TVS-TSD12U SPSEMI | Alldatasheet

Document overview

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Technical content

Features

For surface mounted applications in order to optimize board space Pb-free plated Peak Power is 1800W@1ms ESD Rating of Class X (> 15 kV) (IEC6100-4-2) Response Time is Typically<1 ns Low profile package Typical I R less than 1µA above 10V Low inductance Excellent clamping capability AEC-Q101 TSD(1800W) Series

Applications

Low frequency signal transmission line (RS232, RS485, etc.) Mechanical Characteristics Case: JEDEC DO-214AB. Molded plastic over glass passivated junction Terminal: Solderable per MIL-STD-750, Method 2026 Polarity: Color band denoted positive end (cathode) except Bidirectional Standard Packaging: 16mm tape (EIA STD RS-481) Weight: 0.007 ounce, 0.21 gram Maximum Ratings And Characteristics Ratings at 25 ℃ ambient temperature unless otherwise specified. Notes : 1.Non-repetitive current pulse , per Fig. 3 and derated above TA = 25 ℃ per Fig. 2 . 2.Mounted on 8.0mm x 8.0mm Copper Pads to each terminal 3.8.3ms single half sine-wave , or equivalent square wave, Duty cycle = 4 pulses per minutes maximum. Peak Pulse Power Dissipation on 10/1000µs waveform Peak Forward Surge Current,8.3ms Single Half Sine-Wave Superimposed on Rated Load,(JEDEC Method) (Note2,3) Operating junction and Storage Temperature Range RATING SYMBOL VALUE UNITS PPPM IFSM TJ , TSTG Minimum 1800 -55 to +150 200 Watts Amps Functional Diagram Bi-directional Uni-directional Cathode Anode .. .REV 2016 08 10

瞬 雷 电 子 S P S E M I www.spsemi.cn Page 2 of 5 Dimensions (DO-214AB) TSD(1800W) Series

Electrical Characteristics

DO-214AB(SMC J-Bend) TSD6.0U TSD8.0U TSD12U TSD15U TSD16U TSD20U TSD22U TSD26U TSD28U TSD30U TSD33U TSD36U TSD40U TSD58U TSD60U TSD150U TSD170U TSD Part Number Device Marking Code Reverse Stand-Off Voltage VRWM(V) VBR(V)Min. VBR(V)Max. Test Current IT(mA) Maximum Clamping Voltage @Ipp Vc(V) Peak Pulse Current Ipp(A) Reverse Leakage @VRWM IR(μA)UNI-Polar UNIBI-Polar BI GDG GDR GEE GEM GEP GEV GEX GFE GFG GFK GFM GFP GFR GGG GGK GHM GHR BDG BDR BEE BEM BEP BEV BEX BFE BFG BFK BFM BFP BFR BGG BGK BHM BHR 6.0 8.0 12.0 15.0 16.0 20.0 22.0 26.0 28.0 30.0 33.0 36.0 40.0 58.0 60.0 150.0 170.0 6.67 8.89 13.30 16.70 17.80 22.20 24.40 28.90 31.10 33.30 36.70 40.00 44.40 64.40 66.70 167.00 189.00 7.37 9.83 14.70 18.50 19.70 24.50 26.90 31.90 34.40 36.80 40.60 44.20 49.10 71.20 73.70 185.00 209.00 10.3 13.6 19.9 24.4 26.0 32.4 35.5 42.1 45.4 48.4 53.3 58.1 64.5 93.6 96.8 243.0 275.0 174.8 132.4 90.5 73.8 69.2 55.6 50.7 42.8 39.6 37.2 33.8 31.0 27.9 19.2 18.6 7.4 6.5 200 Breakdown Voltage @IT TSD6.0B TSD8.0B TSD12B TSD15B TSD16B TSD20B TSD22B TSD26B TSD28B TSD30B TSD33B TSD36B TSD40B TSD58B TSD60B TSD150B TSD170B For bidirectional type having VWRM of 10 volts and less, the IR limit is double. .. .REV 2016 08 10 0.126 3.20() 0.112 2.85() 0.280(7.11) 0.260(6.60) 0.245(6.22) 0.220(5.60) Cathode Band 0.118(3.00) 0.081(2.06) 0.329 8.35() 0.305 7.75() 0.067 1.70() 0.030 0.76() Dimensions in inches and(millimeters) 0.012 0.305() 0.006 0.152() 0.012(0.3)MAX.

