TSLM1100

TSLM1100 TI | Alldatasheet

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IrDA COMPLIANT TRANSCEIVER SOES034A – SEPTEMBER 1997 – REVISED OCTOBER 1997 1POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 /C0068Fully Compliant with IrDA 1.1 (4 MBPS) /C0068Compatible with ASK, HP-SIR and TV Remote /C0068No Programming Required to Switch Speeds /C0068Backward Compatible to Slower IrDA Speeds /C0068Excellent Noise Immunity /C0068Fully Supportable by all Interface Chips /C0068Designed to Compensate for Light Loss Caused by Cosmetic Windows

description

The TSLM1100 is an infrared transceiver that provides the interface between logic and IR signals for through-air, serial, half-duplex IR data links. The TSLM1100 is compliant with the Infrared Data Association (IrDA) 1.1 physical-layer specification. Additionally, the TSLM1100 is compatible with ASK, HP-SIR and TV Remote standards. The TSLM1100 is a hybrid device that includes a high-speed AIGaAs 870-nm LED, a silicon intrinsic PN junction (PIN) diode, and a LinCMOS transceiver integrated circuit. This IC has the LED driver and a receiver that provides two output signals: RXD-A for data rates from 2.4 kb/s to 115.2 kb/s and RXD-B for data rates of 576 kb/s to 4.0 Mb/s. The device is encapsulated in a visible-light-rejecting plastic package that has integral lenses for the LED and the PIN diode. The receiver lens increases the effective area of the PIN diode to increase sensitivity. The LED lens is designed to provide a beam angle of ± 30°. The receiver outputs pulse low when an IR signal is detected. The power supply for both PIN diode and LED should be filtered to minimize noise from external sources. This transceiver is well suited for a wide variety of IR interface applications including: PC notebooks, PDAs, pagers, printers, cameras, LANs, telephones and industrial handheld devices. FUNCTION TABLE INPUTS OUTPUTS TXD Ee Ie(LED) RXD-A RXD-B VIH X High NV NV VIL EI(IH)† Low Low NV VIL EI(IH)‡ Low NV Low VIL EI(IL) Low High High X – don’t care, NV – not valid † Data rates up to 115.2 kb/s ‡ Data rates > 115.2 kb/s Copyright  1997, Texas Instruments IncorporatedPRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. GNDA CX4 RXD-B GND TXD RXD-A CX3 2 3456789

10 LEDA

(TOP VIEW) 1CX1

IrDA COMPLIANT TRANSCEIVER SOES034A – SEPTEMBER 1997 – REVISED OCTOBER 1997

2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

NAME NO. CX1 1 Photodiode bypass capacitor GNDA 2 Analog ground CX4 3 Averaging capacitor VCC 4 Supply voltage RXD-B 5 Receiver data output – Channel B GND 6 Ground TXD 7 Transmitter data input RXD-A 8 Receiver data output – Channel A CX3 9 Threshold capacitor LEDA 10 LED anode absolute maximum ratings over operating free-air temperature (unless otherwise noted)† † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. recommended operating conditions CONDITIONS MIN MAX UNITS Supply voltage, VCC 4.75 5.25 V Logic high transmitter input voltage, VIH 4.25 5.25 V Logic low transmitter input voltage, VIL 0.0 0.3 V Logic high receiver input irradiance E(IH) For in-band signals ≤ 116 kb/s 0.0036 500 mW/cm 2 Logic high receiver input irradiance, Ee(IH) For in-band signals ≥ 576 kb/s 0.0090 500 mW/cm 2 Logic low receiver input irradiance, Ee(IL) For in-band signals 0.3 µW/cm 2 LED (logic high) Current pulse amplitude, II(LEDA) 400 660 mA Receiver setup time For full sensitivity after transmitting 1.0 ms Receiver signal rate, RXD-A 2.4 116 kb/s Receiver signal rate, RXD-B 0.576 4 Mb/s Ambient light See IrDA serial infrared physical link specification, 1.1e Appendix A for Ambient levels and Appendix B Operating temperature, TA Case to ambient thermal resistance ≤ 50°C/W 0 70 °C

