TSA5522T

TSA5522 PHILIPS | Alldatasheet

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Technical content

Product specification Supersedes data of 1995 Mar 22 File under Integrated Circuits, IC02

1996 Jan 23

1.4 GHz I2C-bus controlled

1996 Jan 23 2

Philips Semiconductors Product specification

1.4 GHz I2C-bus controlled synthesizer TSA5522

FEATURES

• Complete 1.4 GHz single chip system
• Three PNP band switch buffers (20 mA)
• Four bus-controlled bidirectional ports (NPN open-collector outputs); only one port in 16-pin version
• 33 V tuning voltage output
• In-lock detector
• 5-step ADC
• Mixer-Oscillator (M/O) band switch output
• 15-bit programmable divider
• Programmable reference divider ratio (512, 640 or 1024)
• Programmable charge-pump current (50 or 250µA)
• Varicap drive disable
• I2C-bus format – address plus 4 data bytes transmission (write mode) – address plus 1 status byte transmission (read mode) – three independent addresses
• Low power and low radiation.

APPLICATIONS

• TV tuners and front-ends
• VCR tuners.

ORDERING INFORMATION

TSA5522M SSOP20 plastic shrink small outline package; 20 leads; body width 4.4 mm SOT266-1 TSA5522T SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1

1996 Jan 23 3

Philips Semiconductors Product specification

1. One band switch buffer ON; Io = 20 mA. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VCC1 supply voltage (+5 V) 4.5 − 5.5 V VCC2 band switch supply voltage (+12 V) V CC1 12 13.5 V ICC1 supply current − 22 30 mA ICC2 band switch supply current note 1 − 27 32 mA fRF RF input frequency 64 − 1400 MHz Vi(RF) RF input voltage f i= 80 to 150 MHz − 25 − 3 dBm fi= 150 to 1000 MHz − 28 − 3 dBm fi= 1000 to 1400 MHz − 26 − 3 dBm fxtal crystal oscillator input frequency − 4 − MHz Io(PNP) PNP band switch buffers output current − 20 25 mA Io(NPN) NPN open-collector output current − 20 25 mA Tamb operating ambient temperature −20 − +85 °C Tstg storage temperature (IC) −40 − +150 °C GENERAL DESCRIPTION (see Fig.1) The device is a single chip PLL frequency synthesizer designed for TV and VCR tuning systems. The circuit consists of a divide-by-eight prescaler with its own preamplifier, a 15-bit programmable divider, a crystal oscillator and its programmable reference divider and a phase/frequency detector combined with a charge-pump which drives the tuning amplifier, including 33 V output. Three high-current PNP band switch buffers are provided for band switching together with four open-collector NPN outputs (only one open-collector output on 16-pin devices). These ports can also be used as input ports [one Analog-to Digital Converter (ADC) and three general purpose I/O ports (not available on 16-pin devices)]. An output is provided to control a Philips mixer/oscillator IC in combination with the PNP buffers state. Depending on the reference divider ratio (512, 640 or 1024), the phase comparator operates at 3.90625 kHz, 6.25 kHz or 7.8125 kHz with a 4 MHz crystal. The LOCK detector bit FL is set to logic 1 when the loop is locked and is read on the SDA line (status byte) during a read operation. The ADC is available for digital AFC control. The ADC code is read during a read operation on the I 2C-bus. The ADC input is combined with the port P6. In the TEST mode, this port is also used as a TEST output for f ref and 1⁄2fdiv (see Table 4). I2C-bus format Five serial bytes (including address byte) are required to address the device, select the VCO frequency, program the ports, set the charge-pump current and the reference divider ratio. The device has three independent I 2C-bus addresses selected by applying a specific voltage on AS input (see Table 3). The general address C2 is always valid.

