A8DB101150 PMI | Alldatasheet

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27111 Aliso Creek Road, Suite 175

Aliso Viejo, California 92656 Phone: (714) 362-4211 Fax: (714) 362-4212 MP Premier Magnetics Inc. Specifications subject to change without notice. ETHERNET / CHEAPERNET LAN COUPLING TRANSFORMERS

FEATURES

˚ Designed to meet IEEE 802.3 (10 Base 2, 10 Base 5) ˝ Fast Rise Times ¸ Low Profile DIP or SMD Package ˛ 500 or 2000Vrms Minimum Isolation Ì Low Leakage Inductance and Winding Capacitance ˇ Triple Core Package PRIMARY OCL (µµµµµH – 20%) DCR (Ohms Max.) HIPOT Vrms Min. PRIMARY ET CONSTANT (V-µµµµµsec Min.) PRI / SEC LL (µµµµµH Max.) PRI-SEC Cw/w (pf Max.) RISE TIME (ns Max.) ELECTRICAL SPECIFICATIONS AT 25OC PER CORE TURNS RATIO (– 5%) PART NUMBER PHYSICAL DIMENSIONS .... DIMENSIONS IN INCHES (mm) NOTE: For Gull Wing Package Change "D8" to "G8" "D8" PACKAGESCHEMATIC DIAGRAM "B" "G8" PACKAGE"A8" PACKAGE .300 (7.62) .340 (8.64) .008R (0.20) .010 (0.25) .280 (7.11) MAX .120 (3.05) MIN .200 (5.08) MAX .020 (.51) .010 (.25) .100 (2.54) TYP .020 (0.51) TYP .050 (1.27) TYP .880 (22.35) MAXPIN#1 DOT .200 (5.08) MAX .020 (.51) .010 (.25) .100 (2.54) TYP .020 (0.51) TYP .050 (1.27) TYP .880 (22.35) MAXPIN#1 DOT FLAT .010 (0.25) TYP.425 (10.80) .390 (9.90) .030 (0.76) .020 (0.51) .008R (0.20) .280 (7.11) MAX 91216 15 7 15 13 10 428 PRI. SEC. SEC. SEC. PRI. PRI. 14 11 .900 (22.86) MAX .100 (2.54) .120 (3.05) MIN .250 (6.35) MAX .700 (17.78) .020 (0.51) .400 (12.70) MAX .300 (7.62) DIA PIN#1 DOT

Aliso Viejo, California 92656 Phone: (714) 362-4211 Fax: (714) 362-4212 MP Premier Magnetics Inc. Specifications subject to change without notice. .010 (0.25) TYP .370 (9.40) (0.48) TYP .050 (1.27) TYP .210 (5.33) MAX .280 (7.11) MAX .460 (11.68) MAX PIN#1 WHITE DOT .010 (.25) .004 (.10) 12345678 16 15 14 13 12 11 10 9 ETHERNET / CHEAPERNET LAN COUPLING TRANSFORMERS PRIMARY OCL (µµµµµH Min) DCR (ΩΩΩΩΩ Max) PRI / SEC PRIMARY ET CONSTANT (V-µµµµµsec Min) PRI LL (µµµµµH Max) PRI / SEC Cw/w (pf Max) RISE TIME (ns Max.) ELECTRICAL SPECIFICATIONS AT 25OC PER CORE TURNS RATIO (– 5%) PART NUMBER SCHE- MATIC HIPOT Vrms Min MP TSD-XXX YYWW PHYSICAL DIMENSIONS .... IN INCHES (mm) "G1" PACKAGE FIGURE 3: RECOMMENDED PCB LAYOUT DIMENSION IN INCHES, (mm) VARIATIONS AVAILABLE. FOR INTERMEDIATE VALUES AND/ OR CUSTOM DESIGNS PLEASE CONSULT THE FACTORY. SCHEMATIC DIAGRAM "B" ˚ Designed to meet IEEE 802.3 (10 Base 2, 10 Base 5) ˝ Fast Rise Times ¸ Low Profile soic Type SMD Package ˛ 2000Vrms Minimum Isolation Ì Low Leakage Inductance and Winding Capacitance ˇ Triple Core Package 91216 15 7 15 13 10 428 PRI. SEC. SEC. SEC. PRI. PRI. 14 11 1 16 8 9