TVS3300DRVR

TVS3300 TI | Alldatasheet

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Time ( Traditional TVS TI Flat-Clamp 2010 30 Product Folder Order Now T echnical Documents Tools & Software Support & Community An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. TVS3300 SLVSDO2C –FEBRUARY 2017–REVISED FEBRUARY 2018 TVS330033-VFlat-ClampSurgeProtectionDevice

1 Features

1• Protection Against 1 kV, 42 Ω IEC 61000-4-5 Surge Test for Industrial Signal Lines

• Max Clamping Voltage of 40 V at 35 A of 8/20 µs Surge Current
• Standoff Voltage: 33 V
• Tiny 1.1 mm2 WCSP and 4 mm2 SON Footprints
• Survives Over 4,000 Repetitive Strikes of 30 A 8/20 µs Surge Current at 125°C
• Robust Surge Protection – IEC61000-4-5 (8/20 µs): 35 A – IEC61643-321 (10/1000 µs): 4 A
• Low Leakage Current – 19 nA Typical at 27°C – 28 nA Typical at 85°C
• Low Capacitance: 130 pF
• Integrated Level 4 IEC 61000-4-2 ESD Protection

2 Applications

• Industrial Sensors
• PLC I/O Modules
• 24 V Power Lines or Digital Switching Lines
• 4/20 mA Loops
• Appliances
• Medical Equipment
• Motor Drivers

3 Description

The TVS3300 robustly shunts up to 35 A of IEC 61000-4-5 fault current to protect systems from high power transients or lightning strikes. The device offers a solution to the common industrial signal line EMC requirement to survive up to 1 kV IEC 61000-4- 5 open circuit voltage coupled through a 42 Ω impedance. The TVS3300 uses a unique feedback mechanism to ensure precise flat clamping during a fault, assuring system exposure below 40 V. The tight voltage regulation allows designers to confidently select system components with a lower voltage tolerance, lowering system costs and complexity without sacrificing robustness. In addition, the TVS3300 is available in small 1 mm × 1.1 mm WCSP and 2 mm × 2 mm SON footprints which are ideal for space constrained applications, offering up to a 90 percent reduction in size compared to industry standard SMA and SMB packages. The extremely low device leakage and capacitance ensure a minimal effect on the protected line. To ensure robust protection over the lifetime of the product, TI tests the TVS3300 against 4000 repetitive surge strikes at high temperature with no shift in device performance. The TVS3300 is part of TI's Flat-Clamp family of surge devices. For more information on the other devices in the family, see the Device Comparison Table Device Information(1) PART NUMBER PACKAGE BODY SIZE (NOM) TVS3300 WCSP (4) 1.062 mm × 1.116 mm SON (6) 2.00 mm × 2.00 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Footprint Comparison Voltage Clamp Response to 8/20 µs Surge Event

SLVSDO2C –FEBRUARY 2017–REVISED FEBRUARY 2018 www.ti.com Product Folder Links: TVS3300 Submit Documentation Feedback Copyright © 2017–2018, Texas Instruments Incorporated Table of Contents

12.2 Receiving Notification of Documentation Updates 15

13 Mechanical, Packaging, and Orderable

4 Revision History

Changes from Revision B (April 2017) to Revision C Page Changes from Revision A (March 2017) to Revision B Page Changes from Original (Feb 2017) to Revision A Page

www.ti.com SLVSDO2C –FEBRUARY 2017–REVISED FEBRUARY 2018 Product Folder Links: TVS3300 Submit Documentation FeedbackCopyright © 2017–2018, Texas Instruments Incorporated

5 Device Comparison Table

Device Vrwm Vclamp at Ipp Ipp (8/20 µs) Vrwm leakage (nA) Package Options Polarity TVS0500 5 9.2 43 0.07 SON Unidirectional TVS1400 14 18.4 43 2 SON Unidirectional TVS1800 18 22.8 40 0.5 SON Unidirectional TVS2200 22 27.7 40 3.2 SON Unidirectional TVS2700 27 32.5 40 1.7 SON Unidirectional TVS3300 33 38 35 19 WCSP, SON Unidirectional

B A 1 2 TVS3300 SLVSDO2C –FEBRUARY 2017–REVISED FEBRUARY 2018 www.ti.com Product Folder Links: TVS3300 Submit Documentation Feedback Copyright © 2017–2018, Texas Instruments Incorporated

