TVS2210 TI | Alldatasheet
Document overview
- Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
- PDF pages: 13
Technical content
TVS2210 22V Flat-Clamp Surge Protection Device
1 Features
- Protection against ±1kV, 42Ω IEC 61000-4-5 surge test for industrial signal lines
- Maximum clamping voltage of 28V at 25A of 8/20µs surge current
- Robust surge protection: – IEC 61000-4-5 (8/20µs): 25A
- Integrated IEC 61000-4-2 ESD protection
- Tiny 1.0mm x 0.6mm footprint
2 Applications
- Mobile Phones
- Tablets
- PC & Notebooks
- USB Type-C™ Vbus
3 Description
The TVS2210 robustly shunts up to 25A of IEC 61000-4-5 fault current to protect systems from high power transients or lightning strikes. The device offers a solution to the common industrial signal line EMC requirement to survive up to ±1kV IEC 61000-4-5 open circuit voltage coupled through a 42 Ω impedance. The TVS2210 uses a unique feedback mechanism for precise flat clamping during a fault, allowing system exposure below 30V. The tight voltage regulation allows designers to confidently select system components with a lower voltage tolerance, lowering system costs and complexity without sacrificing robustness. In addition, the TVS2210 is available in a small, non-encapsulated 1.0mm × 0.6mm footprint which is designed for space constrained applications. The extremely low device leakage and capacitance causes a minimal effect on the protected line.
Package Information
PART NUMBER PACKAGE (1) PACKAGE SIZE (2) TVS2210 (0402, 2), YMZ 1.0mm × 0.6mm (1) For all available packages, see the orderable addendum at the end of the data sheet. (2) The package size (length × width) is a nominal value and includes pins, where applicable. Voltage Time ( Traditional TVS TI Flat-Clamp 2010 30 Voltage Clamp Response to 8µs to 20µs Surge Event Voltage Level Detection Power FET Driver IN GND Functional Block Diagram TVS2210 SLVSIE1 – DECEMBER 2025 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.
9 Mechanical, Packaging, and Orderable Information....8 TVS2210 SLVSIE1 – DECEMBER 2025 www.ti.com
2 Submit Document Feedback Copyright © 2025 Texas Instruments Incorporated
Product Folder Links: TVS2210
4 Pin Configuration and Functions
Figure 4-1. YMZ Package, 2-Pin 0402 (Bottom View) Pin Functions PIN TYPE DESCRIPTION NAME NO. IN 1 IO ESD and surge protected channel GND 2 GND Ground www.ti.com TVS2210 SLVSIE1 – DECEMBER 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 3 Product Folder Links: TVS2210
5 Specifications
5.1 Absolute Maximum Ratings
TA = 27°C (unless otherwise noted)(1) MIN MAX UNIT Maximum Surge IEC 61000-4-5 Current (8/20 µs) 25 A IEC 61000-4-5 Power (8/20 µs) 700 W TA Ambient Operating Temperature -40 125 °C Tstg Storage Temperature -65 150 °C (1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
5.2 ESD Ratings - JEDEC
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/ JEDEC JS-001, all pins(1) ±2000 V Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±500 (1) JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.
5.3 ESD Ratings - IEC
V(ESD) Electrostatic discharge IEC 61000-4-2 contact discharge ±8 kV
5.4 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) PARAMETER MIN NOM MAX UNIT VRWM Reverse Stand-off Voltage 22 V
5.5 Thermal Information
THERMAL METRIC(1) TVS2210 UNITYMZ (0402)
2 PINS
RθJA Junction-to-ambient thermal resistance 242.6 °C/W RθJC(top) Junction-to-case (top) thermal resistance 1.9 °C/W RθJB Junction-to-board thermal resistance 63.7 °C/W ΨJT Junction-to-top characterization parameter 1.2 °C/W ΨJB Junction-to-board characterization parameter 63.6 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note. TVS2210 SLVSIE1 – DECEMBER 2025 www.ti.com
4 Submit Document Feedback Copyright © 2025 Texas Instruments Incorporated
Product Folder Links: TVS2210
5.6 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VRWM Reverse Stand-off Voltage 22 V ILEAK Leakage Current Measured at VIN = VRWM TA = 25°C 6 70 nA Measured at VIN = VRWM TA = 85°C 25 500 nA VBR Break-down Voltage IIN = 1mA from IO to GND 24.6 25.9 27.6 V VF Forward Voltage IIN = 1mA from GND to IO 0.25 0.5 0.65 V VCLAMP Clamp Voltage 1A IEC 61000-4-5 Surge (8/20µs) from IO to GND, VIN = 0V before surge, 25°C 27.2 27.7 V VCLAMP Clamp Voltage 25A IEC 61000-4-5 Surge (8/20µs) from IO to GND, VIN = 0V before surge, 25°C 27.6 28 V RDYN 8/20µs surge dynamic resistance Calculated from VCLAMP at .5*Ipp and Ipp surge current levels, 25°C 30 mΩ CIN Input pin capacitance VIN = VRWM, f = 1MHz, IO to GND 59 pF www.ti.com TVS2210 SLVSIE1 – DECEMBER 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 5 Product Folder Links: TVS2210
5.7 Typical Characteristics
V o l t a g e ( V ) Current (mA) - 3 0 3 6 9 1 2 1 5 1 8 2 1 2 4 2 7 - 1 0 - 5 1 0 - 4 0 C 2 5 C 1 0 5 C 1 2 5 C Figure 5-1. IV Across Temperature T i m e ( s ) Voltage (V) / Current (A) - 5 0 5 1 0 1 5 2 0 2 5 3 0 3 5 4 0 1 0 1 5 2 0 2 5 3 0 3 5 C u r r e n t V o l t a g e Figure 5-2. Surge Response at 25A Figure 5-3. Maximum Surge Current (8/20µs) vs Temperature S l e w R a t e ( V / s ) Dynamic Leakage (mA) 0 1 2 3 4 5 1 0 1 5 2 0 - 4 0 C 2 7 C 1 2 5 C Figure 5-4. Maximum Leakage vs Signal Slew Rate Across Temperature TVS2210 SLVSIE1 – DECEMBER 2025 www.ti.com
6 Submit Document Feedback Copyright © 2025 Texas Instruments Incorporated
Product Folder Links: TVS2210
6 Application and Implementation
Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality.
