TSS4B01G TSC | Alldatasheet

Document overview

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Technical content

  • UL Recognized File # E-326243 - Glass passivated junction - Ideal for printed circuit board - High case dielectric strength of 2000VRMS - Reliable low cost construction - Halogen-free according to IEC 61249-2-21 definition V RRM V VRMS V VDC V IF(AV) A I2TA 2sec Trr nS RθJC OC/W TJ OC TSTG OC Note 2 : Reverse Recovery Test Conditions: IF=0.5A, IR=1.0A, IRR=0.25A. Document Number:DS_D1311039 Version:D13 Maximum Reverse Recovery Time(Note 2) 35 50 Note 1:Pulse test with PW=300u sec, 1% duty cycle PARAMETER SYMBOL TSS4B 01G TSS4B 02G TSS4B 03G TSS4B 04G UNIT 200 140 Typical thermal resistance 5.5 Operating junction temperature range - 55 to + 150 Storage temperature range - 55 to + 150 Maximum instantaneous forward voltage (Note 1) @ 4 A V F V Maximum DC reverse current TJ=25 ℃ at rated DC blocking voltage TJ=125℃ IR 500 uA 0.98 1.3 Peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load IFSM 150 A Rating for fusing (t<8.3mS) 93 Maximum DC blocking voltage 50 100 400 Maximum average forward rectified current 4 200 Maximum repetitive peak reverse voltage 50 100 400 Maximum RMS voltage 35 70 280 Mounting torque:5 in-lbs maximum Weight:4 gram (approximately) MAXIMUM RATINGS AND ELECTRICAL CHARACTERSTICS (TA=25℃ unless otherwise noted) MECHANICAL DATA Case:TS4B Molding compound, UL flammability classification rating 94V-0 Base P/N with suffix "G" on packing code - halogen-free, RoHS compliant Terminal:Matte tin plated leads, solderable per JESD22-B102 Meet JESD 201 class 1A whisker test Polarity:Polarity as marked on the body TS4B TSS4B01G thru TSS4B04G Taiwan Semiconductor Glass Passivated Bridge Rectifiers

FEATURES

  • Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC

PART NO. Note 1: "x" defines voltage from 50V (TSS4B01G) to 400V (TSS4B04G) PART NO. TSS4B01G TSS4B01G (TA=25℃ unless otherwise noted) Document Number:DS_D1311039 Version:D13 RATINGS AND CHARACTERISTICS CURVES TS4B TS4B Forming 20 / TUBE TSS4B01G C2 C2 TSS4B01G C2G C2 G Green compound EXAMPLE PREFERRED P/N PACKING CODE GREEN COMPOUND CODE

DESCRIPTION

(Note 1) Suffix "G" TS4B 20 / TUBE X2 TS4B Forming TSS4B01G thru TSS4B04G

ORDERING INFORMATION

PACKING CODE GREEN COMPOUND CODE PACKAGE Taiwan Semiconductor 0 50 100 150 AVERAGE FORWARD A CURRENT (A) CASE TEMPERATURE (oC) FIG.1- MAXIMUM FORWARD CURRENT DERATING CURVE RESISTIVE OR INDUCTIVE LOAD WITH HEATSINK 100 125 150 175 1 10 100 PEAK FORWARD SURGE CURRENT (A) NUMBER OF CYCLES AT 60 Hz FIG. 3- MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT 8.3ms Single Half Sine Wave JEDEC Method 0.1 100 1000 0 20 40 60 80 100 120 140 INSTANTANEOUS REVERSE CURRENT (uA) PERCENT OF RATED PEAK REVERSE VOLTAGE (%) FIG. 4- TYPICAL REVERSE CHARACTERISTICS TJ=25℃ TJ=100℃ 0.1 INSTANTANEOUS FORWARD CURRENT (A) FORWARD VOLTAGE (V) FIG. 2- TYPICAL FORWARD CHARACTERISTICS Pulse Width=300us 1% Duty Cycle TSS4B01G-03G TSS4B04G

A 24.70 25.30 0.972 0.996 B 0.90 1.10 0.035 0.043 C 1.80 2.20 0.071 0.087 D 14.70 15.30 0.579 0.602 E 3.96 4.37 0.156 0.172 F 17.00 18.00 0.669 0.709 G 7.30 7.70 0.287 0.303 H 3.30 3.70 0.130 0.146 I 3.10 3.40 0.122 0.134 J 9.30 9.70 0.366 0.382 K 1.52 1.73 0.060 0.068 L 0.55 0.75 0.022 0.030 P/N = Specific Device Code G = Green Compound YWW = Date Code F = Factory Code Document Number:DS_D1311039 Version:D13 MARKING DIAGRAM TSS4B01G thru TSS4B04G Taiwan Semiconductor PACKAGE OUTLINE DIMENSIONS DIM. Unit(mm) Unit(inch) 100 200 300 400 500 600 700 800 900 1000 0.1 1 10 100 1000 JUNCTION CAPACITANCE (pF) A REVERSE VOLTAGE (V) FIG. 5- TYPICAL JUNCTION CAPACITANCE f=1.0MHz Vsig=50mVp-p