TSL9A12 TSC | Alldatasheet
Document overview
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Technical content
1 Version: A2402
200mA, 6V, Nanopower IQ 600nA, Low-Dropout Linear Regulator with Enable
DESCRIPTION
The TSL9A12 series are ultra-low quiescent current regulator features low dropout voltage and low current in the standby mode. With 600nA quiescent current at no load . T he TSL9A12 series is ideally suited for standby micro -control-unit systems, especially for always-on applications like portable, and other battery - operated systems. The TSL9A12 series retains all the features that are common to low dropout regulators including a low dropout PMOS pass device, short circuit protection, and thermal shutdown.
FEATURES
- Input voltage up to 6V
- Fixed output voltages 1.8V and 3.3V
- Ultra-low quiescent current 600nA (typ.)
- Output voltage accuracy 2%
- Dropout voltage 400mV @ IO: 200mA (VOUT=3.3V)
- Stable with ceramic capacitors
- Current limit protection
- Over temperature protection
- RoHS Compliant
- Halogen-Free APPLICATION
- Portable, Battery powered equipment
- Low power microcontrollers
- Wireless communication equipment SOT-23 Pin Definition: 1. Ground 2. Output 3. Input SOT-25 Pin Definition: 1. Input 2. Ground 3. Enable 4. NC 5. Output Notes: MSL 1 (Moisture Sensitivity Level) per J-STD-020 TYPICAL APPLICATION CIRCUIT OFF ON VIN EN GND VOUT VIN EN TSL9A12 VOUT 1μF 4.7μF
2 Version: A2402
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted) PARAMETER SYMBOL LIMIT UNIT Input voltage (VIN to GND) VIN -0.3 ~ 6 V Recommended operating conditions VIN ~ 6 V Junction temperature range TJ -40 ~ +125 °C Operating temperature ambient range TA -40 ~ +105 °C Storage temperature range TSTG -55 ~ +150 °C ESD HBM 2 kV CDM 1 kV Notes: Stress above the listed absolute rating may cause permanent damage to the device. THERMAL PERFORMANCE (Note 2) PARAMETER SYMBOL TYP UNIT SOT-23 SOT-25 Thermal resistance junction to ambient RθJA 260 220 °C/W Thermal resistance junction to case RθJC 120 95 °C/W ELECTRICAL SPECIFICATIONS (VIN = VOUT +1V, IO=1mA, TA = 25°C unless otherwise noted) PARAMETER CONDITIONS SYMBOL MIN TYP MAX UNIT Output voltage VOUT 1.8V VIN = VOUT+1V, IO = 1mA VOUT 1.764 -- 1.836 V VOUT 3.3V 3.234 3.366 Line regulation VIN = VOUT+1V ~ 5.5V, ΔVOUT,li -- -- 2 % Load regulation VOUT 1.8V 1mA < ILOAD ≤ 200mA ΔVOUT,lo -- -- 2.5 VOUT 3.3V -- -- 2 Quiescent current VIN = VEN, Io = 0mA IQ -- 0.6 1.2 μA Current limit ICL 350 -- -- mA Dropout voltage VOUT = 1.8V Io = 100mA VDROPOUT -- 215 304 mV Io = 150mA -- 320 456 Io = 200mA -- 425 607 VOUT = 3.3V Io = 100mA -- 160 280 mV Io = 150mA -- 300 430 Io = 200mA -- 400 575 Enable threshold voltage Enable high VEN_HI 1 -- -- V Enable low VEN_LO -- -- 0.2 Thermal shutdown TSD -- 150 -- °C Power supply rejection ratio Io = 5mA, f = 100Hz PSRR -- 60 -- dB Note: 1. Stresses listed as the above “Absolute Maximum Ratings” may cause permanent damage to the device. These are for stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may remain possibility to affect device reliability. 2. Devices are ESD sensitive. Handing precaution recommended. 3. The device is not guaranteed to function outside its operating conditions.