6 Pin Configuration and Functions

IN B1, B2 4, 5, 6 I ESD and surge protected channel GND A1, A2 1, 2, 3, exposed thermal pad GND Ground

www.ti.com SLVSDO2C –FEBRUARY 2017–REVISED FEBRUARY 2018 Product Folder Links: TVS3300 Submit Documentation FeedbackCopyright © 2017–2018, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7 Specifications

7.1 Absolute Maximum Ratings

TA = 27℃ (unless otherwise noted)(1) MIN MAX UNIT Maximum Surge IEC 61000-4-5 Current (8/20 µs) 35 A IEC 61000-4-5 Power (8/20 µs) 1330 W IEC 61643-321 Current (10/1000 µs) - WCSP 4 A IEC 61643-321 Power (10/1000 µs) - WCSP 150 W IEC 61643-321 Current (10/1000 µs) - DRV 3.5 A IEC 61643-321 Power (10/1000 µs) - DRV 125 W Maximum Forward Surge IEC 61000-4-5 Current (8/20 µs) 50 A IEC 61000-4-5 Power (8/20 µs) 80 W IEC 61643-321 Current (10/1000 µs) 23 A IEC 61643-321 Power (10/1000 µs) 60 W EFT IEC 61000-4-4 EFT Protection 80 A IBR DC Breakdown Current - DRV 10 mA IF DC Forward Current 500 mA TA Ambient Operating Temperature -40 125 °C Tstg Storage Temperature -65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings - JEDEC

V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 V Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±500

7.3 ESD Ratings - IEC

V(ESD) Electrostatic discharge IEC 61000-4-2 contact discharge ±11 kV IEC 61000-4-2 air-gap discharge ±30

7.4 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted) PARAMETER MIN NOM MAX UNIT VRWM Reverse Stand-off Voltage 33 V (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

7.5 Thermal Information

THERMAL METRIC(1) TVS3300 UNITYZF (WCSP) DRV (SON)

4 PINS 6 PINS

RqJA Junction-to-ambient thermal resistance 173.8 70.4 °C/W RqJC(top) Junction-to-case (top) thermal resistance 1.7 73.7 °C/W

SLVSDO2C –FEBRUARY 2017–REVISED FEBRUARY 2018 www.ti.com Product Folder Links: TVS3300 Submit Documentation Feedback Copyright © 2017–2018, Texas Instruments Incorporated Thermal Information (continued) THERMAL METRIC(1) TVS3300 UNITYZF (WCSP) DRV (SON) RqJB Junction-to-board thermal resistance 47.1 40 °C/W YJT Junction-to-top characterization parameter 9.5 2.2 °C/W YJB Junction-to-board characterization parameter 47.1 40.3 °C/W RqJC(bot) Junction-to-case (bottom) thermal resistance N/A 11 °C/W

7.6 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT ILEAK Leakage Current Measured at VIN = VRWM, TA = 27°C 19 150 nA Measured at VIN = VRWM, TA = 85°C 28 600 nA VF Forward Voltage IIN = 1 mA from GND to IO 0.25 0.5 0.65 V VBR Break-down Voltage IIN = 1 mA from IO to GND 34 35.8 39 V VFCLAMP Forward Clamp Voltage 35 A IEC 61000-4-5 Surge (8/20 µs) from GND to IO, 27°C 1 2 5 V VCLAMP Clamp Voltage

15 A IEC 61000-4-5 Surge (8/20 µs)

from IO to GND, VIN = 0 V before surge, 27°C 34 37 40 V

35 A IEC 61000-4-5 Surge (8/20 µs) from

IO to GND, VIN = 0 V before surge, 27°C 34 38 40 V RDYN 8/20 µs surge dynamic resistance Calculated from VCLAMP at 15 A and 30 A surge current levels, 27°C 40 60 mΩ CIN Input pin capacitance VIN = 12 V, f = 1 MHz, 30 mVpp, IO to GND 110 130 150 pF SR Maximum Slew Rate 0-VRWM rising edge, sweep rise time and measure slew rate when IPEAK = 1 mA, 27°C

2.5 V/µs

0-VRWM rising edge, sweep rise time and measure slew rate when IPEAK = 1 mA, 105°C

