TSM032NH04CR TSC | Alldatasheet

Document overview

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  • PDF pages: 7

Technical content

1 Version: D2207

FEATURES

  • Ultra-low On-resistance
  • Wettable Flank leads for Enhanced AOI
  • 100% UIS and Rg tested
  • 175°C Operating Junction Temperature
  • RoHS Compliant
  • Halogen-Free according to IEC 61249-2-21

APPLICATIONS

  • DC-DC Converters
  • Solenoid and Motor Drivers
  • Load Switch PRODUCT SUMMARY PARAMETER VALUE UNIT VDS 40 V RDS(on) (max) VGS = 10V 3.2 mΩ VGS = 7V 3.8 Qg VGS = 10V 45 nC Note: MSL 1 (Moisture Sensitivity Level) per J-STD-020 ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted) PARAMETER SYMBOL LIMIT UNIT Drain-Source Voltage VDS 40 V Gate-Source Voltage VGS ±20 V Continuous Drain Current, Silicon limited TC = 25°C ID 144 A Continuous Drain Current (Note 1) TC = 25°C ID A TC = 100°C 81 TA = 25°C 23 Pulsed Drain Current IDM 324 A Single Pulse Avalanche Current (Note 2) IAS 32.4 A Single Pulse Avalanche Energy (Note 2) EAS 157 mJ Total Power Dissipation TC = 25°C PD 115 W TC = 125°C 38 Operating Junction and Storage Temperature Range TJ, TSTG -55 to +175 °C THERMAL RESISTANCE PARAMETER SYMBOL MAXIMUM UNIT Thermal Resistance – Junction to Case RӨJC 1.3 °C/W Thermal Resistance – Junction to Ambient RӨJA 50 °C/W Note: RӨJA is the sum of the junction-to-case and case-to-ambient thermal resistances. The case-thermal reference is defined at the solder mounting surface of the drain pins. RӨJC is guaranteed by design while RӨCA is determined by the user’s board design. PDFN56U

2 Version: D2207

ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) PARAMETER CONDITIONS SYMBOL MIN TYP MAX UNIT Static Drain-Source Breakdown Voltage VGS = 0V, ID = 1mA BVDSS 40 -- -- V Gate Threshold Voltage VGS = VDS, ID = 250µA VGS(TH) 2.4 3 3.6 V Gate-Source Leakage Current VGS = ±20V, VDS = 0V IGSS -- -- ±100 nA Drain-Source Leakage Current VGS = 0V, VDS = 40V IDSS -- -- 1 µA VGS = 0V, VDS = 40V Drain-Source On-State Resistance (Note 3) VGS = 10V, ID = 40A RDS(on) -- 2.7 3.2 mΩ VGS = 7V, ID = 40A -- 3.2 3.8 Forward Transconductance (Note 3) VDS = 10V, ID = 10A gfs -- 73 -- S Dynamic Total Gate Charge VGS = 7V, VDS = 20V, nC Total Gate Charge VGS = 10V, VDS = 20V, ID = 23A Qg -- 45 -- Gate-Source Charge Qgs -- 14 -- Gate-Drain Charge Qgd -- 9.5 -- Input Capacitance VGS = 0V, VDS = 25V, f = 1.0MHz Ciss -- 2896 -- pF Output Capacitance Coss -- 562 -- Reverse Transfer Capacitance Crss -- 32 -- Gate Resistance f = 1.0MHz Rg -- 0.7 -- Ω Switching (Note 4) Turn-On Delay Time VGS = 10V, VDS = 20V, ID = 23A, RG = 3.3Ω td(on) -- 15.7 -- nS Rise Time tr -- 71 -- Turn-Off Delay Time td(off) -- 28.6 -- Fall Time tf -- 13 -- Source-Drain Diode Diode Forward Voltage (Note 3) VGS = 0V, IS = 40A VSD -- -- 1.1 V Reverse Recovery Time IS = 23A, di/dt = 100A/μs trr -- 42 -- nS Reverse Recovery Charge Qrr -- 43 -- nC Notes: 1. Package current limit. 2. L = 0.3mH, VGS = 10V, RG = 25Ω, Starting TJ = 25°C. 3. Pulse test: Pulse Width ≤ 300µs, duty cycle ≤ 2%. 4. Switching time is essentially independent of operating temperature.

