ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

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  • Manufacturer or author: Roseanna haney
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ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending o n application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculat ed by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC -7351A, Naming Convention for Stand ard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. 2015-11-09 1 of 1 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions TSSOP-20EP TSSOP-20EP Dim Min Max Typ A - 1.20 - A1 0.025 0.100 - A2 0.80 1.05 0.90 b 0.19 0.30 - c 0.09 0.20 - D 6.40 6.60 6.50 E 6.20 6.60 6.40 E1 4.30 4.50 4.40 L 0.45 0.75 0.60 L1 1.0 REF e 0.65 BSC X - - 4.191 Y - - 2.997 θ1 0° 8° - All Dimensions in mm Suggested Pad Layout TSSOP-20EP Dimensions Value (in mm) C 0.650 X 0.420 X1 4.490 X2 6.270 Y 1.780 Y1 3.290 Y2 4.160 Y3 7.720 ID MARK PIN 1 e D EE1 A2 A A1b X Y DETAIL Seating Plane Gauge Plane 0.25 L Y2 Y3 Y X C