TSS4B01G_16 TMT | Alldatasheet

Document overview

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Technical content

  • Glass passivated junction - Ideal for printed circuit board - High case dielectric strength of 2000VRMS - Reliable low cost construction - UL Recognized File # E-326243 - Halogen-free according to IEC 61249-2-21 definition Molding compound, UL flammability classification rating 94V-0 Base P/N with suffix "G" on packing code - halogen-free Terminal: Matte tin plated leads, solderable per JESD22-B102 Meet JESD 201 class 1A whisker test V RRM V VRMS V VDC V IF(AV) A I2tA 2s Trr ns RθJC OC/W TJ OC TSTG OC Note 2: Reverse Recovery Test Conditions: IF=0.5A, IR=1.0A, IRR=0.25A. Document Number: DS_D1311039 Version: D13 Maximum reverse recovery time(Note 2) 35 50 Note 1: Pulse test with PW=300μs, 1% duty cycle PARAMETER SYMBOL TSS4B 01G TSS4B 02G TSS4B 03G TSS4B 04G UNIT 200 140 Typical thermal resistance 5.5 Operating junction temperature range - 55 to +150 1.3 Peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load IFSM Storage temperature range - 55 to +150 Maximum instantaneous forward voltage (Note 1) @ 4 A VF V Maximum DC reverse current TJ=25 ℃ at rated DC blocking voltage TJ=125℃ IR 500 μA 0.98 150 A Rating for fusing (t<8.3ms) 93 Maximum DC blocking voltage 50 100 400 Maximum average forward rectified current 4 200 Maximum repetitive peak reverse voltage 50 100 400 Maximum RMS voltage 35 70 280 Mounting torque: 5 in-lbs maximum Weight: 4 g (approximately) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25℃ unless otherwise noted) MECHANICAL DATA Case: TS4B Polarity: Polarity as marked on the body TS4B TSS4B01G thru TSS4B04G Taiwan Semiconductor Glass Passivated Bridge Rectifiers

FEATURES

  • Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC

PART NO. Note 1: "x" defines voltage from 50V (TSS4B01G) to 400V (TSS4B04G) PART NO. TSS4B01G TSS4B01G (TA=25℃ unless otherwise noted) Document Number: DS_D1311039 Version: D13 Green compound

DESCRIPTION

RATINGS AND CHARACTERISTICS CURVES TS4B TS4B TSS4B01G C2 C2 TSS4B01G C2G C2 G PREFERRED P/N PACKING CODE GREEN COMPOUND CODE TSS4B0xG (Note 1) Suffix "G" TS4B 20 / Tube TSS4B01G thru TSS4B04G PACKING CODE GREEN COMPOUND CODE PACKAGE Taiwan Semiconductor PACKING

ORDERING INFORMATION

CURRENT (A) CASE TEMPERATURE (oC) FIG.1- MAXIMUM FORWARD CURRENT DERATING CURVE RESISTIVE OR INDUCTIVE LOAD WITH HEATSINK 100 125 150 175 1 10 100 PEAK FORWARD SURGE CURRENT (A) NUMBER OF CYCLES AT 60 Hz FIG. 3- MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT 8.3ms Single Half Sine Wave JEDEC Method 0.1 100 1000 0 20 40 60 80 100 120 140 INSTANTANEOUS REVERSE CURRENT (μA) PERCENT OF RATED PEAK REVERSE VOLTAGE (%) FIG. 4- TYPICAL REVERSE CHARACTERISTICS TJ=25℃ TJ=100℃ 0.1 INSTANTANEOUS FORWARD CURRENT (A) FORWARD VOLTAGE (V) FIG. 2- TYPICAL FORWARD CHARACTERISTICS Pulse Width=300μs 1% Duty Cycle TSS4B01G-03G TSS4B04G

A 24.70 25.30 0.972 0.996 B 0.90 1.10 0.035 0.043 C 1.80 2.20 0.071 0.087 D 14.70 15.30 0.579 0.602 E 3.96 4.37 0.156 0.172 F 17.00 18.00 0.669 0.709 G 7.30 7.70 0.287 0.303 H 3.30 3.70 0.130 0.146 I 3.10 3.40 0.122 0.134 J 9.30 9.70 0.366 0.382 K 1.52 1.73 0.060 0.068 L 0.55 0.75 0.022 0.030 P/N = Specific Device Code G = Green Compound YWW = Date Code F = Factory Code Document Number: DS_D1311039 Version: D13 MARKING DIAGRAM TSS4B01G thru TSS4B04G Taiwan Semiconductor PACKAGE OUTLINE DIMENSIONS DIM. Unit(mm) Unit(inch) 100 200 300 400 500 600 700 800 900 1000 0.1 1 10 100 1000 JUNCTION CAPACITANCE (pF) A REVERSE VOLTAGE (V) FIG. 5- TYPICAL JUNCTION CAPACITANCE f=1.0MHz Vsig=50mVp-p

assumes no responsibility or liability for any errors inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied,to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Document Number: DS_D1311039 Version: D13 TSS4B01G thru TSS4B04G Taiwan Semiconductor Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,