TSB42AB4 TI | Alldatasheet
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(ceLynx) IEEE 1394-a Consumer Electronics Link Layer Controller 8K-byte FIFO supports the following data types: DTCP content protection (TSB42AA4 only). A separate document explains the DTCP DVB MPEG2 transport streams (IEC hardware errata for TSB42AA4. It is available 61883-4) upon request to DTLA licensees only. DirecTV transport streams Interfaces directly to industry standard 400-, DV program streams (IEC 61883-2) 200-, and 100-Mbps physical layer devices, Asynchronous streams including Texas Instruments TSB41LV0X and Support for external processor DMA TSB41AXX family of physical layer devices Programmable data-/space-available Compliant with IEEE 1394-1995 and IEEE indications for flow control; almost full and 1394a 2000 standards almost empty indicators MPEG2 time stamp-based release, as Supports bus manager functions and described in IEC 61883-4 automatic 1394 self-ID verification High-speed data interface (HSDI): Interrupt driven to minimize host polling Byte-wide or serial mode Single 3.3-V supply Two independent HSDI ports Separate async acknowledge buffer Bidirectional decreases the ack-tracking burden on host Several control modes for a variety of JTAG interface to support post-assembly
applications
protection: Motorola 68000/68020-style bus Two baseline ciphers (one per HSDI Large 8K-byte FIFO can be configured up to port) eight independent Tx or Rx FIFOs Random number generator in hardware SHA-1 secure hash algorithm in hardware Authentication key cipher in hardware Optional auto-configuration for MPEG2/DV transmit and receive functions PID filtering and packet insertion for MPEG2 transport stream Consumer Electronics Link (ceLynx) is a high-performance 1394 link layer device designed specifically to support advanced consumer electronics applications, particularly those (MPEG2) transport streams and encryption/decryption of those streams across a 1394 network. The device supports both digital video broadcasting (DVB) and DirecTV type MPEG2 streams using the digital transmission content protection method (DTCP) method of encryption, as well as digital video (DV) encoded streams. The ceLynx supports both the IEC 61883 standard for DVB and DV streams over 1394 and the 1394 Trade Association standard for DirecTV over 1394. Please be aware that an important notice concerning availability, standard warranty, and use in critical sheet. DirecTV is a trademark of Hughes Communications, Inc.. PRODUCTION DATA information is current as of publication date. Copyright 2006, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
www.ti.com TSB42AA4 TSB42AA4I TSB42AB4 TSB42AB4I SLLA217 JUNE 2006 The ceLynx is also versatile enough to handle asynchronous data and asynchronous streams. A key feature of the ceLynx is its ability to handle multiple data type streams simultaneously; the user may transport DVB, DirecTV, DV data streams, and asynchronous data simultaneously The ceLynx can also support multiple streams of the same data type simultaneously, (for example, transmit or receive two DVB transport streams or two DV streams). The ceLynx is full duplex, allowing simultaneous playback and recording of audio/video data. Full duplex support also includes the capability of using the DTCP method, simultaneously using the two embedded cipher modules. The large internal 8-Kbyte FIFO is very flexible, allowing the user to partition it into eight independent first in first out (FIFOs) and allowing the user to determine the exact configuration of each of these FIFOs to fit the application. Advanced (PID) filtering and packet insertions. The ceLynx is also designed to interface seamlessly with popular MPEG2 decoder chipsets. This decreases the design-in effort of customers when using these popular chipsets. NOTE: This product is for high-volume CE only. For a complete datasheet or more information contact support@ti.com. Submit Documentation Feedback
www.ti.com 23-May-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) TSB42AB4PDT Active Production TQFP (PDT) | 128 90 | JEDEC TRAY (5+1) Yes NIPDAU Level-3-260C-168 HR 0 to 70 TSB42AB4 F731992D TSB42AB4PDT.A Active Production TQFP (PDT) | 128 90 | JEDEC TRAY (5+1) Yes NIPDAU Level-3-260C-168 HR 0 to 70 TSB42AB4 F731992D (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1
PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2025 TRAY L - Outer tray length without tabs KO - Outer tray height W - Outer tray width P1 - Tray unit pocket pitch CW - Measurement for tray edge (Y direction) to corner pocket center CL - Measurement for tray edge (X direction) to corner pocket center Text Chamfer on Tray corner indicates Pin 1 orientation of packed units. *All dimensions are nominal Device Package Name Package Type Pins SPQ Unit array matrix Max temperature (°C) L (mm) W (mm) (µm) (mm) CL (mm) CW (mm) TSB42AB4PDT PDT TQFP 128 90 6 X 15 150 315 135.9 7620 15.4 20.3 21 TSB42AB4PDT.A PDT TQFP 128 90 6 X 15 150 315 135.9 7620 15.4 20.3 21 Pack Materials-Page 1
www.ti.com PACKAGE OUTLINE C 128X 0.23 0.13124X 0.4 PIN 1 ID
0.05 MIN
4X 12.4 16.1
15.9 TYP
(0.13) TYP B14.05 13.95 A 14.05 13.95 0.75 0.45 0.25 GAGE PLANE 0 -5
1.2 MAX
(1) PLASTIC QUAD FLATPACK TQFP - 1.2 mm max heightPDT0128A PLASTIC QUAD FLATPACK 4215171/A 10/2023 0.08 C NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 33 64 97128
0.05 C A B
SCALE: 12 DETAIL A TYPICAL SCALE 1.000
www.ti.com EXAMPLE BOARD LAYOUT
0.05 MAX
128X (1.45) 128X (0.2) (15.35) (15.35) 124X (0.4) (R0.05) TYP TQFP - 1.2 mm max heightPDT0128A PLASTIC QUAD FLATPACK 4215171/A 10/2023 NOTES: (continued) 3. Publication IPC-7351 may have alternate designs. 4. Solder mask tolerances between and around signal pads can vary based on board fabrication site. 5. For more information, see Texas Instruments literature numbers SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004). LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:6X SYMM SYMM 128 97 33 64 SEE DETAILS METAL SOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDER MASK DETAILS EXPOSED METAL SOLDER MASK METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL
www.ti.com EXAMPLE STENCIL DESIGN (15.35) 124X (0.4) 128X (1.45) 128X (0.2) (15.35) (R0.05) TYP TQFP - 1.2 mm max heightPDT0128A PLASTIC QUAD FLATPACK 4215171/A 10/2023 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 7. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON 0.1 mm THICK STENCIL SCALE:6X SYMM SYMM 128 97 33 64
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