TSLG-QR8080A08L TAITRON | Alldatasheet

Document overview

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  • PDF pages: 9

Technical content

Features

  • Feature of the device: Small package with high efficiency
  • View angle: 130°C
  • High luminous flux output: more than 34 lm@350mA
  • ESD protection
  • Soldering methods: Hot bar soldering
  • Grouping parameter Total luminous flux, dominant wavelength
  • Optical efficiency: 38 lm/W
  • Thermal resistance (junction to lead): 15 K/W QSLLGQRV
  • RoHS Compliance

Applications

  • TFT LCD display backlight
  • Decorative and entertainment illumination
  • Signal and symbol luminaries for orientation marker light (e.g. steps, exit ways, etc.)
  • Exterior and interior automotive illumination Materials Items Description Housing Heat resistant polymer Encapsulating Resin Silicone resin Lens Heat resistant clear polymer Electrodes Ag plating copper alloy Die attach Silver paste Chip Emitted Color Red Chip AlGaInP Rev. A/LL TAITRON COMPONENTS INCORPORATED www.taitroncomponents.com Tel: (800)-247-2232 (800)-TAITRON (661)-257-6060 Fax: (800)-TAITFAX (800)-824-8329 (661)-257-6415 Page 1 of 9

Absolute Maximum Ratings (Ta=25°C) Parameter Symbol Value Unit Forward Current IF 500 mA Junction to heat-sink thermal resistance Rth 15 K/W Power Dissipation Pd 1.5 W Junction Temperature Tj 125 °C Operating Temperature Topr -40 ~ +100 °C Storage Temperature Tstg -40 ~ +100 °C Electro-Optical Characteristics (Ta=25°C) Parameter Bin Symbol Min. Typ. Max. Unit Condition J1 23 ----- 27 J2 27 ----- 33 Luminous Flux (1) θv 33 ----- 39 lm Viewing Angle (2) ----- 2θ1/2 ----- 130 ----- deg Forward Voltage ----- VF ----- 2.3 3.0 V R3 610 ----- 615 R4 615 ----- 620 R5 620 ----- 625 R6 625 ----- 630 Wavelength(3) λd 630 ----- 635 nm IF =350mA Notes: 1. Luminous flux measurement tolerance: ±10% 2. 2 θ1/2 is the off axis angle from lamp centerline where the luminous intensity is ½ of the peak value. 3. Wavelength measurement tolerance : ±1nm Rev. A/LL www.taitroncomponents.com Page 2 of 9

Typical Electro-Optical Characteristics Curves Forward Voltage vs Forward Current, Ta=25°C Forward Current (mA) Relative Spectral Distribution, IF=350mA, Ta=25°C Wavelength λp(nm) Forward Current Derating Curve, Derating based on TJMAX=125 °C Ambient Temperature Ta (°C) Typical Representative Spatial Radiation Pattern Angle (Degree) Relative luminous intensity (%) Forward Voltage (Volt) Relative luminous intensity Relative Luminous Intensity vs Forward Current, Ta=25°C Forward Current (mA) Forward Current (mA) Relative Intensity Rev. A/LL www.taitroncomponents.com Page 3 of 9

Reliability Test Items and Conditions No. Items Test Condition Test Hours / Cycles Sample Size Ac/Re

1 Solderability Tsol= 230°C, 5sec 1 times 22 PCS 0/1

2 Resistance to Solder Heat Tsol = 260°C, 10sec,

6 Min 3 times 22 PCS 0/1

3 Temperature Cycle

H: +100°C 30min ∫ 5 min L: - 40°C 30min

1000 Cycles 22 PCS 0/1

4 Thermal Shock

H: +110°C 20min ∫ 10 sec L: - 40°C 20min

500 Cycles 22 PCS 0/1

5 High Temperature Storage Temp: 110°C 1000 Hrs. 22 PCS 0/1 6 Low Temperature Storage Temp: - 40°C 1000 Hrs. 22 PCS 0/1 7 High Temperature Operation Life #1 Ta=55°C IF=350mA 1000 Hrs. 22 PCS 0/1 8 High Temperature Operation Life #2 Ta=85°C IF=225mA 1000 Hrs. 22 PCS 0/1 9 High Temperature Operation Life #3 Ta=100°C IF=150mA 1000 Hrs. 22 PCS 0/1 10 Low Temperature Operation Life Ta= - 40°C IF=350mA 1000 Hrs. 22 PCS 0/1

11 Power Temperature Cycle

H: +85°C 15min ∫ 5 min L: - 40°C 15min IF=225mA, 2min on/off 1000 cycles 22 PCS 0/1