瞬 雷 电 子 S P S E M I www.spsemi.cn Page 3 of 5 TSD(1800W) Series Ratings And Characteristic Curves(TA=25℃ Unless otherwise noted) Fig.1 Peak Pulse Power Rating Fig.2 Pulse Derating Cruve I-V Curve Characteristics Uni-directional Bi-directional IPP IR IT VC VBR VRWM IPP IR IT VCVBRVRWM V IPP IR IT VC VBR VRWM VF V Fig.3 Pulse Waveform Fig.4 Typical Junction Capacitance 00 1.0 2.0 4.03.0 10/1000μsec.Waveform as defined by R.E.A Half Value IPPM tr=10uS Peak Value IPPM TJ=25℃ Pulse width(td) is defined ad the Point where the Peak Current Decays to 50% of IPPM 100 150 IPPM-Peak Pulse Current(%) IRSM t-Time(mS) td 0 25 50 75 100 125 150 175 200 100 TA-Ambient Temperature(℃) Peak Pulse Power(PPP) or Current(IPPM) Derating in Percentage,% Copper Pad Areas PPPM-Peak Pulse Power (kW) 0.1μs 10μs 10ms 0.1 100 td - Pulse Width (sec.) 1.0μs 100μs 1.0ms Non-repetitive pulse waveform shown in Fig.3 TA = 25°C CJ-Junction Capacitance(pF) 1 10 10010 100 1000 20000 VWM-Reverse Stand-off Voltage(V) 400 VR,Measured at Stand-Off Voltage,VWM TJ=25℃ f=1.0MHZ Vsig=50mVp-p Uni-Directional Bi-Directional Measured at Zero Bias 10000 .. .REV 2016 08 10

瞬 雷 电 子 S P S E M I www.spsemi.cn Page 4 of 5 TSD(1800W) Series Ratings And Characteristic Curves Fig.5 Typ.Transient Thermal Impedance Fig.6 Maximum Non-Repetitive Peak Forward Surge Current Uni-Directional Only Recommended Soldering Conditions Recommended Conditions Reflow Soldering ts tP tL Time time to peak temperature (t 25℃ to peak) Temperature Ts(min) Ts(max) TL TP Preheat Ramp-down Ramp-up Critical Zone TL to TP Re”ow Condition Pb-Free assembly (see Fig.1) Pre Heat -Temperature Min(T s(min) ) -Temperature Max(T s(max) ) -Time(Min to Max)(t s) Average ramp up rate (Liquidus Temp(T L) to peak) Ts(max) to TL -Ramp-up Rate Re”ow -Temperature(T L)(Liquidus) -Temperature(t L) Peak Temp(T P) Time within 5 ℃ of actual Peak Temp(t P) Ramp-down Rate Time 25 ℃ to Peak Temp(T P) Do not exceed +150 ℃ +200 ℃ 60-180secs 3℃/sec.Max. 3℃/sec.Max. +217 ℃ 60-150secs +260(+0/-5) ℃ 30 secs.Max. 6℃/sec.Max. 8 min.Max. +260 ℃ 0.001 0.1 0.1 1 100010 1.0 100 Transient Thermal Impedance(C/W) tp-Pulse Duration(sec) 0.01 100 Marking Code Cathode Band GDG ** Marking Code Logo Date Code BDG ** Marking Code Logo Date Code Peak Forward Surge Current(A) 10 100 100 200 Number of Cycles at 60H Z 8.3mS single half sine-wave (JEDEC Method) TJ=TJ max. .. .REV 2016 08 10

瞬 雷 电 子 S P S E M I www.spsemi.cn Page 5 of 5 TSD(1800W) Series Packing Options And Reel Specification-DO-214AB 0.157 (4.0) 0.63 (16.0) 0.315 (8.0) 0.65 (16.4) Symbol Ea Per Reel REEL DIA (mm) Industry Standard TSD*** 500 178 EIA RS-481 7.0(178) .. .REV 2016 08 10