TSYS01 TEC | Alldatasheet

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SENSOR SOLUTIONS ///TSYS01 Page 1 09/2015 TSYS01 Digital Temperature Sensor SPECIFICATIONS  High Accuracy Temperature Sensor  16/24 bit Resolution  Low Power  SPI/I2C Interface  QFN16 Package The TSYS01 is a single chip, versatile, new technology temperature sensor. The TSYS01 provides factory calibrated temperature information. It includes a temperature sensing chip and a 24 bit ΔΣ- ADC. The essence of the digital 24 bit temperature value and the internal factory set calibration values lead to highly accurate temperature information accompanied by high measurement resolution. The TSYS01 can be interfaced to any microcontroller by an I2C or SPI interface. This microcontroller has to calculate the temperature result based on the ADC values and the calibration parameters. The basic working principle is:  Converting temperature into digital 16/24 bit ADC value  Providing calibration coefficients  Providing ADC value and calibration coefficients by SPI or I2C interface.

Digital Temperature Sensor SENSOR SOLUTIONS /// TSYS01 09/2015 Page 2

FEATURES

High Accuracy ±0.1°C @ Temp.: -5°C … +50°C Adjustment of high accuracy temp. range on request Low Current, <12.5 μA (standby < 0.14 μA) SPI / I2C Interface Small Package: QFN16 Operating Temperature Range: -40°C … +125°C

APPLICATIONS

Replacement of Thermistors and NTCs Heating / Cooling Systems HVAC ABSOLUTE MAXIMUM RATINGS Absolute maximum ratings are limiting values of permitted operation and should never be exceeded under the worst possible conditions either initially or consequently. If exceeded by even the smallest amount, instantaneous catastrophic failure can occur. And even if the device continues to operate satisfactorily, its life may be considerably shortened. Parameter Symbol Conditions Min Typ Max Unit Supply Voltage VDD -0.3 +3.6 V Operating Temperature Top -40 +125 °C Storage temperature Tstor -55 +150 °C ESD rating ESD Human Body Model (HBM) pin to pin incl. VDD & GND -4 +4 kV Humidity Hum Non condensing OPERATING CONDITIONS Parameter Symbol Conditions Min Typ Max Unit Operating Supply Voltage VDD stabilized 2.2 3.6 V High Accuracy Supply Voltage VDD To achieve Acc1 3.2 3.4 V Supply Current IDD 1 sample per second 12.5 µA Standby current IS No conversion, VDD = 3V T = 25°C T = 85°C 0.02 0.70 0.14 1.40 µA µA Peak Supply Current IDD During conversion 1.4 mA Conversion time TCONV 7.40 8.22 9.04 ms Serial Data Clock SPI FSCLK 20 MHz Serial Data Clock I2C FSCL 400 kHz VDD Capacitor Place close to the chip 100nF

Digital Temperature Sensor SENSOR SOLUTIONS /// TSYS01 09/2015 Page 3 OPERATIONAL CHARACTERISTICS If not otherwise noted, 3.3V supply voltage is applied. Parameter Symbol Conditions Min Typ Max Unit Temp. Measurement Range TRANG -40 125 °C Accuracy 1 TACC1 -5°C < T < +50°C Accuracy 2 TACC2 -40°C < T < +125°C Power Supply Reject Ratio PSRR VDD = 2.7 – 3.6 T = 25°C, C = 100nF 0.2 °C Temperature Resolution TRES 0.01 °C Time Constant Tliquid t63 (t1  t2) t1 = 25°C (air 0m/s) t2 = 75°C (liquid) PCB 900mm2 x 1.5mm FR4 3 s Tair t63 (t1  t2) t1 = 25°C (air 0m/s) t2 = 75°C (air stream 60m/s) PCB 900mm2 x 1.5mm FR4 4 s Self Heating SH1 10 samples/s, 60s, still air 0.02 °C ANALOGUE TO DIGITAL CONVERTER Parameter Symbol Conditions Min Typ Max Unit Output Word 24 bit Conversion Time tc 7.40 8.22 9.04 ms DIGITAL INPUTS (SCLK, SDI, CSB, PS) Parameter Symbol Conditions Min Typ Max Unit Input High Voltage VIH VDD = 2.2…3.6V 0.7 VDD VDD V Input Low Voltage VIL VDD = 2.2…3.6V 0.0 VDD 0.3 VDD V CS low to first SCLK rising tCSL 21 ns CS high to first SCLK rising tCSH 21 ns SDI setup to first SCLK rising TDSO 6 ns SDI hold to first SCLK rising TDO 6 ns DIGITAL OUTPUTS (SDA, SDO) Parameter Symbol Conditions Min Typ Max Unit Output High Voltage VOH ISource = 1mA 0.8 VDD VDD V Output Low Voltage VOL ISink = 1mA 0.0 VDD 0.2 VDD V SDO setup to first SCLK rising tQS 10 ns SDO hold to first SCLK rising tQH 0 ns

