TVS5800 TI | Alldatasheet

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TVS5800 58V Flat-Clamp Surge Protection Device

1 Features

  • IEC 61000-4-5 Surge Protection: – 25A (8/20µs) – Clamping voltage: 70.9V at 20A (8/20µs)
  • Low leakage current: – 6nA typical at 27°C – 50nA typical at 85°C
  • Low capacitance: 150pF
  • Integrated IEC 61000-4-2 ESD protection

2 Applications

  • Power over Ethernet (PoE)
  • PLC I/O Modules
  • Appliances
  • Industrial Sensors
  • Power lines

3 Description

The TVS5800 robustly shunts up to 25A of IEC 61000-4-5 fault current to protect systems from high power transients or lightning strikes. The TVS5800 uses a unique feedback mechanism to maintain precise flat clamping during a fault, supporting system exposure below 76V. The tight voltage regulation allows designers to confidently select system components with a lower voltage tolerance, lowering system costs and complexity without sacrificing robustness. In addition, the TVS5800 is available in a 1.6mm x 1.6mm footprint which is designed for space constrained applications. The extremely low device leakage and capacitance allows a minimal effect on the protected line. The TVS5800 is part of TI's Flat-Clamp family of surge devices. For more information on the other devices in the family, see the Device Comparison Table

Package Information

PART NUMBER PACKAGE (1) PACKAGE SIZE (2) TVS5800 VEB (DFN1616, 6) 1.6mm × 1.6mm (1) For more information, see the orderable addendum at the end of the data sheet. (2) The package size (length x width) is a nominal value and includes pins, where applicable. Voltage Time ( Traditional TVS TI Flat-Clamp 2010 30 Voltage Clamp Response to 8/20µs Surge Event TVS5800 SLVSII6 – JANUARY 2026 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.

11.2 Receiving Notification of Documentation Updates.. 10

13 Mechanical, Packaging, and Orderable

SLVSII6 – JANUARY 2026 www.ti.com

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4 Device Comparison Table

Device Vrwm (V) Vclamp at Ipp (V) Ipp (8/20µs) (A) Vrwm leakage (nA) Package Options Polarity TVS0500 5 9.2 43 0.07 SON Unidirectional TVS1400 14 18.4 43 2 SON Unidirectional TVS1800 18 22.8 40 0.5 SON Unidirectional TVS2200 22 27.7 40 3.2 SON Unidirectional TVS2700 27 32.5 40 1.7 SON Unidirectional TVS3300 33 38 35 19 WCSP, SON Unidirectional TVS4000 (1) 40 50.4 24 4.45 DFN1616 Unidirectional TVS5200 (1) 52 58.8 20 18.3 DFN1616 Unidirectional TVS5800 58 70.9 25 6 DFN1616 Unidirectional (1) Preview information (not Production Data)

5 Pin Configuration and Functions

Figure 5-1. VEB Package, 6-Pin DFN1616 (Bottom View) Table 5-1. Pin Functions PIN TYPE (1) DESCRIPTION NAME NO. IN 4, 5, 6 I ESD and surge protected channel GND 1, 2, 3 GND Ground (1) I = input, GND = ground www.ti.com TVS5800 SLVSII6 – JANUARY 2026 Copyright © 2026 Texas Instruments Incorporated Submit Document Feedback 3 Product Folder Links: TVS5800

6 Specifications

6.1 Absolute Maximum Ratings

TA = 27°C (unless otherwise noted)(1) MIN MAX UNIT Maximum Surge IEC 61000-4-5 Current (8/20 µs) 25 A IEC 61000-4-5 Power (8/20 µs) 1880 W EFT IEC 61000-4-4 EFT Protection 80 A TA Ambient Operating Temperature -40 125 °C Tstg Storage Temperature -65 150 °C (1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings - JEDEC

V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/ JEDEC JS-001, all pins(1) ±2000 V Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±500 (1) JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.

6.3 ESD Ratings - IEC

V(ESD) Electrostatic discharge IEC 61000-4-2 contact discharge ±15 kV IEC 61000-4-2 air-gap discharge ±15

6.4 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted) PARAMETER MIN NOM MAX UNIT VRWM Reverse Stand-off Voltage 58 V

6.5 Thermal Information

THERMAL METRIC(1) TVS5800 UNITVEB (DFN1616)

6 PINS

RθJA Junction-to-ambient thermal resistance 132.1 °C/W RθJC(top) Junction-to-case (top) thermal resistance 61.5 °C/W RθJB Junction-to-board thermal resistance 34.5 °C/W ΨJT Junction-to-top characterization parameter 1.04 °C/W ΨJB Junction-to-board characterization parameter 34.4 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note. TVS5800 SLVSII6 – JANUARY 2026 www.ti.com

