TSTM872-20 STMICROELECTRONICS | Alldatasheet

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Technical content

.MOBILE CLASS C POWER AMPLIFIER .806 - 870 MHz .12.5 VOLTS .INPUT/OUTPUT 50 OHMS .POUT = 20 W MIN. .GAIN = 19 dB MIN.

DESCRIPTION

The TSTM872-20 module is designed for high power, high efficiency, analog private mobile radio systems in the 806 - 870 MHz frequency range. A significant advantage of this module is its high RF power output performance and very low standby current. PIN CONNECTION ABSOLUTE MAXIMUM RATINGS (Tcase = 25°C) Symbol Parameter Value Unit V S1 ,V S2 ,V S3 DC Supply Voltage 16 Vdc P IN RF Input Power 400 mW P OUT RF Output Power 25 W TSTG Storage Temperature − 30 to +100 °C TC Operating Case Temperature − 30 to +100 °C TSTM872-20 4. 12.5 Vdc VS3 5. RF Output ORDER CODE TSTM872-20 BRANDING TSTM872-20 PRODUCT DEVELOPMENT DATA SHEET This data sheet contains the design criteria and target specifications for a product which is currently under development by SGS-THOMSON. The design criteria and specifications of this item could change prior to introduction and SGS-THOMSON assumes no liability for use of information contained herein.

ELECTRICAL SPECIFICATIONS (Tcase = 25 °C, VS1 ,V S2 ,V S3 = 12.5 Volts unless otherwise noted.) Symbol Parameter Test Conditions Value Unit Min. Typ. Max. BW Frequency Range 806 — 870 MHz P IN Input Power POUT = 20 W — — 250 mW η Efficiency POUT = 20 W 35 40 — % IQ1(q) Quiescent Current VS1 No RF applied — 50 — mA IQ2(q) Quiescent Current VS2 No RF applied — 1.0 — mA IQ3 (q) Quiescent Current VS3 No RF applied — 0.04 — mA H Harmonics POUT = 20 W — −58 —d B c ZIN Input Impedance POUT = 20 W — — 2.0:1 VSWR — Load Mismatch VSWR = 30:1 V = 16 Vdc POUT = 25 W No Degradation in Output Power INTERNAL CONFIGURATION TSTM872-20

APPLICATIONS RECOMMENDATIONS OPERATION LIMITS The TSTM872-20 power module should never be operated under any condition which exceeds the Absolute Maximum Ratings presented on this data sheet. Nor should the module be operated continuously at any of the specified maximum rat- ings. If the module is to be subjected to one or more of the maximum rating conditions, care must be taken to monitor other parameters which may be affected. DECOUPLING Failure to properly decouple any of the voltage supply pins will result in oscillations at certain op- erating frequencies. Therefore, it is recommended that these pins be bypassed as indicated in the Module DC and Test Fixture Configuration draw- ing of this data sheet. MODULE MOUNTING To insure adequate thermal transfer from the module to the heatsink, it is recommended that a satisfactory thermal compound such as Dow Corning 340, Wakefield 120-2 or equivalent be applied between the module flange and the heatsink. The heatsink mounting surface under the module should be flat to within +/- 0.05 mm (+/- 0.002 inch). The module should be mounted to the heatsink using 3.5 mm (or 6-32) or equivalent screws torques to 5-6 kg-cm (4-6 in-lb). The module leads should be attached to equip- ment PC board using 180°C solder applied to the leads with a properly grounded soldering iron tip, not to exceed 195°C, applied a minimum of 2 mm (0.080”) from the body of the module for a dura- tion not to exceed 15 seconds per lead. It is im- perative that no other portion of the module, other than the leads, be subjected to temperatures in excess of 100°C (maximum storage temperature), for any period of time, as the plastic moulded cover, internal components and sealing adhesives may be adversely affected by such conditions. Due to the construction techniques and materials used within the module, reflow soldering of the flange heatsink or leads, is not recommended. TSTM872-20

Ref.: Dwg. No. M12-030 rev. C Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no respon- sibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectronics.  1995 SGS-THOMSON Microelectronics - All Rights Reserved SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A. TSTM872-20