Digital Temperature Sensor SENSOR SOLUTIONS /// TSYS01 09/2015 Page 4 CONNECTION DIAGRAM PIN FUNCTION TABLE Pin Name Type Function

1 VSS G Ground

2 CSB DI SPI: Chip Select (active low)

I2C: Address Selection

3 SCLK/SCL DI SPI: Serial Data Clock

I2C: Serial Data Clock

4 SDI/SDA DIO SPI: Serial Data Input

I2C: Data Input / Output

5 SDO DO SPI: Serial Data Output

6 – 9 NC --- Not connected / Do not connect

10 A I Connect Pin10 with Pin11

11 B I Connect Pin11 with Pin10

12 – 14 NC --- Not connected / Do not connect

15 VDD P Supply Voltage

16 PS DI Communication protocol select (0=SPI, 1=I2C)

--- DAP --- Die Attach Pad, suggested to connect to VSS

Digital Temperature Sensor SENSOR SOLUTIONS /// TSYS01 09/2015 Page 5 INTERFACE DESCRIPTION PROTOCOL SELECTION PS pin input level has to be defined in dependence to protocol selection.  PS = 0 activates SPI.  PS = 1 activates I 2C. I2C INTERFACE A I2C communication message starts with a start condition and it is ended by a stop condition. Each command consists of two bytes: the address byte and command byte. I2C ADDRESS SELECTION The I2C address can be selected by CSB pin.  CSB=1 then the address is 1110110x.  CSB=0 the address is 1110111x. Therefore, two TSYS01 can be interfaced on the same I2C bus. SPI INTERFACE The serial interface is a 4-wire SPI bus, operating as a slave. CS (chip select), SCLK (serial clock), SDI (serial data in), and SDO (serial data out) are used to interact with the SPI master. Communication with the chip starts when CS is pulled to low and ends when CS is pulled to high. SCLK is controlled by the SPI master and idles low (SCLK low on CS transitions, mode 0). A mode where the clock alternatively idles high is also supported (mode 3). COMMANDS The commands are the same for SPI and I2C interface. There are four commands:  Reset  Read PROM (calibration parameters)  Start ADC Temperature conversion  Read ADC Temperature result Command Hex Value Reset 0x1E Start ADC Temperature Conversion 0x48 Read ADC Temperature Result 0x00 PROM Read Address 0 0xA0 PROM Read Address 1 0xA2 PROM Read Address 2 0xA4 PROM Read Address 3 0xA6 PROM Read Address 4 0xA8 PROM Read Address 5 0xAA PROM Read Address 6 0xAC PROM Read Address 7 0xAE

Digital Temperature Sensor SENSOR SOLUTIONS /// TSYS01 09/2015 Page 6 RESET SEQUENCE The Reset sequence has to be sent once after power-on. It can be also used to reset the device ROM from an unknown condition. SPI I2C PROM READ SEQUENCE The PROM Read command consists of two parts. First command sets up the system into PROM read mode. The second part gets the data from the system. Below examples are sequences to read address 3 (command 0xA6). SPI I2C

Digital Temperature Sensor SENSOR SOLUTIONS /// TSYS01 09/2015 Page 7 CONVERSION SEQUENCE A conversion has to be started by sending this command. The sensor stays busy until conversion is done. When conversion is finished the data can be accessed by using ADC read command SPI The last clock will start the conversion which TSYS01 indicates by pulling SDO low. SDO goes high when conversion is completed. I2C When the command is sent the TSYS01 stays busy until the conversion is done. All other commands except the reset command will not be executed during this time. When the conversion is finished th e data can be accessed by sending a ADC read command, when an acknowledge appears from TSYS0 1. READ ADC RESULT After the conversion command the ADC result is read using ADC read command. Repeated ADC read commands, or command executed without prior conversion will return all 0 as result. SPI I2C

Digital Temperature Sensor SENSOR SOLUTIONS /// TSYS01 09/2015 Page 8 TEMPERATURE CALCULATION CALIBRATION PARAMETER Variable Description Command Size / bit Min Max Example k4 Coefficient k4 of polynomial 0xA2 16 0 65535 28446 k3 Coefficient k3 of polynomial 0xA4 16 0 65535 24926 k2 Coefficient k2 of polynomial 0xA6 16 0 65535 36016 k1 Coefficient k1 of polynomial 0xA8 16 0 65535 32791 k0 Coefficient k0 of polynomial 0xAA 16 0 65535 40781 TEMPERATURE POLYNOMAL ADC24 : ADC value ADC16 : ADC24 / 256 4 * k3 * 10-16 * ADC163 + 1 * k1 * 10-6 * ADC16 + EXAMPLE ADC24: 9378708 ADC16: 9378708 / 256 = 36636 4 * 24926 * 10-16 * 366363 + (-2 * 36016 * 10 -11 * 366362 + 1 * 32791 * 10-6 * 36636 + T / °C = 10.59

Digital Temperature Sensor SENSOR SOLUTIONS /// TSYS01 09/2015 Page 9 DIMENSIONS TOP VIEW SIDE VIEW BOTTOM VIEW Die Attach Pad, suggested to connect to VSS MARKING Line Description Example

1 Manufacturer MEAS

2 Product Name TSYS01

3 Pin 1 Dot, Date Code YYWW 1141

Digital Temperature Sensor SENSOR SOLUTIONS /// TSYS01 09/2015 Page 10 ORDER INFORMATION Please order this product using following: Part Number Part Description G-NICO-018 TSYS01 Digital Temperature Sensor EMC Due to the use of these modules for OEM application no CE declaration is done. Especially line coupled disturbances like surge, burst, HF etc. cannot be removed by the module d ue to the small board area and low price feature. There is no protection circuit against reverse polarity or over vol tage implemented. The module will be designed using capacitors for blocking and ground plane areas in order to prevent w ireless coupled disturbances as good as possible. DEFINITIONS AND DISCLAIMERS  Application information – Applications that are described herein for any of these products are for illustrative purpose only. MEAS Deutschland GmbH makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.  Life support applications – These products are not designed for use in life support appliances, devices, or systems where malfunctions of these products can reasonably be expected to result in personal injury. MEAS Deutschland GmbH customers using or selling this product for use in such applications do so at their own risk and agree to fully indemnify MEAS Deutschland GmbH for an y damages resulting from such improper use or sale TE.com/sensorsolutions Measurement Specialties, Inc., a TE Connectivity company. Measurement Specialties, TE Connectivity, TE Connectivity (logo) and EVERY CONNECTION COUNTS are trademarks. All other logos, products and /or company names referred to herein might be trademarks of their respective owners. The information given herein, including drawings, illustrations and schematics which are intended for illustration purposes only, is believe d to be reliable. However, TE Connectivity makes no warranties as to its accuracy or completeness and disclaims any liability in connection with its use. TE Connectivity‘s obligation s shall only be as set forth in TE Connectivity‘s Standard Terms and Conditions of Sale for this product and in no ca se will TE Connectivity be liable for any incidental, indirect or consequential damages arising out of the sale, resale, use o r misuse of the product. Users of TE Connectivity products should make their own evaluation to determine the suitability of each such product for the specific application. © 2015 TE Connectivity Ltd. family of companies All Rights Reserved. NORTH AMERICA Measurement Specialties, Inc., a TE Connectivity Company

910 Turnpike Road

Shrewsbury, MA 01545 Tel: 1-508-842-0516 Fax: 1-508-842-0342 Sales email: temperature.sales.amer@meas-spec.com EUROPE Measurement Specialties (Europe), Ltd., a TE Connectivity Company Deutschland GmbH Hauert 13

44277 Dortmund

Fax: +49 (0) 231/9740-20 Sales email: info.de@meas-spec.com ASIA Measurement Specialties (China), Ltd., a TE Connectivity Company No. 26 Langshan Road Shenzhen High-Tech Park (North) Nanshan District, Shenzhen 518057 China Tel: +86 755 3330 5088 Fax: +86 755 3330 5099 Sales: temperature.sales.asia@meas- spec.com