TSV522IST STMICROELECTRONICS | Alldatasheet
Document overview
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- PDF pages: 27
Technical content
Datasheet sections
- 1 Package pin connections
- 2 Absolute maximum ratings and operating conditions
- 3 Electrical characteristics
- 4 Application information
- 4.1 Operating voltages
- 4.2 Common mode voltage range
- 4.3 Rail-to-rail input
- 4.4 Rail-to-rail output
- 4.5 Driving resistive and capacitive loads
- 4.6 Input offset voltage drift over temperature
- 4.7 Long term input offset voltage drift
- 4.8 PCB layouts
- 4.9 Macromodel
- 5 Package information
- 6 Ordering information
- 7 Revision history
Features
■ Gain bandwidth product: 1.15 MHz typ. at 5 V ■ Low power consumption: 45 µA typ. at 5 V ■ Rail-to-rail input and output ■ Low input bias current: 1 pA typ. ■ Supply voltage: 2.7 to 5.5 V ■ Low offset voltage: 800 µV max. ■ Unity gain stable on 100 pF capacitor ■ Automotive grade Benefits ■ Increased lifetime in battery powered
applications
■ Easy interfacing with high impedance sensors
Related products
■ See TSV6x series for lower minimum supply voltage (1.5 V) ■ See LMV82x series for higher gain bandwidth products (5.5 MHz) ■ Battery powered applications ■ Portable devices ■ Automotive signal conditioning ■ Active filtering ■ Medical instrumentation
Description
The TSV52x series of operational amplifiers offers low voltage operation and rail-to-rail input and output. The TSV521 device is the single version, the TSV522 device the dual version, and the TSV524 device the quad version, with pinouts compatible with industry standards. The TSV52x series offers an outstanding speed/power consumption ratio, 1.15 MHz gain bandwidth product while consuming only 45 µA at 5 V. The devices are housed in the smallest industrial packages. These features make the TSV52x family ideal for sensor interfaces, battery supplied and portable applications. The wide temperature range and high ESD tolerance facilitate their use in harsh automotive applications. Table 1. Device summary
1 Package pin connections
Figure 1. Pin connections for each package (top view)
2 Absolute maximum ratings and operating conditions
Table 2. Absolute maximum ratings (AMR)
- All voltage values, except differential voltages are with respect to network ground terminal.
- Differential voltages are the non inverting input terminal with respect to the inverting input terminal.
- V CC - Vin must not exceed 6 V, Vin must not exceed 6 V.
- Input current must be limited by a resistor in series with the inputs.
- Short-circuits can cause excessive heating and destructive dissipation.
- Human body model: 100 pF discharged through a 1.5 k Ω resistor between two pins of the device, done for
all couples of pin combinations with other pins floating.
- Machine model: a 200 pF cap is charged to the specified voltage, then discharged directly between two
combinations with other pins floating.
- Charged device model: all pins plus package are charged together to the specified voltage and then
discharged directly to ground. Table 3. Operating conditions
3 Electrical characteristics
Table 4. Electrical characteristics at V CC+ = +2.7 V with VCC- = 0 V, Vicm = VCC/2, T = 25 °C, and
Table 5. Electrical characteristics at V CC+ = +3.3 V with VCC- = 0 V, Vicm = VCC/2, T = 25 °C, and
Table 6. Electrical characteristics at V CC+ = +5 V with VCC- = 0 V, Vicm = VCC/2, T = 25 °C,
- See Section 4.6: Input offset voltage drift over temperature on page 15 .
- Typical value is based on the V io drift observed after 1000 h at 125 °C extrapolated to 25 °C using the Arrhenius law and
assuming an activation energy of 0.7 eV. The operational amplifier is aged in follower mode configuration.
4 Application information
4.1 Operating voltages
temperature ranges from -40 to +125 °C.
4.2 Common mode voltage range
to 100 mv above the positive rail. below the negative rail to VCC- +0 . 7V . And between VCC- + 0.7 V and VCC+ - 0.7 V the both N and P pairs are active. When the both pairs work together it allows to increase the speed of the TSV52x device. io (Figure 25 and Figure 26) and THD is slightly degraded. Figure 25. Input offset voltage vs. input Figure 26. Input offset voltage vs. input
4.3 Rail-to-rail input
The TSV52x series are guaranteed without phase reversal as shown in Figure 28. It is extremely important that the current flowing in the input pin does not exceed 10 mA. In order to limit this current a serial resistor can be added on the V in path.
