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Technical content

Features

For surface mounted applications in order to optimize board space Pb-free plated Peak Power is 240W@1ms ESD Rating of Class X (> 15 kV) (IEC6100-4-2) Response Time is Typically<1 ns Low profile package Typical IR less than 1µA above 10V Low inductance Excellent clamping capability AEC-Q101

Applications

Low frequency signal transmission line (RS232, RS485, etc.) Mechanical Characteristics Case: JEDEC SOD-123FL. Molded plastic over glass passivated junction Solderable per MIL-STD-750, Method 2026Terminal: Color band denoted positive end (cathode) except BidirectionalPolarity: Maximum Ratings And Characteristics Ratings at 25 ambient temperature unless otherwise specified.℃ Notes : 1.Non-repetitive current pulse , per Fig. 3 and derated above TA = 25 per Fig. 2 .℃ 2.Mounted on 5.0mm x 5.0mm (0.03mm thick) Copper Pads to each terminal 3.8.3ms single half sine-wave , or equivalent square wave, Duty cycle = 4 pulses per minutes maximum. Peak Pulse Power Dissipation on 10/1000µs waveform Peak Forward Surge Current,8.3ms Single Half Sine-Wave Superimposed on Rated Load,(JEDEC Method) (Note2,3) Operating junction and Storage Temperature Range RATING SYMBOL VALUE UNITS P PPM IFSM T, TJS T G Minimum 240 -55 to +150 Watts Amps Functional Diagram Bi-directional Uni-directional Cathode Anode

/UNI77ac/UNI96f7/UNI7535/UNI5b50 SPSEMI www.spsemi.cn Page 2 of 5 Dimensions (SOD-123FL) SOD-123FL 0.04 1.00() 0.02 0.50() 0.114 2.9() 0.098 2.5() 0.152 3.82() 0.138 3.5() Cathode Band 0.077 1.95() 0.055 1.38() 0.053 1.33() 0.031 0.8() 0.043 1.10() 0.010 0.25() 0.010 0.250() 0.002 0.050() Dimensions in inches and(millimeters)

Electrical Characteristics

TSA(240W) Series TSA6.0U TSA8.0U TSA12U TSA15U TSA16U TSA20U TSA22U TSA26U TSA28U TSA30U TSA33U TSA36U TSA40U TSA58U TSA60U TSA150U TSA170U TSA Part Number Device Marking Code Reverse Stand-Off Voltage V (V) RWM V (V)Min.BR V (V)Max.BR Test Current IT(mA) Maximum Clamping Voltage @Ipp Vc(V) Peak Pulse Current Ipp(A) Reverse Leakage @VRWM I( A )R μUNI-Polar UNI BI-Polar BI AG AR BE BM BP BV BX CE CG CK CM CP CR RG RK SM SR WG WR XE XM XP XV XY YE YG YK YM YP YR ZG ZK VM VR 6.0 8.0 12.0 15.0 16.0 20.0 22.0 26.0 28.0 30.0 33.0 36.0 40.0 58.0 60.0 150.0 170.0 6.67 8.89 13.30 16.70 17.80 22.22 24.40 28.90 31.10 33.30 36.70 40.00 44.40 64.40 66.70 167.00 189.00 7.37 9.83 14.70 18.50 19.70 24.50 26.90 31.90 34.40 36.80 40.60 44.20 49.10 71.20 73.70 185.00 209.00 10.3 13.6 19.9 24.4 26.0 32.4 35.5 42.1 45.4 48.4 53.3 58.1 64.5 93.6 96.8 243.0 275.0 23.3 17.7 12.1 9.8 9.2 7.4 6.8 5.7 5.3 5.0 4.5 4.1 3.7 2.6 2.5 1.0 0.9 100 Breakdown Voltage T TSA6.0B TSA8.0B TSA12B TSA15B TSA16B TSA20B TSA22B TSA26B TSA28B TSA30B TSA33B TSA36B TSA40B TSA58B TSA60B TSA150B TSA170B For bidirectional type having Vrwm of 10 volts and less, the IR limit is double. For parts with A , the VBR is ±5% REV 2017 02 07.. .

/UNI77ac/UNI96f7/UNI7535/UNI5b50 SPSEMI www.spsemi.cn Page 3 of 5 Characteristic Curves (TA=25 unless otherwise noted)℃ Fig.3 Pulse Waverform Fig.4 Typical Junction Capacitance 00 1.0 2.0 4.03.0 10/1000uS Waveform Half Value IPPM tr=10uS Peak Value I PPM T= 2 5J ℃ Pulse width(td) is defined ad the Point where the Peak Current Decays to 50% of I PPM 100 150 I -Peak Pulse Current(%)PPM t-Time(mS) Junction Capacitance(pF) 1 10 10010 100 1000 10000 V -Reverse Stand-off Voltage(V)RWM Measured at Stand-off Voltage(V ) RWM Measured at Zero Bias Fig.1 Peak Pulse Power Rating Curve Fig.2 Pulse Derating Curve P -Peak Pulse Power(KW) PPM td-Pulse Width(uS) 0.10.1 1.0 10 100 1000 10000 1.0 100 Non-repetitive Pulse Waveform Shown Fig.3 T= 2 5 A ℃ T --Ambient Temperature( )A ℃ 100 125 150 17575502500 100 120 Peak Pulse Power(P )or Current(I ) PP PPM Derating in Percentage% TSA(240W) Series I-V Curve Characteristics Uni-directional Bi-directional IPP IR IT VC VBR VRWM IPP IR IT VCVBRVRWM V IPP IR IT VC VBR VRWM VF V REV 2017 02 07.. .

/UNI77ac/UNI96f7/UNI7535/UNI5b50 SPSEMI www.spsemi.cn Page 4 of 5 Marking Code A G Cathode Band Marking Code WG Marking Code Recommended Soldering Conditions Recommended Conditions Reflow Soldering ts tP tL Time time to peak temperature (t 25 to peak)℃ Temperature T (min)s T (max)s TL TP Preheat Ramp-down Ramp-up Critical Zone Tt o TLP Re”ow Condition Pb-Free assembly (see Fig.1) Pre Heat -Temperature Min(T ) s(min) -Temperature Max(T ) s(max) -Time(Min to Max)(t ) s Average ramp up rate (Liquidus Temp(T ) to peak)L T to T -Ramp-up Rates(max) L Re”ow -Temperature(T )(Liquidus)L -Temperature(t )L Peak Temp(T )P Time within 5 of actual Peak Temp(t )℃ P Ramp-down Rate Time 25 to Peak Temp(T )℃ P Do not exceed +150 ℃ +200 ℃ 60-180secs 3 /sec.Max.℃ 3 /sec.Max.℃ +217 ℃ 60-150secs +260(+0/-5) ℃ 30 secs.Max. 6 /sec.Max.℃ 8 min.Max. +260 ℃ TSA(240W) Series Ratings And Characteristic Curves Fig.5 Maximum Non-Repetitive Peak Forward Surge Current Peak Forward Surge Current(A) 10 10 100 Number of Cycles T= Tm a xJJ 8.3mS single half sine-wave (JEDEC Method) REV 2017 02 07.. .

/UNI77ac/UNI96f7/UNI7535/UNI5b50 SPSEMI TSA(240W) Series Packing Options And Reel Specification-SOD-123FL 0.157 (4.0) 0.31 (8.0) 0.157 (4.0) 0.33 (8.5) Symbol Ea Per Reel REEL DIA (mm) Industry Standard TSA*** 3000 178 EIA RS-481 7.0(178)