TSM SPSEMI | Alldatasheet
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Technical content
Surface Mount Devices Almost anywhere there is a low voltage Lead free deivce power supply, up to DC60V and a load Size 5045mm/2018 mils to be protested, including: Surface Mount packaging for automated assembly Computer mother board, Modem. Agency recognition: Telecommunication equipments Model D min max min max min max min TSM100 4.44 4.72 4.22 4.93 0.45 0.80 0.30 Product dimensions (mm) Dimensions (mm) A B C TSM100 Test Passive aging Humidity aging Thermal shock Resistance to solvent Vibration Maximum surface of the device in the tripped state is 125℃ MIL-STD-202,Method 215 No change Meets EIA specification RS186-9E and ANSI/J-STD-002 Category 3. Terminal pad materials Terminal pad solderability Tin-Plated Nickle-Copper or Gold-Plated Nickle-Copper Termination pad characteristics Ambient operating confitions:-40℃ to 85℃ MIL-STD-202,Method 201 No change Environmental Specifications ±5% typical 85℃,85%℃R.H.,168hrs ±5% typical 85℃,to-40℃,13times ±33% typical C o n d i t i o n s Resistance change 85℃,1000hrs 3.4 ±0.1 1.5 ±0.1 1.5 ±0.1 4.6 ±0.1 ZZZ B D A C PPTC /TSM Series 01 | www.spsemi.cn REV.2014.05.01
V max Imax Pd ma x Current Time Rmin Rmax (A) (A) (Vdc) (A) (w) (A) (S) (Ω) (Ω) Ihold Itrip Vmax Imax Pd Rmin/max R1max *CAUTION Model maximun ambient operating temperature(Tmao)vs.hold current(Ihold) Ihold versus tempetature Trip current:Minimum current at which the device will always trip in 25℃ still air Maximum Time To Trip Resistance Hold Current:Maximum current device will not trip in 25℃ still air. Maximum resistance of device at 25℃ measured one hour after trippde tripping. Operation beyond the specified rating may result in damage and possible arcing. Maximum operating volatge device can withstand without damage at ratde curre nt(imax). Maximum fault current device can withstand without damage at rated voltage(V max). Electrical characteristics(25℃) Typical power dissipatde from device when in the tripped state in 25℃ still air. Minimum/Maximum device resistance prior to tripping at 25℃.
Package Information
Reel: TSM030～050 1500pcs/Reel TSM100～200 2500pcs/Reel Thermal Derating Curve Typical Time-To-Trip At 25°C Derating Curves for SMD2018 Series 100 120 140 160 -40 -20 0 20 40 60 80 Temperature (°C) Percentage of Derated Current Average Time Current Curves 0.001 0.01 0.1 100 0.1 1 10 100 Current In Amperes Time In Second 050 100 150 200 133 030 PPTC/TSM Series 02 | www.spsemi.cn REV.2014.05.01