12 High Temperature / High Humidity

Reverse Bias 85°C / 85%RH 1000 Hrs. 22 PCS 0/1

13 Intermittent operational Life Ta=25°C, IF=1000mA

30mS on/ 2500mS off 1000 Hrs. 22 PCS 0/1 14 ESD Human Body Model 2000V, Interval: 0.5sec 3 times 22 PCS 0/1 15 ESD Machine Model 200V, Interval: 0.5sec 3 times 22 PCS 0/1 Notes: Im: Brightness Attenuate Difference (1000hrs) <50% VF: Forward Voltage Difference < 20% Rev. A/LL www.taitroncomponents.com Page 4 of 9

Package Dimensions (In mm) Note: 1. Dimensions are in millimeters 2. Tolerances unless dimensions ± 0.25mm Solder pattern Carrier Tape Dimensions: Loaded quantity 800pcs per reel Progressive direction Note: 1. Dimensions are in millimeters 2. Tolerances unless dimensions ± 0.1mm Rev. A/LL www.taitroncomponents.com Page 5 of 9

Reel Dimensions: Note: The tolerances unless mentioned is ± 0.1mm Moisture Resistant Packaging: Rev. A/LL www.taitroncomponents.com Page 6 of 9

Ordering Information

TS L G– Q R 8080 – A08L-92-TR70 Lead Frame Type Red Color Dome Top G-bend Size in mm Lead Free Tape & Reel 7=7˝ reel 0=3k per reel Factory Location Code Code of Frame Structure Taitron SMD LED Precautions For Use 1. Over-current-proof Though the LEDs have conducted ESD protection mechanism, customer must not use the device in reverse and should apply resistors for extra protection. Otherwise slight voltage shift may cause enormous current change and burn out failure would happen. 2. Storage æ Do not open moisture proof bag before the products are ready to use. ç Before opening the package, the LEDs should be kept at 30°C or less and 90%RH or less. è The LEDs should be used within a year. é After opening the package, the LEDs should be kept at 30°C or less and 70%RH or less. ê The LEDs should be used within 168 hours (7 days) after opening the package. ë If the moisture absorbent material (silicone gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. ì Pre-curing treatment: 60±5°C for 24 hours. 3. Thermal Management æ For maintaining the high flux output and achieving reliability, the series LED package should be mounted on a metal core printed circuit board (MCPCB) with proper thermal connection to dissipate approximately 1W of thermal energy under 350mA operation. Rev. A/LL www.taitroncomponents.com Page 7 of 9

ç Special thermal designs are also recommended to take in outer heat sink design, such as FR4 PCB on Aluminum with thermal vias or FPC on Aluminum with thermal conductive adhesive, etc. è Sufficient thermal management must be conducted, or the die junction temperature will be over the limit under large electronic driving and LED lifetime will decrease critically. 4. Assembly process flow Thermal conductive glue dispensing Recommended material and its supplier: EpoTek T7109 from Epoxy Technology LED emitter placement Hot bar soldering of LED emitter Note: The MCPCB should be preheated up to 40°C for increasing the solderability Functional test of LED emitter Curing of thermal conductive glue Rev. A/LL www.taitroncomponents.com Page 8 of 9

Handling Indications: Do not handle the LEDs by the lens at any time during the assembly process. This can cause damage to the optical surfaces or may dislocate the lens if excessive force is applied. 5. Soldering Iron æ For prototype builds or small series production runs it is possible to place and solder the LED by hand. ç Dispensing thermal conductive glue or grease on the substrates and follow its curing spec. Press LED housing to closely connect LED and substrate. è It is recommended to hand solder the leads with a solder tip temperature of 280°C for less than 3 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. é Be careful because the damage of the product is often started at the time of the hand solder. How to contact us TAITRON COMPONETS INCORPORATED E REPRESENTAÇÕES DO BRASIL LTDA RUA DOMINGOS DE MORAIS, 2777, 2.ANDAR, SALA 24 SAÚDE - SÃO PAULO-SP 04035-001 BRAZIL Tel: +55-11-5574-7949 Fax: +55-11-5572-0052 TAITRON COMPONETS INCORPORATED, SHANGHAI REPRESENTATIVE OFFICE CROSS REGION PLAZA, 899 LINGLING ROAD, SUITE 18C, SHANGHAI, 200030, CHINA Tel: +86-21-54249942 Fax: +86-21-5424-9931 US HEADQUARTERS

28040 WEST HARRISON PARKWAY, VALENCIA, CA 91355-4162

Tel: (800) TAITRON (800) 247-2232 (661) 257-6060 Fax: (800) TAITFAX (800) 824-8329 (661) 257-6415 Email: taitron@taitroncomponents.com Http://www.taitroncomponents.com TAITRON COMPONENTS MEXICO, S.A .DE C.V. BOULEVARD CENTRAL 5000 INTERIOR 5 PARQUE INDUSTRIAL ATITALAQUIA, HIDALGO C.P. 42970 MEXICO Tel: +52-55-5560-1519 Fax: +52-55-5560-2190 Rev. A/LL www.taitroncomponents.com Page 9 of 9