1996 Jan 23 4

Philips Semiconductors Product specification Fig.1 Block diagram (SSOP20). handbook, full pagewidth PRESCALER DIVIDE-BY-8 DIVIDER 512/640/1024 XTAL OSCILLATOR POWER-ON RESET 15-BIT PROGRAMMABLE DIVIDER 15-BIT FREQUENCY REGISTER 7-BIT PORTS REGISTER 7-BIT CONTROL REGISTER DIGITAL PHASE COMPARATOR IN-LOCK DETECTOR CHARGE PUMP I C -BUS TRANSCEIVER ADC COMPARATORS PNP BUFFERS BAND SWITCH P0n.c. V P1 P2 P6 P4 P5 P7 LOGIC OS CP BS CC1 V GATE RSA RSB RSA,RSB 67 1 0 9 8 1 31 61 51 4 17SCL SDA AS XTAL RF2 RF1 ref div 11 CP T2,T1,T0 T2,T1,T0 EE LOCK TSA5522 MLD226 CC2 V f f AMP V tune

1996 Jan 23 5

Philips Semiconductors Product specification SYMBOL SO16 SSOP20 DESCRIPTION VCC1 1 1 voltage supply (+5 V) RF1 2 2 RF signal input 1 RF2 3 3 RF signal input 2 BS 4 4 band switch output to mixer/oscillator drive V EE 5 5 ground VCC2 6 6 voltage supply (+12 V) n.c. − 7 not connected P2 7 8 PNP band switch buffer output 2 P1 8 9 PNP band switch buffer output 1 P0 9 10 PNP band switch buffer output 0 CP 10 11 charge-pump output V tune 11 12 tuning voltage output P6 12 13 NPN open-collector output/ADC input P7 − 14 NPN open-collector output/comparator input P5 − 15 NPN open-collector output/comparator input P4 − 16 NPN open-collector output/comparator input SCL 13 17 serial clock input SDA 14 18 serial data input/output AS 15 19 address selection input XTAL 16 20 crystal oscillator input Fig.2 Pin configuration (SO16). handbook, halfpage MLD225 TSA5522T V RF1 RF2 BS V EE XTAL AS SDA SCL V CP PO CC1 V CC2 tune Fig.3 Pin configuration (SSOP20). handbook, halfpage TSA5522M MLD230 XTAL AS SDA SCL CP RF1 RF2 BS CC2V CC1V EEV n.c. V tune

1996 Jan 23 6

Philips Semiconductors Product specification The device is controlled via the two-wire I2C-bus. For programming, there is one module address (7 bits) and the R/W bit for selecting the READ or the WRITE mode. I 2C-bus mode W RITE MODE (R/W = 0); see Table 1 Data bytes can be sent to the device after the address transmission (first byte). Four data bytes are required to fully program the device. The bus transceiver has an auto-increment facility which permits the programming of the device within one single transmission (address + 4 data bytes). The device can also be partially programmed providing that the first data byte following the address is divider byte 1 (DB1) or control byte (CB). The bits in the data bytes are defined in Table 1. The first bit of the first data byte transmitted indicates whether frequency data (first bit = 0) or control and ports data (first bit = 1) will follow. Until an I 2C-bus STOP command is sent by the controller, additional data bytes can be entered without the need to re-address the device. The frequency register is loaded after the 8th clock pulse of the second divider byte (DB2), the control register is loaded after the 8th clock pulse of the control byte (CB) and the ports register is loaded after the 8th clock pulse of the ports byte (PB). I 2C-BUS ADDRESS SELECTION The module address contains programmable address bits (MA1 and MA0) which offer the possibility of having several synthesizers (up to 3) in one system by applying a specific voltage on the AS input. The relationship between MA1 and MA0 and the input voltage on the AS input is given in Table 3. Table 1 I 2C-bus data format Note 1. Not available on 16-pin devices. Table 2 Description of Table 1 BYTE MSB DATA BYTE LSB COMMAND Address byte (ADB) 1 1 0 0 0 MA1 MA0 0 A Divider byte 1 (DB1) 0 N14 N13 N12 N11 N10 N9 N8 A Divider byte 2 (DB2) N7 N6 N5 N4 N3 N2 N1 N0 A Control byte (CB) 1 CP T2 T1 T0 RSA RSB OS A Ports byte (PB) P7 (1) P6 P5 (1) P4(1) XP 2 P 1 P 0 A SYMBOL DESCRIPTION MA1, MA0 programmable address bits (see Table 3) N14 to N0 programmable divider bits N = N14 × 214 + N13 × 213 + ... + N1× 2 + N0 CP charge-pump current; CP = 0 = 50 µA; CP = 1 = 250µA T2 to T0 test bits (see Table 4). For normal operation T2 = 0; T1 = 0; T0 = 1 RSA, RSB reference divider ratio select bits (see Table 5) OS tuning amplifier control bit; for normal operation OS = 0 and tuning voltage is ON; when OS = 1 tuning voltage is OFF (high impedance) P2 to P0 PNP band switch buffers control bits P7 to P4 NPN open collector control bits when P n = 0 output n is OFF; when Pn = 1 output n is ON X don’t care