0.7 V/µs

7.7 Typical Characteristics

Figure 1. 8/20 µs Surge Response at 35 A Figure 2. 8/20 µs Surge Response at 35 A Across Figure 3. Capacitance vs Temperature Across Bias Figure 4. Leakage Current vs Temperature at 33 V Figure 5. I/V Curve Across Temperature Figure 6. Forward Voltage vs Temperature

Copyright © 2017, Texas Instruments Incorporated TVS3300 www.ti.com SLVSDO2C –FEBRUARY 2017–REVISED FEBRUARY 2018 Product Folder Links: TVS3300 Submit Documentation FeedbackCopyright © 2017–2018, Texas Instruments Incorporated

8 Detailed Description

8.1 Overview

The TVS3300 is a precision clamp with a low, flat clamping voltage during transient overvoltage events like surge and protecting the system with zero voltage overshoot.

8.2 Functional Block Diagram

8.3 Feature Description

The TVS3300 is a precision clamp that handles 35 A of IEC 61000-4-5 8/20 µs surge pulse. The flat clamping feature helps keep the clamping voltage very low to keep the downstream circuits from being stressed. The flat clamping feature can also help end-equipment designers save cost by opening up the possibility to use lower- cost, lower voltage tolerant downstream ICs. The TVS3300 has minimal leakage under the standoff voltage of 33 V, making it an ideal candidate for applications where low leakage and power dissipation is a necessity. IEC 61000-4-2 and IEC 61000-4-4 ratings make it a robust protection solution for ESD and EFT events. Wide ambient temperature range of –40°C to +125°C a good candidate for most applications. Compact packages enable it to be used in small devices and save board area.

8.4 Reliability Testing

To ensure device reliability, the TVS3300 is characterized against 4000 repetitive pulses of 30 A IEC 61000-4-5 8/20 µs surge pulses at 125°C. The test is performed with less than 10 seconds between each pulse at high temperature to simulate worst case scenarios for fault regulation. After each surge pulse, the TVS3300 clamping voltage, breakdown voltage, and leakage are recorded to ensure that their is no variation or performance degradation. By ensuring robust, reliable, high temperature protection, the TVS3300 enables fault protection in applications that must withstand years of continuous operation with no performance change.

8.5 Device Functional Modes

8.5.1 Protection Specifications

The TVS3300 is specified according to both the IEC 61000-4-5 and IEC 61643-321 standards. This enables usage in systems regardless of which standard is required in relevant product standards or best matches measured fault conditions. The IEC 61000-4-5 standards requires protection against a pulse with a rise time of 8 µs and a half length of 20 µs, while the IEC 61643-321 standard requires protection against a much longer pulse with a rise time of 10 µs and a half length of 1000 µs.

SLVSDO2C –FEBRUARY 2017–REVISED FEBRUARY 2018 www.ti.com Product Folder Links: TVS3300 Submit Documentation Feedback Copyright © 2017–2018, Texas Instruments Incorporated Device Functional Modes (continued) The positive and negative surges are imposed to the TVS3300 by a combinational waveform generator (CWG) with a 2-Ω coupling resistor at different peak voltage levels. For powered on transient tests that need power supply bias, inductances are usually used to decouple the transient stress and protect the power supply. The TVS3300 is post tested by assuring that there is no shift in device breakdown or leakage at Vrwm. In addition, the TVS3300 has been tested according to IEC 61000-4-5 to pass a ±1 kV surge test through a 42-Ω coupling resistor and a 0.5 µF capacitor. This test is a common test requirement for industrial signal I/O lines and the TVS3300 will serve an ideal protection solution for applications with that requirement. The TVS3300 allow integrates IEC 61000-4-2 level 4 ESD Protection and 80 A of IEC 61000-4-4 EFT Protection. These combine to ensure that the device can protect against most transient conditions regardless of length or type. For more information on TI's test methods for Surge, ESD, and EFT testing, reference TI's IEC 61000-4-x Testing Application Note

8.5.2 Minimal Derating

Unlike traditional diodes the TVS3300 has very little derating of max power dissipation and ensures robust performance up to 125°C, shown in Figure 8. Traditional TVS diodes lose up to 50% of their current carrying capability when at high temperatures, so a surge pulse above 85°C ambient can cause failures that are not seen at room temperature. The TVS3300 prevents this and ensures that you will see the same level of protection regardless of temperature.