4.4 Rail-to-rail output
4.5 Driving resistive and capacitive loads
s/Rload. By choosing Rs as low as possible, this error is generally negligible. Figure 27. Phase reversal test schematic Figure 28. No phase reversal
Figure 29. In series resistor versus capacitive load
4.6 Input offset voltage drift over temperature
the system designer to anticipate the effects of temperature variations. size ensuring a Cpk greater than 2.
4.7 Long term input offset voltage drift
In a product reliability evaluation, two types of stress acceleration are usable:
- Voltage acceleration, by changing the applied voltage
- Temperature acceleration, by changing the die temperature (below the maximum junction temperature allowed by the technology) with the ambient temperature The voltage acceleration has been defined based on JEDEC results, and is defined by: Equation 2 where: AFV is the voltage acceleration factor ß is the voltage acceleration constant in 1/V , constant technology parameter VS is the stress voltage used for the accelerated test VU is the use voltage for the application The temperature acceleration is driven by the Arrhenius model, and is defined by: Equation 3 where: AFT is the temperature acceleration factor Ea is the activation energy of the technology based on failure rate k is the Boltzmann’s constant TU is the temperature of the die when V U is used TS is the temperature of the die under temperature stress The final acceleration factor, AF, is the multiplication of these two acceleration factors, which is: Equation 4 AF = AFT x AFV Based on this AF, calculated following the defined usage temperature and usage voltage of the product, the 1000 h duration of the stress corresponds to a number of equivalent months of usage. Equation 5 Months = A F x 1000 h x 12 months / (24h x 365.25 days) AFV e β VS VU–()⋅ AFT e Ea TU TS ⎛⎞⋅
For the operational amplifier, a follower stress condition is used for the reliability evaluation, with VCC defined in function of the Maximum operating voltage and the absolute maximum rating (as recommended by the JEDEC standards). The Vio drift, in µV, of the product after 1000 h duration of stress is tracked with parameters at different measurement conditions, as for example: Equation 6 VCC = max. Vop with Vicm=VCC/2 Finally, knowing the calculated number of months and with the measured drift value of the Vio (corresponding to the electrical characteristics of the respective table) after 1000 h duration of stress, the ratio of the Vio drift over the square of months, ΔVio in µV/√month, is defined as the long term drift parameter, the parameter estimating the reliability performance of the product. Equation 7 ΔVio = Vio drift / √(months)
4.8 PCB layouts
For correct operation, it is advised to add 10 nF decoupling capacitors as close as possible to the power supply pins.
4.9 Macromodel
Accurate macromodels of the TSV52x device are available on STMicroelectronics™ website at www.st.com. This model is a trade-off between accuracy and complexity (that is, time simulation) of the TSV52x operational amplifiers. It emulates the nominal performance of a typical device within the specified operating conditions mentioned in the datasheet. It also helps to validate a design approach and to select the appropriate operational amplifier, but it does not replace onboard measurements .
5 Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark.
Figure 30. SC70-5 package outline Table 7. SC70-5 package mechanical data
Figure 31. DFN8 2 x 2 x 0.6, 8 pitch, 0.5 mm package outline Table 8. DFN8 2 x 2 x 0.6, 8 pitch, 0.5 mm package mechanical data
Figure 32. DFN8 2 x 2 0.6, 8 pitch, 0.5 mm footprint recommendation
Figure 33. MiniSO8 package outline Table 9. MiniSO8 package mechanical data
Figure 34. QFN16 - 3 x 3 x 0.9 mm, pad 1.7 - package outline
Figure 35. QFN16 - 3 x 3 x 0.9 mm, pad 1.7 - footprint recommendation Table 10. QFN16 - 3 x 3 x 0.9 mm, pad 1.7 - package mechanical data
Figure 36. TSSOP14 body 4.40 mm, lead pitch 0.65 mm - package outline Table 11. TSSOP14 body 4.40 mm, lead pitch 0.65 mm - package mechanical data
6 Ordering information
7 Revision history
Table 12. Order codes
- Qualification and characterization according to AEC Q100 and Q003 or equivalent, advanced screening according to AEC
Q001 and Q 002 or equivalent are ongoing. Table 13. Document revision history 19-Jun-2012 1 Initial release.