TSS42U_10 TSC | Alldatasheet
Document overview
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Technical content
Features
Terminals: Gold plated, solderable per MIL-STD-750, Method 2026. Green compound (Halogen free) with suffix "G" on packing code and prefix "G" on date code High temperature soldering guaranteed: 260°C/10s T C 0.45 (Typical) mA °C/W D Value 500 667 150 mW Storage Temperature Range T J, TSTG -55 to + 125 Repetitive Peak Forward Current Thermal Resistance (Junction to Ambient) IFRM RθJA 1.00 VVRRM Power Dissipation Repetitive Peak Reverse Voltage PD Type Number Polarity : Indicated by cathode band Weight :0.003 gram (appeox.)
Ordering Information
Suggested Footprint Dimensions Operation Junction Temperature T J 125 °C 0.40 0.65 0.33 Pin Configuration 0.018 (Typical) 0.7 (Typical) X (x2) Y (x2) L W D T C Version :B10
RATINGS AND CHARACTERISTIC CURVES (TSS42U/TSS43U) Capacitance between terminals ( PF) Reverse voltage (V) Fig.3 - Capacitance between terminals characteristics Forward current (mA ) 0.2 0.40 100 0.6 0.1 0.8 Forward voltage (V) Fig. 1 - Forward characteristics O 5 C O 25 C O 5 7 C O
25 C 1
Reverse current ( A ) Reverse voltage (V) 10u 10n 100u 100n 0 10 20 30 40 Fig. 2 - Reverse characteristics O 25 C O 75 C O 125 C 0 5 10 15 20 25 30 35 f=1MHz O TA=25 C 100 0 25 50 75 100 125 150 O Ambient temperature ( C) Average forward current(%) Mounting on glass epoxy PCBs Fig.4 - Current derating curve 120 500 Version :B10