SD56120_06 STMICROELECTRONICS | Alldatasheet

Document overview

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  • PDF pages: 15

Technical content

Datasheet sections

  • 1 Electrical data
  • 1.1 Maximum ratings
  • 1.2 Thermal data
  • 2 Electrical characteristics
  • 2.1 Static
  • 2.2 Dynamic
  • 3 Impedances
  • 4 Typical performance
  • 5 Test circuit
  • 6 Package mechanical data
  • 7 Revision history

RF POWER Transistors, LDMOST plastic family N-Channel enhancement-mode lateral MOSFETs General features ■ Excellent thermal stability ■ Common source configuration Push-pull ■ POUT = 100W with 14dB gain @ 860MHz ■ BeO free package

Description

The SD56120 is a common source N-Channel enhancement-mode lateral Field-Effect RF power transistor designed for broadband commercial and industrial applications at frequencies up to 1.0GHz. The SD56120 is designed for high gain and broadband performance operating in common source mode at 28 V. It is ideal for broadcast applications from 470 to 860 MHz requiring high linearity. Pin connection M246 Epoxy sealed 1-2 Drain 4-5 Gate

3 Source

Part number Package Branding SD56120 M246 TSD56120

1 Electrical data

1.1 Maximum ratings

1.2 Thermal data

Table 1. Absolute maximum ratings (TCASE = 25°C) Table 2. Thermal data

2 Electrical characteristics

2.1 Static

2.2 Dynamic

Table 3. Static (per section) Table 4. Dynamic

3 Impedances

Figure 1. Current conventions Note: Measured drain to drain and gate to gate respectively. Table 5. Impedance data

4 Typical performance

Figure 2. Capacitance vs drain voltage Figure 3. Gate-source voltage vs case Figure 4. Drain current vs gate voltage Figure 5. Output power vs input power

5 Test circuit

Figure 13. 860MHz test circuit schematic Note: 1 Dimensions at component symbols are reference for component placement.

Table 6. 860MHz test circuit component part list

6 Package mechanical data

In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com

Figure 16. Package dimensions Table 7. M246 (.230 x .650 WIDE 4/L BAL N/HERM W/FLG) mechanical data

7 Revision history

Table 8. Revision history