8.5.3 Transient Performance

During large transient swings, the TVS3300 will begin clamping the input signal to protect downstream conditions. While this prevents damage during fault conditions, it can cause leakage when the intended input signal has a fast slew rate. In order to keep power dissipation low and remove the chance of signal distortion, it is recommended to keep the slew rate of any input signal on the TVS3300 below 2.5 V/µs at room temperature and below 0.7 V/µs at 125°C shown in Figure 9. Faster slew rates will cause the device to clamp the input signal and draw current through the device for a few microseconds, increasing the rise time of the signal. This will not cause any harm to the system or to the device, however if the fast input voltage swings occur regularly it can cause device overheating.

9 Application and Implementation

validate and test their design implementation to confirm system functionality.

9.1 Application Information

by the environment or other electrical components.

9.2 Typical Application

Figure 10. TVS3300 Application Schematic

9.2.1 Design Requirements

A typical operation for the TVS3300 would be protecting an analog output module on a PLC similar to Figure 10. provides the best protection solution.

9.2.2 Detailed Design Procedure

resistance of the TVS3300, large amounts of surge current will have minimal impact on the clamping voltage. input voltage. This ensures robust protection of your circuit.

SLVSDO2C –FEBRUARY 2017–REVISED FEBRUARY 2018 www.ti.com Product Folder Links: TVS3300 Submit Documentation Feedback Copyright © 2017–2018, Texas Instruments Incorporated Typical Application (continued) The small size of the device also improves fault protection by lowering the effect of fault current coupling onto neighboring traces. The small form factor of the TVS3300 allows the device to be placed extremely close to the input connector, lowering the length of the path fault current will take through the system compared to larger protection solutions. Finally, the low leakage of the TVS3300 will have low input power losses. At 33 V, the device will see typical 19 nA leakage for a constant power dissipation of less than 100 µW, a small quantity that will minimally effect overall efficiency metrics and heating concerns.

9.2.3 PLC Surge Protection Reference Design

For a detailed description of the TVS3300 advantages in a PLC Analog Input Module, reference TI's Surge Protection Reference Design for PLC Analog Input Module This document describes the considerations and performance of the TVS3300 in a common industrial application.

9.2.4 Configuration Options

The TVS3300 can be used in either unidirectional or bidirectional configuration. By placing two TVS3300's in series with reverse orientation bidirectional operation can be used, allowing a working voltage of ±33 V. TVS3300 operation in bidirectional will be similar to unidirectional operation, with a minor increase in breakdown voltage and clamping voltage. The TVS3300 bidirectional performance has been characterized in the TVS3300 Configurations Characterization.

10 Power Supply Recommendations

The TVS3300 is a clamping device so there is no need to power it. To ensure the device functions properly do not violate the recommended VIN voltage range (0 V to 33 V) .

11 Layout

11.1 Layout Guidelines

between the TVS and the connector. Route the protected traces straight. corners with the largest radii possible. Electric fields tend to build up on corners, increasing EMI coupling.

11.2 Layout Example

Figure 11. TVS3300 WCSP Layout

Figure 12. TVS3300 SON Layout

www.ti.com SLVSDO2C –FEBRUARY 2017–REVISED FEBRUARY 2018 Product Folder Links: TVS3300 Submit Documentation FeedbackCopyright © 2017–2018, Texas Instruments Incorporated

12 Device and Documentation Support

12.1 Documentation Support

12.1.1 Related Documentation

For related documentation see the following:

• Flat-Clamp TVS Evaluation Kit
• Surge Protection Reference Design for PLC Analog Input Module
• TVS3300 Evaluation Module User's Guide
• TVS3300DRV Evaluation Module User's Guide

12.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

12.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.4 Trademarks

E2E is a trademark of Texas Instruments.

12.5 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

12.6 Glossary

SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions.