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6.6 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VRWM Reverse Stand-off Voltage -0.5 58 V ILEAK Leakage Current Measured at VIN = VRWM TA = 27°C 6 300 nA Measured at VIN = VRWM TA = 85°C 50 1200 nA Measured at VIN = VRWM TA = 105°C 140 2400 nA VF Forward Voltage IIN = 1mA from GND to IO 0.25 0.5 0.65 V VBR Break-down Voltage IIN = 1mA from IO to GND 65.8 69.8 V VCLAMP Clamp Voltage 10A IEC 61000-4-5 Surge (8/20µs) from IO to GND, VIN = 0V before surge, 27°C 66.5 70.7 74.7 V 20A IEC 61000-4-5 Surge (8/20µs) from IO to GND, VIN = 0V before surge, 27°C 66.7 70.9 75 V RDYN 8/20 µs surge dynamic resistance Calculated from VCLAMP at .5*Ipp and Ipp surge current levels, 27°C 40 mΩ CIN Input pin capacitance VIN = VRWM, f = 1MHz, 30mVpp, IO to GND 150 pF www.ti.com TVS5800 SLVSII6 – JANUARY 2026 Copyright © 2026 Texas Instruments Incorporated Submit Document Feedback 5 Product Folder Links: TVS5800

6.7 Typical Characteristics

T i m e (  s ) Voltage (V) / Current (A) - 6 - 2 2 6 1 0 1 4 1 8 2 2 1 6 2 4 3 2 4 0 4 8 5 6 6 4 7 2 8 0 C u r r e n t V o l t a g e Figure 6-1. 8/20µs Surge Response at 20A T e m p e r a t u r e (  C ) Voltage (V) - 4 0 - 2 5 - 1 0 5 2 0 3 5 5 0 6 5 8 0 9 5 1 1 0 1 2 5 6 9 6 9 . 2 6 9 . 4 6 9 . 6 6 9 . 8 7 0 7 0 . 2 7 0 . 4 7 0 . 6 Figure 6-2. Breakdown Voltage (1mA) vs Temperature T e m p e r a t u r e (  C ) Forward Voltage (V) - 4 0 - 2 5 - 1 0 5 2 0 3 5 5 0 6 5 8 0 9 5 1 1 0 1 2 5 0 . 3 5 0 . 4 0 . 4 5 0 . 5 0 . 5 5 0 . 6 0 . 6 5 Figure 6-3. Forward Voltage vs Temperature T e m p e r a t u r e (  C ) Leakage Current (nA) - 4 0 - 2 5 - 1 0 5 2 0 3 5 5 0 6 5 8 0 9 5 1 1 0 1 2 5 5 0 1 0 0 1 5 0 2 0 0 2 5 0 3 0 0 3 5 0 4 0 0 4 5 0 Figure 6-4. Leakage Current vs Temperature at 58V B i a s V o l t a g e ( V ) Capacitance (pF) 0 5 1 0 1 5 2 0 2 5 3 0 3 5 4 0 4 5 5 0 5 5 6 0 1 0 0 1 5 0 2 0 0 2 5 0 3 0 0 3 5 0 4 0 0 4 5 0 5 0 0 5 5 0 6 0 0 6 5 0 7 0 0 7 5 0 - 4 0  C 2 7  C 1 2 5  C Figure 6-5. Capacitance vs Bias Voltage Across Temperature T e m p e r a t u r e (  C ) IPP(A) - 4 0 - 2 5 - 1 0 5 2 0 3 5 5 0 6 5 8 0 9 5 1 1 0 1 2 5 3 2 3 4 3 6 3 8 4 0 4 2 4 4 Figure 6-6. Max Surge Current (8/20µs) vs Temperature TVS5800 SLVSII6 – JANUARY 2026 www.ti.com

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7 Detailed Description

7.1 Overview

The TVS5800 is a precision clamp with a low, flat clamping voltage during transient overvoltage events like surge and protecting the system with zero voltage overshoot. For a detailed overview of the Flat-Clamp family of devices, please reference TI's Flat-Clamp surge protection technology for efficient system protection white paper. This document explains in detail the functional operation of the devices and how the TVS5800 impacts and improves system design.

7.2 Functional Block Diagram

7.3 Feature Description

The TVS5800 is a precision clamp that handles 25A of IEC 61000-4-5 8/20µs surge pulse. The flat clamping feature helps keep the clamping voltage very low to keep the downstream circuits from being stressed. The flat clamping feature can also help end-equipment designers save cost by opening up the possibility to use lower- cost, lower voltage tolerant downstream ICs. The TVS5800 has minimal leakage under the standoff voltage of 58V, making TVS5800 an desirable candidate for applications where low leakage and power dissipation is a necessity. IEC 61000-4-2 rating make TVS5800 a robust protection design for ESD events. Wide ambient temperature range of -40°C to +125°C, a good candidate for most applications. Compact package enables the TVS5800 to be used in small devices and save board area.