1996 Jan 23 7

Philips Semiconductors Product specification Table 6 Band switch output levels VOLTAGE APPLIED ON AS INPUT MA1 MA2 0 to 0.1VCC1 00 Always valid 0 1 0.4V CC1 to 0.6VCC1 10 0.9VCC1 to VCC1 11 T2 T1 T0 DEVICE OPERATION 0 0 1 normal mode 0 1 X charge-pump is OFF 1 1 0 charge-pump is sinking current 1 1 1 charge-pump is sourcing current 100 f ref is available at LOCK output 101 1⁄2fdiv is available at LOCK output RSA RSB REFERENCE DIVIDER X 0 640 0 1 1024 1 1 512 P2 P1 P0 VOLTAGE ON BS OUTPUT PHILIPS M/O BAND 0 1 0 0.25 V band A 1 0 0 0.4V CC1 band B 0 0 1 0.8V CC1 band C R EAD MODE ; R/W = 1 (see Table 7) Data can be read from the device by setting the R/W bit to logic 1. After the slave address has been recognized, the device generates an acknowledge pulse and the first data byte (status byte) is transferred on the SDA line (MSB first). Data is valid on the SDA line during a HIGH level of the SCL clock signal. A second data byte can be read from the device if the microcontroller generates an acknowledge on the SDA line (master acknowledge). End of transmission will occur if no master acknowledge occurs. The device will then release the data line to allow the microcontroller to generate a STOP condition. When ports P4 to P7 are used as inputs, the corresponding bits must be logic 0 (high impedance state). The POR flag is set to logic 1 at power-on. The flag is reset when an end-of-data is detected by the device (end of a read sequence). Control of the loop is made possible with the in-lock flag (FL) which indicates when the loop is locked (FL = 1). The bits I2, to I0 represent the status of the I/O ports P7, P5 and P4 respectively. A logic 0 indicates a LOW level and a logic 1 indicates a HIGH level (see “Characteristics”). A built-in ADC is available at pin P6. This converter can be used to apply AFC information to the microcontroller from the IF section of the television. The relationship between the bits A2 to A0 is given in Table 8. Table 7 READ data format Notes 1. A = acknowledge. 2. POR = power-on-reset (POR = 1 at power-on). 3. FL = in-lock flag (FL = 1 when loop is locked). 4. I2 to I0 = digital levels for I/O ports P7, P5 and P4 respectively. 5. A2 to A0 = digital outputs of the 5-level ADC. BYTE MSB DATA BYTE LSB COMMAND Address byte (ADB) 11000 M A 1 M A 0 1 A (1) Status byte (SB) POR (2) FL(3) I2(4) I1(4) I0(4) A2(5) A1(5) A0(5) −