ORDERING INFORMATION

ORDERING CODE PACKAGE PACKING TSM032NH04CR RLG PDFN56U 2,500pcs / 13” Reel

3 Version: D2207

(TA = 25°C unless otherwise noted) Output Characteristics Transfer Characteristics On-Resistance vs. Drain Current Gate-Source Voltage vs. Gate Charge On-Resistance vs. Junction Temperature On-Resistance vs. Gate-Source Voltage ID, Drain Current (A) VGS, Gate to Source Voltage (V) VDS, Drain to Source Voltage (V) RDS(on), Drain-Source On-Resistance (mΩ) ID, Drain Current (A) VGS, Gate to Source Voltage (V) Qg, Gate Charge (nC) RDS(on), Drain-Source On-Resistance (Normalized) TJ, Junction Temperature (°C) RDS(on), Drain-Source On-Resistance (mΩ) VGS, Gate to Source Voltage (V) ID, Drain Current (A) 0.00 1.00 2.00 3.00 4.00 5.00 10 15 20 25 30 35 40 VGS= 10V VGS= 7V 0 10 20 30 40 50 VDS=20V ID=23A 1 2 3 4 5 6 7 8 25°C -55°C 125°C VGS=5V VGS=5.5V VGS=6V VGS=7V VGS=8V VGS=9V VGS=10V VGS=4.5V 0.50 0.75 1.00 1.25 1.50 1.75 2.00 -75 -50 -25 0 25 50 75 100 125 150 175 VGS=10V ID=40A 1.00 2.00 3.00 4.00 5.00 7 7.5 8 8.5 9 9.5 10 ID=40A

4 Version: D2207

(TA = 25°C unless otherwise noted) Capacitance vs. Drain-Source Voltage BVDSS vs. Junction Temperature Maximum Safe Operating Area, Junction-to-Case Source-Drain Diode Forward Current vs. Voltage Normalized Thermal Transient Impedance, Junction-to-Case Normalized Effective Transient Thermal Impedance, ZӨJC t, Square Wave Pulse Duration (sec) C, Capacitance (pF) VDS, Drain to Source Voltage (V) BVDSS (Normalized) Drain-Source Breakdown Voltage TJ, Junction Temperature (°C) IS, Reverse Drain Current (A) VSD, Body Diode Forward Voltage (V) VDS, Drain to Source Voltage (V) ID, Drain Current (A) 100 1000 10000 0 10 20 30 40 VGS = 0V f = 1MHz Ciss Coss Crss 0.90 0.95 1.00 1.05 1.10 -75 -50 -25 0 25 50 75 100 125 150 175 ID=1mA 0.01 0.1 0.0001 0.001 0.01 0.1 SINGLE PULSE RӨJC=1.3°C/W Duty=0.5 Duty=0.2 Duty=0.1 Duty=0.05 Duty=0.02 Duty=0.01 Single Notes: Duty = t1 / t2 TJ = TC + PDM x ZӨJC x RӨJC 0.1 1.0 10.0 100.0 -55°C 25°C 175°C 0.1 100 1000 0.1 1 10 100 RDS(ON) SINGLE PULSE RӨJC=1.3°C/W TC=25°C

5 Version: D2207

(TA = 25°C unless otherwise noted) Power Dissipation Drain Current Normalized gate threshold voltage vs Temperature ID, Drain Current (A) Junction-to-Case Temperature (°C) Threshold Voltage (Normalized) TJ, Junction Temperature (°C) PTOT – Power (W) Junction-to-Case Temperature (°C) 0.0 20.0 40.0 60.0 80.0 100.0 120.0 0 25 50 75 100 125 150 175 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 -75 -50 -25 0 25 50 75 100 125 150 175 ID=250µA 100 120 140 160 0 25 50 75 100 125 150 175 VGS=10V Package limited Silicon limited

6 Version: D2207

PACKAGE OUTLINE DIMENSIONS (Unit: Millimeters) PDFN56U SUGGESTED PAD LAYOUT (Unit: Millimeters) MARKING DIAGRAM Y = Year Code WW = Week Code (01~52) L = Lot Code (1~9,A~Z) F = Factory Code TSC 032NH04 YWWLF

7 Version: D2207

Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Purchasers are solely responsible for the choice, selection, and use of TSC products and TSC assumes no liability for application assistance or the design of Purchasers’ products. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life -saving, or life -sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and a gree to fully indemnify TSC for any damages resulting from such improper use or sale.