3 Version: A2402
ORDERING INFORMATION
OUTPUT VOLTAGE ORDERING CODE PACKAGE PACKING 1.8V TSL9A12V18CX RFG SOT-23 3,000pcs / 7” Reel 3.3V TSL9A12V33CX RFG SOT-23 3,000pcs / 7” Reel 1.8V TSL9A12V18CX5 RFG SOT-25 3,000pcs / 7” Reel 3.3V TSL9A12V33CX5 RFG SOT-25 3,000pcs / 7” Reel
4 Version: A2402
APPLICATION INFORMATION
Input-Output capacitor requirements The external input and output capacitors of TSL9A12 series must be properly selected for stability and performance. Use a 1μF or larger input capacitor and place it close to the IC's VIN and GND pins. Any output capacitor meeting the minimum 1mΩ ESR (Equivalent Series Resistance) and effective capacitance between 1μF and 22μF requirement may be used. Place the output capacitor close to the IC's VOUT and GND pins. Increasing capacitance and decreasing ESR can improve the circuit's PSRR and line transient response. Dropout voltage The TSL9A12 series use a PMOS pass transistor to achieve low dropout. When (VIN – VOUT) is less than the dropout voltage (VDROP), the PMOS pass device is in the linear region of operation and the input -to-output resistance is the RDS(ON) of the PMOS pass element. V DROP scales approximately with the output current because the PMOS device behaves as a resistor in dropout condition. As any linear regulator, PSRR and transient response are degraded as (VIN – VOUT) approaches dropout condition. Over Temperature Protection The over temperature protection function of TSL9A12 series will turn off the P -MOSFET when the junction temperature exceeds 150°C (typ.). Once the junction temperature cools down by approximately 15°C, the regulator will automatically resume operation Thermal Application For continuous operation, do not exceed the absolute maximum junction temperature. The maximum power dissipation depends on the thermal resistance of the IC package, PCB layout, rate of surrounding airflow, and difference between junction and ambient temperature. The maximum power dissipation can be calculated as below: PD(MAX) = (TJ(MAX)−TA) / (R θJA) where T J(MAX) is the maximum allowable junction temperature, and T A is the ambient temperature suitable in application. Power dissipation (PD) is equal to the product of the output current and the voltage drop across the output pass element, as shown in the equation below: PD = (VIN – VOUT) × IOUT.
5 Version: A2402
Figure 1. Dropout Voltage vs. Output Current Figure 2. Dropout Voltage vs. Output Current Figure 3. Dropout Voltage vs Input Voltage Figure 4. Dropout Voltage vs Input Voltage Figure 5. Quiescent Current vs Ambient Figure 6. Ground Current vs Load Current
6 Version: A2402
Figure 7. Output Voltage vs Input Voltage Figure 8. Shutdown Current vs Ambient Figure 9. Enable Voltage vs Input Voltage Figure 10. Output Voltage vs Ambient Temperature Figure 11. Output Voltage vs Output Current Figure 12. Output Voltage vs Output Current
7 Version: A2402
Figure 13. Start-up with VEN = VIN Figure 14. Output Noise vs. Frequency Figure 15. IOUT Transient 0mA to 200mA
8 Version: A2402
PACKAGE OUTLINE DIMENSIONS SOT-23 NOTES: UNLESS OTHERWISE SPECIFIED 1. ALL DIMENSIONS ARE IN MILLIMETERS. 2. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994. 3. PACKAGE OUTLINE REFERENCE: EIAJ ED-7500A, SC-59.
4 MOLDED PLASTIC BODY DIMENSIONS DO
NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. 5. DWG NO. REF: HQ2SD07-SOT23IC-104 REV A. SUGGESTED PAD LAYOUT 1 2 32.35 0.95 0.85 0.85 MARKING DIAGRAM B 1.70 1.404
0.20 C A B
0.50 0.350.95 1.90 (3X) (3X) 3.10 2.80A 0.10 C C 0.20 0.10 DETAIL A 0.10 0.00 1.30 1.001.20 1.00 SEATING PLANE C0.60 0.30 0.25 GAUGE PLANE (0.65) DETAIL A, ROTATED -90° (SCALE 2:1) 3.00 2.60 P/N = PRODUCT DEVICE CODE Y = YEAR CODE M = MONTH CODE FOR HALOGEN FREE PRODUCT O =JAN P =FEB Q=MAR R = APR S =MAY T =JUN U=JUL V = AUG W =SEP X =OCT Y=NOV Z = DEC L = LOT CODE P/N YML Device code: C Voltage code: D (1.8V), S (3.3V)
9 Version: A2402
PACKAGE OUTLINE DIMENSIONS SOT-25 B SUGGESTED PAD LAYOUT A 3.00 2.60 1.80 1.40 NOTES: UNLESS OTHERWISE SPECIFIED 1. ALL DIMENSIONS ARE IN MILLIMETERS. 2. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994. 3. PACKAGE OUTLINE REFERENCE: JEDEC MO-178, VARIATION AA. NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. 5. DWG NO. REF: HQ2SD07-SOT25-026 REV A. MARKING DIAGRAM 3.10 2.70 0.50 0.300.95 1.90 1 3 P/N YML 0.25 0.10 C DETAIL A, ROTATED -90° (SCALE 2:1) GAUGE PLANE (0.60) P/N = PRODUCT DEVICE CODE Y = YEAR CODE M = MONTH CODE FOR HALOGEN FREE PRODUCT O =JAN P =FEB Q=MAR R = APR S =MAY T =JUN U=JUL V = AUG W =SEP X =OCT Y=NOV Z = DEC L = LOT CODE DETAIL A 0.15 0.00 1.30 0.90 SEATING PLANE C0.60 0.30 1 3 2.35 0.95 1.00 0.70 0.22 0.08 1.45 0.90 Device code: C Voltage code: D (1.8V), S (3.3V)
10 Version: A2402
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