1996 Jan 23 8

Philips Semiconductors Product specification

1. Accuracy is 0.02VCC1 . LIMITING VALUES In accordance with the Absolute Maximum System (IEC 134) HANDLING Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling bipolar devices. Every pin withstands the ESD test in accordance with MIL-STD-883C category B (2000 V). Every pin withstands the ESD test in accordance with Philips Semiconductors Machine Model 0Ω , 200 pF (200 V). VOLTAGE APPLIED ON PORT P6 (1) A2 A1 A0 0.6VCC1 to 13.5V 1 0 0 0.45VCC1 to 0.6VCC1 011 0.3VCC1 to 0.45VCC1 010 0.15VCC1 to 0.3VCC1 001 0 to 0.15VCC1 000 SYMBOL PARAMETER MIN. MAX UNIT VCC1 supply voltage +5 V −0.3 6.0 V VCC2 supply voltage + 12 V −0.3 16 V Vi(RF) prescaler input voltage −0.3 V CC1 V Vo(BS) band switch output voltage −0.3 V CC1 V Vo(PNP) PNP band switch buffer output voltage − 0.3 V CC2 V Io(PNP) PNP band switch buffers output current −12 5m A VNPN NPN open-collector output voltage −0.3 16 V INPN NPN open-collector output current −12 5m A Vo(CP) charge-pump output voltage −0.3 V CC1 V Vo(tune) output tuning voltage −0.3 35 V Vi(SCL) serial clock input voltage −0.3 6.0 V Vi/o(SDA) serial data input/output voltage −0.3 6.0 V Io(SDA) serial data output current −15 m A Vi(AS) address selection input voltage −0.3 V CC1 V Vi(xtal) crystal oscillator input voltage −0.3 V CC1 V Tstg storage temperature range (IC) −40 +150 °C Tj maximum junction temperature − +150 °C tsc short circuit time; every pin to VCC1 or GND − 10 s

1996 Jan 23 9

Philips Semiconductors Product specification VCC1 = 4.5 to 5.5 V; VCC2 =V CC1 to 13.2 V; Tamb = −20 to 85°C; unless otherwise specified; see note 1 SYMBOL PARAMETER MAX UNIT R th j-a thermal resistance from junction to ambient in free air SO16 110 K/W SSOP20 120 K/W SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX UNIT V CC1 supply voltage (+5 V) 4.5 − 5.5 V VCC2 supply voltage (+12 V) V CC1 − 13.5 V ICC1 supply current − 22 30 mA ICC2 supply current One band switch buffer is ON; Isource=2 0m A − 27 32 mA fRF RF input frequency 64 − 1400 MHz DR divider ratio 15-bit frequency word 256 − 32767 MHz Crystal oscillator fxtal crystal oscillator input frequency R xtal=2 5t o3 0 0Ω 3.2 4 4.48 MHz Zxtal crystal oscillator input impedance (absolute value) fi= 4 MHz 600 1200 −Ω Prescaler Vi(RF) RF input level V CC1 = 4.5 to 5.5 V; see Fig.4; fi= 80 to 150 MHz −25 − 3d B VCC1 = 4.5 to 5.5 V; see Fig.4; fi= 150 to 1000 MHz −28 − 3d B VCC1 = 4.5 to 5.5 V; see Fig.4; fi= 1000 to 1400 MHz −26 − 3d B PNP band switch buffers outputs |ILO | output leakage current V CC2 = 13.5 V; Vo =0V −10 −− µ A Vo(sat) output saturation voltage Isource= 20 mA; note 1 - 0.2 0.5 V NPN open-collector outputs P4, P5, P6 and P7;see note 2 |ILO | output leakage current V CC1 = 5.5 V; Vo = 13.5 V −− 10 µA Vo(sat) output saturation voltage Isink= 20 mA; note 3 − 0.2 0.5 V C OL allowed capacitive loading on output pins VOL = 13.5 V 10 nF Input ports P7, P5 and P4;see note 2 VIL LOW level input voltage −− 1.5 V VIH HIGH level input voltage 3 −− V AS input (Address Selection) IIH(AS) HIGH level input current VAS =V CC1 −− 50 µA

