TSSOP-56 FAIRCHILD | Alldatasheet
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Fairchild Semiconductor Product Package Material Disclosure Materials Disclosure Disclaimer The information provided in this Materials Disclosure is, to our knowledge, correct. However, there is no guarantee to complet eness or accuracy, as some information is derived from data sources outside the company. Also, there may not be information included in this statement regarding the minute amounts of dopant and metal materials contained within the electrically active or passive devices contained within the finished product. Package Type TSSOP-56 Weight of Package (grams) Maximum Minimum 2.21E-01 2.08E-01 Component Material Weight in grams Substance in material Wt% in finished product min Wt% in finished product max CAS # 33.34 35.41 Copper 32.08 33.66 7440-50-8 Nickel 1.00 1.06 7439-89-6 Silicon 0.22 0.23 7440-66-6 Magnesium 0.05 0.05 7439-95-4 Silver (DP) 0.00 0.40 7440-22-4 Lead Frame Copper alloy 7.37E-02 58.07 61.66 Silica 35.92 47.89 Carbon Black 0.00 0.90 Resin 8.98 20.65 Antimony Compound 0.30 1.80 1309-64-4 Brominated Compound 0.90 2.39 68541-56-0 Encapsulation Epoxy 1.28E-01 1.37 6.87 Tin 1.17 5.84 7440-31-5 Solder 8.84E-03 Lead 0.21 1.03 7439-92-1 1.37 6.87 Tin 1.37 6.87 7440-31-5 Plating or Lead-free Solder 8.84E-03 0.84 0.93 Silicon and trace metals 0.84 0.93 7440-21-3 Chip Silicon and inorganic compounds 1.90E-03 0.10 0.11 Silver 0.07 0.08 7440-22-4 Resin 0.02 0.03 Die Attach Adhesive 2.22E-04 0.62 0.68 Gold 0.62 0.68 7440-57-5 Wire Bond Gold Wire 1.39E-03