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

www.ti.com 10-Nov-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) TVS3300DRVR Active Production WSON (DRV) | 6 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 17JH TVS3300DRVR.A Active Production WSON (DRV) | 6 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 17JH TVS3300DRVRG4 Active Production WSON (DRV) | 6 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 17JH TVS3300DRVRG4.A Active Production WSON (DRV) | 6 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 17JH TVS3300YZFR Active Production DSBGA (YZF) | 4 3000 | LARGE T&R Yes SNAGCU Level-1-260C-UNLIM -40 to 125 15K TVS3300YZFR.A Active Production DSBGA (YZF) | 4 3000 | LARGE T&R Yes SNAGCU Level-1-260C-UNLIM -40 to 125 15K (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1

www.ti.com 10-Nov-2025 Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 18-Jun-2025 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 18-Jun-2025 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TVS3300DRVR WSON DRV 6 3000 210.0 185.0 35.0 TVS3300DRVRG4 WSON DRV 6 3000 210.0 185.0 35.0 TVS3300YZFR DSBGA YZF 4 3000 182.0 182.0 20.0 Pack Materials-Page 2

Images above are just a representation of the package family, actual package may vary. Refer to the product data sheet for package details. DRV 6 WSON - 0.8 mm max height PLASTIC SMALL OUTLINE - NO LEAD 4206925/F

www.ti.com PACKAGE OUTLINE C 6X 0.35 0.25 1.6 0.1 6X 0.3 0.2 1.3 1 0.1 4X 0.65 0.8 0.7 0.05 0.00 B 2.1 1.9 A 2.1 1.9 (0.2) TYP WSON - 0.8 mm max heightDRV0006A PLASTIC SMALL OUTLINE - NO LEAD 4222173/B 04/2018 PIN 1 INDEX AREA SEATING PLANE 0.08 C 3 4 (OPTIONAL) PIN 1 ID

0.1 C A B

0.05 C THERMAL PAD EXPOSED NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. SCALE 5.500

www.ti.com EXAMPLE BOARD LAYOUT

0.07 MIN

0.07 MAX

(1) 4X (0.65) (1.95) 6X (0.3) 6X (0.45) (1.6) (R0.05) TYP ( 0.2) VIA TYP (1.1) WSON - 0.8 mm max heightDRV0006A PLASTIC SMALL OUTLINE - NO LEAD 4222173/B 04/2018 SYMM 3 4 SYMM LAND PATTERN EXAMPLE SCALE:25X NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If some or all are implemented, recommended via locations are shown. SOLDER MASK OPENING SOLDER MASK METAL UNDER SOLDER MASK DEFINED METALSOLDER MASK OPENING SOLDER MASK DETAILS NON SOLDER MASK DEFINED (PREFERRED)

www.ti.com EXAMPLE STENCIL DESIGN 6X (0.3) 6X (0.45) 4X (0.65) (0.7) (1) (1.95) (R0.05) TYP (0.45) WSON - 0.8 mm max heightDRV0006A PLASTIC SMALL OUTLINE - NO LEAD 4222173/B 04/2018 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL EXPOSED PAD #7 88% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE SCALE:30X SYMM 3 4 SYMM METAL

www.ti.com PACKAGE OUTLINE C

0.625 MAX

0.35 0.15 0.5 0.5 4X 0.35 0.25 B E A D 4223221/A 08/2016 DSBGA - 0.625 mm max heightYZF0004 DIE SIZE BALL GRID ARRAY NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. SYMM SYMM BALL A1 CORNER SEATING PLANE BALL TYP 0.05 C 1 2

0.015 C A B

A B SCALE 14.000 D: Max = E: Max = 1.146 mm, Min = 1.092 mm, Min = 1.086 mm 1.032 mm

www.ti.com EXAMPLE BOARD LAYOUT 4X ( 0.245) ( 0.245) METAL

0.05 MAX

( 0.245) SOLDER MASK OPENING

0.05 MIN

(0.5) (0.5) 4223221/A 08/2016 DSBGA - 0.625 mm max heightYZF0004 DIE SIZE BALL GRID ARRAY NOTES: (continued) 3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. See Texas Instruments Literature No. SNVA009 (www.ti.com/lit/snva009). SOLDER MASK DETAILS NOT TO SCALE 1 2 A B SYMM SYMM LAND PATTERN EXAMPLE SCALE:40X NON-SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED

www.ti.com EXAMPLE STENCIL DESIGN 4X ( 0.25) (R0.05) TYP METAL TYP (0.5) TYP (0.5) TYP 4223221/A 08/2016 DSBGA - 0.625 mm max heightYZF0004 DIE SIZE BALL GRID ARRAY NOTES: (continued) 4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. 1 2 A B SYMM SYMM SOLDER PASTE EXAMPLE BASED ON 0.1 mm THICK STENCIL SCALE:50X

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