IrDA COMPLIANT TRANSCEIVER SOES034A – SEPTEMBER 1997 – REVISED OCTOBER 1997 3POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 electrical characteristics at VCC = 5 V, TA = 25°C (unless otherwise noted); test conditions represent worst-case values for the parameters under test PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VOL Low level output voltage receiver data RXD-A IO = 1 mA, for in-band Ee ≥ 3.6 µW/cm 2, φ1/2 ≤ 15° 0.5 VVOL Low-level output voltage, receiver data RXD-B IO = 1 mA, for in-band Ee ≥ 9 µW/cm 2, φ1/2 ≤ 15° 0.5 V VOH High level output voltage receiver data RXD-A IO =–20 µA, for in-band Ee ≤ 0.3 µW/cm 2 VCC –0.6 VVOH High-level output voltage, receiver data RXD-B IO = –20 µA, for in-band Ee ≤ 0.3 µW/cm 2 VCC –1.2 V IIL Low-level input current, transmitter dataIIL(TXD) GND ≤ VIL(TXD) ≤ 0.3 V –2 2 µA IIH High-level input current, transmitter dataIIH(TXD) VIH(TXD) = 4.25 V 40 250 µA vT On-state voltage LED anode vT(LEDA) II(LED) = 400 mA at 25°C VIH(TXD) = 4.25 V 2.78 V ID(lkg) OFF-state leakage current, LED anodeID(lkg)(LEDA) VI(LEDA) = VCC = 5.25 V VIL(TXD) = 0.3 V 250 µA ICC1 Supply current, idle state VCC = 5.25 V VI(TXD) = VIL, Ee = 0 3 5.1 mA ICC2 Supply current, active receiver VCC = 5.25 V VI(TXD) = VIL, Ee ≤ 500 nW/cm2 4 18 mA optical specifications PARAMETER CONDITIONS MIN TYP MAX UNIT 2φ1/2 Receiver viewing angle ±15 ° Effective detector area 0.2 cm 2 I Transmitter radiant intensity logic high VIH(TXD) = 4.25 V II(LED) = 450 mA, 100 177 mW/sr Ie Transmitter radiant intensity, logic high VIH(TXD) = 4.25 V II(LED) = 450 mA, 80 177 mW/sr λp Transmitter peak-emission wavelength 875 nm Δλ 1/2 Transmitter spectral-line half-width 35 nm 2Φ 1/2 Transmitter viewing angle ±15 ±30 ° Receiver peak-emission sensitivity wave length 880 nm

IrDA COMPLIANT TRANSCEIVER SOES034A – SEPTEMBER 1997 – REVISED OCTOBER 1997

4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT I (PW) Transmitter radiant intensitypulse width Ie(PW) Transmitter radiant intensity pulse width Ie(PW)(TXD) = 125 ns at 2M pulses/s 115 125 135 ns I Transmitter radiant intensity Rise time I (PW)(TXD) = 125 ns at 2Mpulses/s 40 nsIe Transmitter radiant intensity Fall time Ie(PW)(TXD) = 125 ns at 2M pulses/s 40 ns PW Pulse width RXD-A Φ 1/2 ≤ 15° 1 7.5 µs PW Pulse width RXD-B Φ 1/2 =≤ 15° 75 185 ns PW Pulse width RXD B (ASK) 500 kHz 50% duty cycle carrier ASK 07 1 13 µsPW Pulse width, RXD -B (ASK) 500 kHz, 50% duty cycle carrier ASK 0.7 1 1.3 µs tL Receiver latency time RXD-A 05 mstL Receiver latency time RXD-B 0.5 ms

APPLICATION INFORMATION

CX1 † CX3 CX4 CX5 † CX6 CX7 RECOMMENDED VALUE 10 Ω , ± 5%, 0.125 W 0.47 µF, ±10%, X7R Ceramic 4700 pF, ±10%, X7R Ceramic 0.010 µF, ±10%, X7R Ceramic 0.47 µF, ± 20%, X7R Ceramic 6.8 µF, Tantalum 0.47 µF, ± 20%, X7R Ceramic PARTS LIST † CX1 and CX5 must be placed within 0.7 cm of the TSLM1100 to obtain optimum noise immunity. CX1 GNDA LEDA VCC VCC CX3CX4 CX1

IrDA COMPLIANT TRANSCEIVER SOES034A – SEPTEMBER 1997 – REVISED OCTOBER 1997 5POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA SRA (R-PSIP-T8) PLASTIC SMALL-OUTLINE PACKAGE 0.168 (4,27) 0.180 (4,57) 0.055 (1,39) 0.263 (6,68) 0.275 (6,98) 0.039 (0,99) 4153800/A 06/97 0.020 (0,51) 0.014 (0,35) 0.516 (13,11) 0.636 (16,15) 0.616 (15,65) 0.524 (13,31) 0.274 (6,96) 0.266 (6,76) 0.075 (1,91) 0.059 (1,50) 0.050 (1,27) NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice.

Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) TSLM1100 OBSOLETE OPTO SRA 10 TBD Call TI Call TI (1)The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontentfor the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS):TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br):TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. PACKAGE OPTION ADDENDUM www.ti.com 8-Apr-2005 Addendum-Page 1

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