7.4 Device Functional Modes

7.4.1 Protection Specifications

The TVS5800 is specified according to the IEC 61000-4-5 standard. The IEC 61000-4-5 standards requires protection against a pulse with a rise time of 8µs and a half length of 20µs. The TVS5800 has been tested according to IEC 61000-4-5 to pass a ±1kV surge test through a 42 Ω coupling resistor and a 0.5µF capacitor. This test is a common test requirement for industrial signal I/O lines and the TVS5800 serves as an desired protection design for applications with that requirement. The TVS5800 also integrates IEC 61000-4-2 level 4 ESD Protection. These combine to maintain that the device can protect against most transient conditions regardless of length or type. For more information on TI's test methods for Surge, ESD, and EFT testing, reference TI's IEC 61000-4-x Testing Application Note www.ti.com TVS5800 SLVSII6 – JANUARY 2026 Copyright © 2026 Texas Instruments Incorporated Submit Document Feedback 7 Product Folder Links: TVS5800

8 Application and Implementation

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality.

8.1 Application Information

The TVS5800 can be used to protect any power, analog, or digital signal from transient fault conditions caused by the environment or other electrical components.

8.2 Typical Application

Figure 8-1. TVS5800 Application Schematic

8.2.1 Design Requirements

An application for the TVS5800 is protecting a Power over Ethernet (PoE) Power Sourcing Equipment (PSE) controller. In this example, the TVS5800 is protecting a PoE PSE controller such as the TPS23882, that has a nominal voltage of 58V and a clamping voltage requirement below 95V which is easily doable for the TVS5800 with a max clamping voltage of 75V. Most industrial interfaces such as this require protection against ±1kV surge test through a 42 Ω coupling resistor and a 0.5µF capacitor, equaling roughly 24A of surge current. Without any input protection, if a surge event is caused by lightning, coupling, ringing, or any other fault condition thissd input voltage rises to hundreds of volts for multiple microseconds, violating the absolute maximum input voltage and harming the device. A desired surge protection diode maximizes the useable voltage range while still clamping at a safe level for the system, TI's Flat-Clamp technology provides the best protection design. For more information on PoE PSE controller protection, see Section 10.2 of the TPS23882 data sheet. TVS5800 SLVSII6 – JANUARY 2026 www.ti.com

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8.2.2 Detailed Design Procedure

If the TVS5800 is in place to protect the device, during a surge event the voltage rises to the breakdown of the diode at 69.8V, and then the TVS5800 turns on, shunting the surge current to ground. With the low dynamic resistance of the TVS5800, large amounts of surge current has minimal impact on the clamping voltage. The dynamic resistance of the TVS5800 is around 40mΩ, which means 25A of surge current causes a voltage raise of 25A × 40m Ω = 1V. Because the device turns on at 69.8V, this means the TPS23882 input is exposed to a maximum of 69.8V + 1V = 70.8V during surge pulses. This maintains robust protection of your circuit. The small size of the device also improves fault protection by lowering the effect of fault current coupling onto neighboring traces. The small form factor of the TVS5800 allows the device to be placed extremely close to the input connector, lowering the length of the path fault current takes through the system compared to larger protection designs.

9 Power Supply Recommendations

The TVS5800 is a clamping device so there is no need to power the device. To maintain the device functions properly do not violate the recommended VIN voltage range (0V to 58V) .

10 Layout

10.1 Layout Guidelines

The optimum placement is close to the connector. EMI during an ESD event can couple from the trace being struck to other nearby unprotected traces, resulting in early system failures. The PCB designer must minimize the possibility of EMI coupling by keeping any unprotected traces away from the protected traces which are between the TVS and the connector. Route the protected traces straight. Eliminate any sharp corners on the protected traces between the TVS5800 and the connector by using rounded corners with the largest radii possible. Electric fields tend to build up on corners, increasing EMI coupling.

10.2 Layout Example

Figure 10-1. TVS5800 DFN1616 Layout www.ti.com TVS5800 SLVSII6 – JANUARY 2026 Copyright © 2026 Texas Instruments Incorporated Submit Document Feedback 9 Product Folder Links: TVS5800

11 Device and Documentation Support

11.1 Documentation Support

11.1.1 Related Documentation

For related documentation, see the following:

  • Texas Instruments, Flat-Clamp TVS Evaluation Kit
  • Texas Instruments, How to select a Surge Diode
  • Texas Instruments, Flat-Clamp surge protection technology for efficient system protection

11.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Notifications to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

11.3 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

11.4 Trademarks

TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners.

11.5 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

11.6 Glossary

TI Glossary This glossary lists and explains terms, acronyms, and definitions. NOTE: Page numbers for previous revisions may differ from page numbers in the current version. DATE REVISION NOTES January 2026 * Initial Release

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. TVS5800 SLVSII6 – JANUARY 2026 www.ti.com

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www.ti.com 10-Jan-2026 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) TVS5800VEBR Active Production UQFN-HR (VEB) | 6 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 125 S9 (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 11-Jan-2026 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant TVS5800VEBR UQFN- HR Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 11-Jan-2026 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TVS5800VEBR UQFN-HR VEB 6 3000 210.0 185.0 35.0 Pack Materials-Page 2

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