6.1 Power Supply Recommendations
The TVS2210 is a clamping device so there is no need to power it. To ensure the device functions properly, do not violate the recommended VIN voltage range (0V to 22V).
6.2 Layout
6.2.1 Layout Guidelines
The optimum placement is close to the connector. EMI during an ESD event can couple from the trace being struck to other nearby unprotected traces, resulting in early system failures. The PCB designer must minimize the possibility of EMI coupling by keeping any unprotected traces away from the protected traces which are between the TVS and the connector. Route the protected traces straight. Eliminate any sharp corners on the protected traces between the TVS2210 and the connector by using rounded corners with the largest radii possible. Electric fields tend to build up on corners, increasing EMI coupling.
6.2.2 Layout Example
Figure 6-1. TVS2210 Layout www.ti.com TVS2210 SLVSIE1 – DECEMBER 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 7 Product Folder Links: TVS2210
7 Device and Documentation Support
7.1 Documentation Support
7.1.1 Related Documentation
For related documentation, see the following:
- Texas Instruments, Flat-Clamp surge protection technology for efficient system protection
- Texas Instruments, TI's IEC 61000-4-x Testing Application Note.
- Texas Instruments, TVS3300 Configurations Characterization
7.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Notifications to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.
7.3 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.
7.4 Trademarks
Type-C™ is a trademark of USB Implementers Forum, Inc.. TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners.
7.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
7.6 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.
8 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version. DATE REVISION NOTES December 2025 * Initial Release
9 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. TVS2210 SLVSIE1 – DECEMBER 2025 www.ti.com
8 Submit Document Feedback Copyright © 2025 Texas Instruments Incorporated
Product Folder Links: TVS2210
9.1 Mechanical Data
www.ti.com PACKAGE OUTLINE 2X 0.30.20.015CAB 2X 0.550.45 0.650.55 1.050.95 4231897/A 05/2025 PicoStar - 0.2 mm max heightYNZ0002APicoStar PIN 1 INDEX AREA SEATING PLANE 1 20.015CBA 0.015CAB PKG PKGPIN 1 ID(45X 0.125) TM TM SCALE 15.000 AB C www.ti.com TVS2210 SLVSIE1 – DECEMBER 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 9 Product Folder Links: TVS2210
www.ti.com EXAMPLE BOARD LAYOUT 2X (0.25) 2X (0.5) 0.05 MINALL AROUND0.05 MAXALL AROUND (0.65)(R0.05) TYP 4231897/A 05/2025 PKG PicoStar - 0.2 mm max heightYNZ0002APicoStar SEE DETAILS 1 2PKG LAND PATTERN EXAMPLEEXPOSED METAL SHOWNSCALE:80X NOTES: (continued) 4. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). TMTM SOLDER MASKOPENING METAL UNDERSOLDER MASK SOLDER MASKDEFINEDEXPOSEDMETALMETAL EDGE SOLDER MASKOPENINGNON SOLDER MASKSOLDER MASK DETAILSDEFINED(PREFERRED)EXPOSEDMETAL TVS2210 SLVSIE1 – DECEMBER 2025 www.ti.com
10 Submit Document Feedback Copyright © 2025 Texas Instruments Incorporated
Product Folder Links: TVS2210
www.ti.com EXAMPLE STENCIL DESIGN 2X (0.5) 2X (0.25) (0.65)(R0.05) TYP 4231897/A 05/2025 PicoStar - 0.2 mm max heightYNZ0002APicoStar NOTES: (continued) 5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. TMTM SOLDER PASTE EXAMPLEBASED ON 0.1 mm THICK STENCILSCALE:80X PKG 1 2PKG www.ti.com TVS2210 SLVSIE1 – DECEMBER 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 11 Product Folder Links: TVS2210
www.ti.com 19-Dec-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) TVS2210YMZR Active Production DSLGA (YMZ) | 2 3000 | LARGE T&R - Call TI Level-1-260C-UNLIM - TN (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1
IMPORTANT NOTICE AND DISCLAIMER TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, regulatory or other requirements. These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you fully indemnify TI and its representatives against any claims, damages, costs, losses, and liabilities arising out of your use of these resources. TI’s products are provided subject to TI’s Terms of Sale, TI’s General Quality Guidelines, or other applicable terms available either on ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products. Unless TI explicitly designates a product as custom or customer-specified, TI products are standard, catalog, general purpose devices. TI objects to and rejects any additional or different terms you may propose. IMPORTANT NOTICE Copyright © 2025, Texas Instruments Incorporated Last updated 10/2025