TSD3GFSH TSC | Alldatasheet

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Technical content

TSD3GFSH – TSD3JFSH Taiwan Semiconductor

1 Version: B2312

3A, 400V - 600V ESD Capability Rectifier

FEATURES

  • AEC-Q101 qualified
  • High ESD capability
  • Glass passivated chip junction
  • Low forward voltage drop
  • Ideal for automated placement
  • Moisture sensitivity level: level 1, per J-STD-020
  • RoHS Compliant
  • Halogen-free

APPLICATIONS

  • General purpose
  • Polarity protection MECHANICAL DATA
  • Case: SOD-128
  • Molding compound meets UL 94V-0 flammability rating
  • Terminal: Matte tin plated leads, solderable per J-STD-002
  • Meet JESD 201 class 2 whisker test
  • Polarity: Indicated by cathode band
  • Weight: 0.028g (approximately) KEY PARAMETERS PARAMETER VALUE UNIT IF 3 A VRRM 400 - 600 V IFSM 50 A TJ MAX 175 °C Package SOD-128 Configuration Single die SOD-128 ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted) PARAMETER SYMBOL TSD3GFSH TSD3JFSH UNIT Marking code on the device D3GFS D3JFS Repetitive peak reverse voltage VRRM 400 600 V Reverse voltage, total rms value VR(RMS) 280 420 V Forward current IF 3 A Surge peak forward current single half sine-wave superimposed on rated load t = 8.3ms IFSM A t = 1.0ms 145 Junction temperature TJ -40 to +175 °C Storage temperature TSTG -55 to +175 °C

TSD3GFSH – TSD3JFSH Taiwan Semiconductor

2 Version: B2312

Junction-to-lead thermal resistance RӨJL 15 °C/W Junction-to-ambient thermal resistance RӨJA 70 °C/W Junction-to-case thermal resistance RӨJC 15 °C/W Thermal Performance Note: Units mounted on PCB (5mm x 5mm Cu pad test board) ELECTRICAL SPECIFICATIONS (TA = 25°C unless otherwise noted) PARAMETER CONDITIONS SYMBOL TYP MAX UNIT Forward voltage(1) IF = 1.5A, TJ = 25°C VF 0.90 - V IF = 3.0A, TJ = 25°C 0.96 1.1 V IF = 1.5A, TJ = 125°C 0.78 - V IF = 3.0A, TJ = 125°C 0.85 - V Reverse current @ rated VR(2) TJ = 25°C IR - 1 µA TJ = 125°C 6 - µA Junction capacitance 1MHz, VR = 4.0V CJ 18 - pF Notes: 1. Pulse test with PW = 0.3ms 2. Pulse test with PW = 30ms IMMUNITY TO ELECTRICAL STATIC DISCHARGE TO THE FOLLOWING STANDARDS (TA = 25°C unless otherwise noted) STANDARD TEST TYPE TEST CONDITIONS SYMBOL CLASS VALUE AEC-Q101-001 Human body mode C=100pF, R=1.5kΩ Vc H3B ≥8kV IEC 61000-4-2 Contact mode C=150pF, R=330Ω x ≥10kV Air-discharge mode C=150pF, R=330Ω 4 ≥15kV ISO 10605 Contact mode C=330pF, R=330Ω L4 ≥15kV

ORDERING INFORMATION

ORDERING CODE(1) PACKAGE PACKING TSD3xFSH SOD-128 14,000/ Tape & Reel Notes: 1. “x” defines voltage from 400V(TSD3GFSH) to 600V(TSD3JFSH)

TSD3GFSH – TSD3JFSH Taiwan Semiconductor

3 Version: B2312

(TA = 25°C unless otherwise noted) Fig.1 Forward Current Derating Curve Fig.2 Typical Junction Capacitance Fig.3 Typical Reverse Characteristics Fig.4 Typical Forward Characteristics Fig.5 Typical Transient Thermal Impedance 0 25 50 75 100 125 150 175 100 1 10 100 f=1.0MHz Vsig=50mVp-p 0.001 0.01 0.1 100 10 20 30 40 50 60 70 80 90 100 TJ=25°C TJ=125°C TJ=150°C TJ=175°C 0.1 Pulse width 300μs 1% duty cycle TJ=25°C TJ=125°C TJ= -40°C TJ=150°C TJ=175°C 0.0001 0.001 0.01 0.1 100 CAPACITANCE (pF) INSTANTANEOUS REVERSE CURRENT (μA) PERCENT OF RATED PEAK REVERSE VOLTAGE (%) INSTANTANEOUS FORWARD CURRENT (A) (A) FORWARD VOLTAGE (V) AVERAGE FORWARD CURRENT (A) REVERSE VOLTAGE (V) LEAD TEMPERATURE (°C) PULSE DURATION (s) TRANSIENT THERMAL IMPEDANCE (°C/W)

TSD3GFSH – TSD3JFSH Taiwan Semiconductor

4 Version: B2312

PACKAGE OUTLINE DIMENSIONS SOD-128 P/N = MARKING CODE YW = DATE CODE F = FACTORY CODE MARKING DIAGRAM SUGGESTED PAD LAYOUT 1.10 0.90 0.10 0.00 0.22 0.10 CSEATING PLANE DETAIL A (SCALE 3:1) 4.00 3.60 B 2.70 2.30 A DETAIL A C 0.80 0.40 1.90 1.60 5.00 4.40 4.10 1.20 2.30 YWF P/N CATHODE INDICATOR

0.13 C A B

NOTES: UNLESS OTHERWISE SPECIFIED 1. ALL DIMENSIONS ARE IN MILLIMETERS. 2. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-2009. 3. PACKAGE OUTLINE REFERENCE: JEDEC DO-221, VARIATION AD, ISSUE B.

4 MODED PLASTIC BODY DIMENSIONS DO NOT

INCLUDE MOLD FLASH. 5. DWG NO. REF: HQ2SD07-SOD128-039 REV A. 0.60 0.30

TSD3GFSH – TSD3JFSH Taiwan Semiconductor

5 Version: B2312

Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Purchasers are solely responsible for the choice, selection, and use of TSC products and TSC assumes no liability for application assistance or the design of Purchasers’ products. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life -saving, or life -sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale.