TSA6057 PHILIPS | Alldatasheet
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Technical content
Philips Semiconductors Product specification SS Radio tuning PLL frequency synthesizers TSA6057; TSA6057T FEATURES Ss ¢ On-chip AM and FM prescalers with high input 4 ee a | sensitivity le) * On-chip high performance one input (two output) tuning ri ry voltage amplifier for the AM and FM loop filters BUS * On-chip 2-level current amplifier (charge pump) to adjust the loop gain GENERAL DESCRIPTION © Only one reference oscillator (4 MHz) for both The TSA6057 is a bipolar single chip frequency AM and FM synthesizer manufactured in SUBILO-N technology ¢ High speed tuning due to a powerful digital memory (components laterally separated by oxide). It performs all phase detector the tuning functions of a PLL radio tuning system. The IC 40 kHz output reference frequency forco-operation with designed for application in all types of radio receivers. the FM/IF system and microcomputer-based tuning interface IC (TEA6100) * Oscillator frequency ranges of: 512 kHz to 30 MHz and 30 to 150 MHz * 3 selectable reference frequencies of 1, 10 or 25 kHz for both tuning ranges * Serial 2-wire I?C-bus interface to a microcontroller and one programmable address input * Software controlled band switch output.
ORDERING INFORMATION
NUMBER | NAME | DESCRIPTION VERSION DIP16 plastic dual in-line package; 16 leads (300 mil); long body TSA6057T plastic small outline package; 16 leads; body width 7.5 mm SOT162-1
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Philips Semiconductors Product specification Radio tuning PLL frequency synthesizers TSA6057; TSA6057T QUICK REFERENCE DATA SYMBOL PARAMETER conpitions | min. | TyP. | MAX. | UNIT [Vos [ppv wolage Ts pin [es feo fas fv _| [Voce | suppl voltage 2: pin 16 ee lece supply current 2; pin 16 version C1 0.2 1 mA version C8 0.7 1.5 mA [iawny [maximum input requeney ona | «dia |_| _ [Me | input votage on AMA (RMS value) __[Vew=0V 30 |-__|00_[mv_| [Pix [etal power cesiation CC fesionce [0 [frase]
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Philips Semiconductors Product specification Radio tuning PLL frequency synthesizers TSA6057; TSA6057T BLOCK DIAGRAM a 22 oe 6 85 $5 Bes Sy 2s H $2. 885 9 322 of G82 a6 P| i 3 rm 2 tt i tT z¥8 iss ork B32 Eg z & 35 5 aS 38 338 36 3 i a "go BSE 8 = i 458 g i) & ira i x | §5 98 na TIL, 82 qe BF BS fesse oF 2 bs 2 a 33
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Philips Semiconductors Product specification Radio tuning PLL frequency synthesizers TSA6057; TSA6057T PINNING syMBoL| PIN | DESCRIPTION XTAL1 [1 | reference oscillator output XTAL2 reference oscillator input U0 [Voor | 3 | positive supply voltage 1 xrali [i] Voce FM VCO input Veer Loop; ANI VCO input one] TEAST Fas band atch oui [ 3s | and switch output vec [a] seu [fer | 9 | 40 kHz reference output [spa | 10 | serial data input/output; I@C-bus aM SDA serial clock input; 2C-bus ss [| 9 | fret address select input; I2@C-bus aK7e0 FM output for external loop filter LOOP, tuning voltage amplifier input AM output for external loop filter Fig.2. Pinning diagram. positive supply voltage 2 FUNCTIONAL DESCRIPTION and the FM output is switched to a high impedance state . . . by the AM/FM switch in the AM position. The outputs The TSAG057 contains the following parts and facilities: can deliver a tuning voltage of up to 10.5 V. ° pepara’e spat amplars for the AM and * An [?C-bus interface with data latches and control logic. signa s- . The I?C-bus is intended for communication between * Aprescaler with the divisors 3 : 4 on AM and 15 : 16 on microcontrollers and different ICs or modules. Detailed FM, a multiplexer to select AM or FM and a 4-bit. information on the I2C-bus specification is available on programmable swallow counter. request. ¢ A 13-bit programmable counter. Asoftware-controlled band switch output. * Adigital memory phase detector. * Areference frequency channel comprised of a 4 MHz Controls crystal oscillator followed by a reference counter. The TSA6057 is controlled via the 2-wire I2C-bus. The reference frequency can be 1, 10 or 25 kHz andis — For programming there is one module address, a logic 0 applied to the digital memory phase detector. RW bit, a subaddress byte and four data bytes. The reference counter also outputs a 40 kHz reference = The subaddress determines which one of the four data frequency to pin 9 for co-operation with the FM/IF bytes is transmitted first. The module address contains a system and microcomputer-based tuning interface IC programmable address bit (D1) which with address select (TEA6100). input AS (pin 12) makes it possible to operate two * Aprogrammable current amplifier (charge pump) which ~ TSA6057s in one system. consists of a5 and a 450 wAcurrent source. This allows The auto increment facility of the I2C-bus allows adjustment of loop gain, thus providing high current-high programming of the TSA6057 within one transmission speed tuning and low current-stable tuning. (address + subaddress + 4 data bytes). * Aone input, two output tuning voltage amplifier. * The TSA6057 can also be partially programmed. One output is connected to the external AM loop filter Transmission must then be ended by a STOP condition. and the other output to the external FM loop filter. Under . | | | software control, the AM output is switched to a high The bit organization of the 4 data bytes is shown in Fig.3 impedance state by the FM/AM switch in the FM position and described in Tables 1 to 5.
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- The minimum dividing ratio for AM mode is 26 = 64.
- The minimum dividing ratio for FM mode is 28 = 256.
Table 3. The bits REF1 and REF2 are used to set the
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Philips Semiconductors Product specification Radio tuning PLL frequency synthesizers TSA6057; TSA6057T START orien programmable address bit (D1) STOP condition _-—acknowledge RW] MSB LSB | MSB LSB | MSB LSB | MSB LSB MODULE s| ADDRESS o|a} SUBADDRESS DATABYTEO Jal DATABYTE: |a| DATABYTE2 [Al DATABYTES |a| BYTE BYTE AT AO o7 Do D7 Do D7 Do D7 Do se usB momen AT AO Seton’ oars oe) o7 Do DATA BYTE 1 (DB1) si4 $13 si2 si si0 sg SB Ss7 D7 Do oammorres oe) 07 Do NOT NOT NOT NOT NOT pavers) 7 Do Examples using auto-increment facility soos [ssmoonsserf[ oe a E[eones feaconase [om oe [eons faaconesse lose em waKre2 Fig.3 Bit organization.
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Philips Semiconductors Product specification Radio tuning PLL frequency synthesizers TSA6057; TSA6057T Sensitivity measurement HYBRID JUNCTION Voct 8 FM sinewave ©)» 38 oO 4 generator + J Zz R=5002 g a \\ 1onF -3dB O 5 (| 502 ° ] 502 10 nF iv 6 TSA6057 7 d 7. TSA6057T HYBRID JUNCTION AM sinewave Q+Q—| =8. | 9 -—@ generator +
2 Zz R=502 7
\\ 10 nF -3 dB O 7 (| 50a “ ] 50a — a = 50 Q coaxial waKres Fig.4 Prescaler input sensitivity. LIMITING VALUES Limiting values in accordance with the Absolute Maximum System (IEC 134). SYMBOL PARAMETER conpitions | MIN. | MAX. | UNIT [Voor | supply vatage 1 (pina) Cc supply votage 2 (in 16)
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Philips Semiconductors Product specification Radio tuning PLL frequency synthesizers TSA6057; TSA6057T CHARACTERISTICS Voc1 = 5 V; Voce = 8.5 V; Tamb = 25 °C; unless otherwise specified. [swweo. [__parawerer | conomons | wn | WR | wax | unt | [supplies [Voc [eupeivvotage Tein) ——«dSSSSCSCSC~sS C=O id [icc |suppiveurrentpina [no outputstoades 1220 [28 [mA __| loce supply current pin 16 no outputs loaded version C1 0.7 1.0 1.5 mA version C8 0.2 0.5 1 mA Vn | nputwotageHiGH sd SSSCSC~diSO «dCi [vu [inputvotagetow | ios i vd [in [inputcurrene HIGH |i iid [hn [inputeurentow [| _|-_|- 0 [ua] [Vo outputvotagetOW [la =80mA_[- [oa v_ [AS input [Vin inputvoltageHIGH Tov [vu inputvotagetow fro tov [inv inputcurrent HIGH tov [i [imputcurrenecow | + |-_ | _[ua__ [iawinay [maximum input requeney on Aw [a0 [-__[- [we _| [iawn [minimum input requency on av, [| __|-__]osia [wre [iewnay [maximum input trequeney on F160 [| ___[ mie _| [iewmny [minimum input requency on Fu |__| [0 [He | Powe [eterna [resansnrasl® | [| measured in Fig.4 [ca CS EC few [eseesenss EE Prwm [restr rotarsinnws[ | [| measured in Fig.4 a ( [cru _[eapactanos Sd 2 id
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Philips Semiconductors Product specification Radio tuning PLL frequency synthesizers TSA6057; TSA6057T [smo [_Paraweren | conomions [ww | TR | wax | ONT | pe fee ee PP see Fig.5 lehp output current to loop filter bit CP = logic 0 version C1 3 5 7 pA bit CP = logic 0 version C8 3 5 9 pA bit CP = logic 1 400 500 600 pA [RAI [20logaVocvaVo Tt co [RAZ [20 logAVoca/AVo | tfc [Vou ___[outputvotagsiGH [Sd Sd i [vo Joutbutvotage tow [la=ama [> [- joa fv __| [ier ____[outbutrequeney ___—*[awHeeneia’ [io ie [Vo outputvotagetow Post foe fv version C1 ee oe version C8 [Vow | minimum ouipatvotage [lune=tmA [= [> loa [v__ fin nasmum ouputareorent [fod | version C1 eee Ee version C8 [Worm | rinimum auputwotage _[lau=1mA [> [joa _[v __| [sauce | maximum outputsourse eurent | __———+ios |= |- [ma [ik maximum ouput snkeurent [10 [-_|-_|ma__| [bos [roscoe [|
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Philips Semiconductors Product specification Radio tuning PLL frequency synthesizers TSA6057; TSA6057T
APPLICATION INFORMATION
: (MGK764 Fig.5 Crystal connection (4 MHz).
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Philips Semiconductors Product specification Radio tuning PLL frequency synthesizers TSA6057; TSA6057T Cy 4MHz TALI vi K (| 1 te eV : a * XTAL2 AM 2 iso Ri a | 10 MQ") 27kQ c3 C5 “AM tuning voltage output vi LOOP, 220 nF 38 nF +5V cot 3 14 ! " " iad ce FM tuning TE itput ci 47 uF 220 nF | 3.9nF voltage output " R2 vi FM 10kQ . ee}, 13 Mo TSA6057 +e TSA6057T { Jt FM VCO Cem em AS 9 address selection input 5 12 Jt: At=1 address : C6H 1 nF b J2:A1=0 address : C4H Rem | |1609 J 6 ” DEC DEC sot K 6 W 10 nF FC-bus CaM aM, ‘AM VCO 1 SDA input > 7 10 22 nF bandswitch BS fret 40 kHz reference output ’ 8 8 output Res | 110 ka. i maK765 48V (1) fusing extended range of 10 V < Voce < 12 V it is recommended in certain applications to use a discharge resistor on pin 15 if this operating amplifier is used for AM (only for TSA6057/C1). Fig.6 Application diagram.
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Philips Semiconductors Product specification Radio tuning PLL frequency synthesizers TSA6057; TSA6057T PACKAGE OUTLINES DIP16: plastic dual in-line package; 16 leads (300 mil); long body SOT38-1 D Me ee POR R AMAA AT + isi - 1 4 H t A ' i j | | i W ec Zz fe] by (e;) b 16 | “| i 9 My | pin 1 index ' | = ee a 1 8 oO 5 10 mm es ee scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) jer | | oa [i |» | om |e fom] em] s [ow |e [me | am | w | abe jvm [ey [os | or | iit | em | oes | it | 68 | ase | vee | 8 | tah | 88 [oa | oe | [ome | ove [oa | ov | 3 | 8 | i | 8a | 22h [ov | om | 885 | 85: | 85 | om | om | Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. ourune [| ReFeRENcES | cunOPEAN SE ee ets | co | 92-40-02 [om [omen [woe | eS | ES
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Philips Semiconductors Product specification Radio tuning PLL frequency synthesizers TSA6057; TSA6057T $016: plastic small outline package; 16 leads; body width 7.5 mm SOT162-1 D E hy LG MARA tS me "T__, —S=-d. gro aad jem og AIA Hon IO i | a a DL A p--—---—- - Ay \\ fay A pin 1 index Toy HIE WY : 1oOOON OOOO oe p 0 5 10 mm a ee scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) jut nm | a [a | |e | © [omler| [me] ellos [ | [eo] e | f= fo] [ae a om om [a | io i mm | [ = om * Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. ourne | REFERENCES | EUROPEAN | Ra ee ey [| oe
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Philips Semiconductors Product specification Radio tuning PLL frequency synthesizers TSA6057; TSA6057T SOLDERING Several techniques exist for reflowing; for example, . thermal conduction by heated belt. Dwell times vary Introduction between 50 and 300 seconds depending on heating There is no soldering method that is ideal for all IC method. Typical reflow temperatures range from packages. Wave soldering is often preferred when 215 to 250 °C. through-hole and surface mounted components are mixed Preheating is necessary to dry the paste and evaporate on one printed-circuit board. However, wave soldering is the binding agent. Preheating duration: 45 minutes at not always suitable for surface mounted ICs, or for 45°C, printed-circuits with high population densities. In these situations reflow soldering is often used. WAVE SOLDERING This text gives a very brief insight to a complex technology. Wave soldering techniques can be used for all SO A more in-depth account of soldering ICs can be found in ackages if the following conditions are observed: our “IC Package Databook” (order code 9398 652 90011). PacKag! 9 . ¢ A double-wave (a turbulent wave with high upward DIP pressure followed by a smooth laminar wave) soldering technique should be used. SOLDERING BY DIPPING OR BY WAVE © The longitudinal axis of the package footprint must be The maximum permissible temperature of the solder is parallel to the solder flow. 260 °C; solder at this temperature must not be in contact» The package footprint must incorporate solder thieves at with the joint for more than 5 seconds. The total contact the downstream end. time of successive solder waves must not exceed 5 seconds. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be The device may be mounted up to the seating plane, but applied by screen printing, pin transfer or syringe the temperature of the plastic body must not exceed the dispensing. The package can be soldered after the specified maximum storage temperature (Tstg max): If the adhesive is cured. printed-circuit board has been pre-heated, forced cooling . . may be necessary immediately after soldering to keep the Maximum permissible solder temperature is 260 °C, and temperature within the permissible limit. maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within REPAIRING SOLDERED JOINTS 6 seconds. Typical dwell time is 4 seconds at 250 °C. Apply a low voltage soldering iron (less than 24 V) tothe 4 mildly-activated flux will eliminate the need for removal lead(s) of the package, below the seating plane or not of corrosive residues in most applications. more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in REPAIRING SOLDERED JOINTS contact for up to 10 seconds. If the bit temperature is Fix the component by first soldering two diagonally- between 300 and 400 °C, contact may be up to5 seconds. —_gpposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact so time must be limited to 10 seconds at up to 300 °C. When REFLOW SOLDERING using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between Reflow soldering techniques are suitable for all SO 270 and 320 °C. packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.