TSS42L TSC | Alldatasheet
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Technical content
Features
Designed for mounting on small surface Extremely thin/leadless package Low capacitance Low forward voltage drop High temperature soldering: 260oC/10 seconds at terminals Chip version in 1005 Mechanical Data Case: 1005 Standard package, molded plastic Terminals: Gold plated, solderable per MIL-STD-750, method 2026. Polarity: Indicated by cathode band Mounting position: Any Package code: RW Weight: 0.006 gram (approximately) ITEM 1005 L 0.102(2.60) 0.095(2.40) W 0.051(1.30) 0.043(1.10) T 0.035(0.90) 0.027(0.70) C 0.020(0.50) Typical D 0.040(1.00) Typical Dimensions in inches and (millimeters) Maximum Ratings TA=25 oC unless otherwise specified Type Number Symbol 1005 Units Repetitive Peak Reverse Voltage VRRM 30 V Reverse Voltage VR 30 V RMS Reverse Voltage VR(RMS) 21 V Average Forward Current IO 200 mA Repetitive Peak Forward Current IFRM 0.5 A Peak Forward Surge Current 8.3ms single half sine-wave superimposed on rate load (JEDEC method) IFSM 400 mA Power Dissipation Pd 200 mW Forward Voltage TSS42L/43L IF=200mA TSS42L IF=10mA TSS42L IF=50mA TSS43L IF=2mA TSS43L IF=15mA VF 1.0 0.4 0.65 0.33 0.45 V Reverse Leakage Current VR=25V IR 0.5 uA Typical capacitance between terminals VR=1V, f =1.0MHz reverse voltage CJ 10 pF Reverse Recovery Time (IF=IR=10mA, Irr=0.1x IR, RL=100Ώ) Trr 5 nS Junction Temperature TJ -55 to + 125 oC Storage Temperature TSTG -55 to + 125 oC Version: A07
RATINGS AND CHARACTERISTIC CURVES(TSS42L/TSS43L) Capacitance between terminals ( PF) Reverse voltage (V) Fig.3 - Capacitance between terminals characteristics Forward current (mA ) 0.2 0.40 100 0.6 0.1 0.8 Forward voltage (V) Fig. 1 - Forward characteristics O CO CO 5 7 CO C Reverse current ( A ) Reverse voltage (V) 10u 10n 100u 100n 0 10 20 30 40 Fig. 2 - Reverse characteristics O 25 C O 75 C O 125 C 0 5 10 15 20 25 30 35 f=1MHz O TA=25 C 100 0 25 50 75 100 125 150 O Ambient temperature ( C) Average forward current(%) Mounting on glass epoxy PCBs Fig.4 - Current derating curve 120 500