protection with fast response time (<1ns) allowing equipment to pass IEC 61000-4-2 level 4 test Low profile designs for board space savings Low leakage current reduces power consumption Low clamping voltage Solid-state silicon-avalanche technology Lead free, halogen free and RoHS compliant for global applications Pb Specifications Part Stand-Off Breakdown Clamping Voltage Capacitance ESD Leakage Current Number Size Voltage Voltage At I peak = 1A pF Air/Contact (kV) (typical) TVSA02V05C004 0201 5 10 17 4 15/8 < 10nA TVSA04V05C006 0402 5 10 17 6 15/8 < 10nA HALOGEN HFFREE Stand-off Voltage - Maximum DC operating voltage the varistor can maintain and not exceed 1 μA leakage current. Breakdown Voltage - Measured at any I/O pin to ground at 1mA DC current. Clamping Voltage - Maximum peak voltage across the varistor with 8/20 μs waveform and 1A pulse current. Capacitance - Device capacitance measured with zero volt bias at 1MHz. ESD Air/Contact - Voltages tested to IEC 61000-4-2.
© 2009 Cooper Bussmann St. Louis, MO 63178 www.cooperbussmann.com
0510 BU-SB10348 Page 2 of 2 Data Sheet 4072
The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. Al l other copies of this document are by definition uncontrolled. This bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with desig n applications. Cooper Bussmann reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves t he right to change or update, without notice, any technical information con- tained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications. Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or system s without the express written approval of an officer of the Company. Life sup- port systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instr uctions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Time (seconds) Temperature (°C) Soldering Recommendations Compatible with lead and lead-free solder reflow processes Peak reflow temperatures and durations: - IR Reflow = 260°C max for 30 sec. max. - Wave Solder = 260°C max. for 10 sec. max. Recommended IR Reflow Profile: Environmental Specifications Characteristic Value Bias Humidity: +40°C, 90% RH for 1000 hours Thermal Shock: -40°C to +85°C, 30 minute cycle, 5 cycles Operating Temperature Range: -40°C to +85°C Storage Temperature Range: -40°C to +85°C Dimensions - mm W H L C c b b d a Recommended Pad Layout - mm (in) Size L W H C Size a b c d Tape Packaging Specifications - mm