1996 Jan 23 10

Philips Semiconductors Product specification

1. A single PNP band switch buffer is ON. 2. P4, P5 and P7 I/O ports are not available in 16-pin package. In 20-pin package, when a port is active, the collector voltage must not exceed 6 V. 3. A single NPN open-collector output is ON. I IL(AS) LOW level input current VAS = 0 V −50 −− µ A SCL and SDA inputs VIL LOW level input voltage −− 1.5 V VIH HIGH level input voltage 3.0 − 5.5 V IIH HIGH level input current VIH = 5.5 V; VCC1 =0V −− 10 µA VIH = 5.5 V; VCC1 = 5.5 V −− 10 µA IIL LOW level input current VIL=0V ; VCC1 = 5.5 V −10 −− µ A fclk input clock frequency − 100 400 kHz SDA output (I2C bus mode) IILO output leakage current V O = 5.5 V −− 10 µA Vo output voltage I sink=3m A −− 0.4 µA BS output (M/O band selection) Vo(BS) output voltage band A; I source=2 0µA − 0.25 0.5 V band B; Isource=2 0µA 0.36V CC1 0.4VCC1 0.43VCC1 V band C; Isource=2 0µA 0.7V CC1 0.8VCC1 0.9VCC1 V band C; Isource=5 0µA 3.1 −− V Charge-pump output CP IICPH  HIGH charge pump current (absolute value) CP = 1 − 250 −µ A IICPL LOW charge pump current (absolute value) CP = 0 − 50 −µ A Vo(CP) output voltage in-lock; T amb = +25°C − 1.95 − V ILI(off) off-state leakage current T2 = 0; T1 = 1 −5 1 15 nA Tuning voltage output Vtune ILO(off) leakage current when switched-off OS = 1; Vtune=3 3V −− 10 µA Vo output voltage when the loop is closed R L =2 7k Ω; Vtune=3 3V 0.4 − 32.6 V Vripple(p-p)acceptable ripple voltage on VCC1 (peak-to-peak value) fripple= 300 Hz to 300 kHz −− 30 mV SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX UNIT

1996 Jan 23 11

Philips Semiconductors Product specification Fig.4 Prescaler typical input sensitivity curve. handbook, full pagewidth 600 0 200 400 1400 1600800 1000 1200 MLD227 power (dBm) f (MHz)i

1996 Jan 23 12

Philips Semiconductors Product specification INTERNAL PIN CONFIGURATION handbook, full pagewidth V down up CC1 n.c. EEV BS RF2 RF1 to presscaler divider Vref V XTAL 3 kΩ 1 kΩ 1 kΩ 1 kΩ 300 µF AS AS SDA SCL control CP V MLD228 VCC1V CC1 Vtune VCC1V CC1 VCC1V CC1V CC1V CC1V CC1V CC1V CC1V CC1V CC1V CC1 VCC1V CC1 CC1 CC2 VCC2 VCC2 VCC2 TSA5522 Fig.5 Internal pin configuration.

1996 Jan 23 13

Philips Semiconductors Product specification

APPLICATION INFORMATION

Tuning amplifier The tuning amplifier is capable of driving the varicap voltage without an external transistor. The tuning voltage output must be connected to an external load of 27 kΩ which is connected to the tuning voltage supply rail. Figure 6 shows a possible loop filter. The component values depend on the oscillator characteristics and the selected reference frequency. Crystal oscillator The crystal oscillator uses a 4 MHz crystal connected in series with an 18 pF capacitor thereby operating in the series resonance mode. Connecting the oscillator to the supply voltage is preferred, but it can, however, also be connected to ground. Fig.6 Typical application (SO16). handbook, full pagewidth CP SCL SDA AS XTAL V 33 V UHF VHF1 VHF3 12 V BS RF RF 5 V 10 nF 1 nF 1 nF V V BS RF2 RF1 V CC2 CC1 EE SCL 39 nF 180 nF SDA AS TSA5522T tune 22 kΩ 27 kΩ

4 MHz 18 pF

1996 Jan 23 14

Philips Semiconductors Product specification Flock flag (FL) definition When the LOCK output is LOW the maximum frequency deviation(Δf) from stable frequency can be expressed as follows: where: Kvco = oscillator slope Hz/V ICP = charge-pump current (A) KO = 4× 10E6 C1, C2 = loop filter capacitors. In the application: KVCO = 16 MHz/V (UHF band) ICP = 250µA C1 = 180 nF, C2 = 39 nF Δf= ±31.2 kHz. Δ f K VCO K O C1 C2+() Fig.7 Loop filter. handbook, halfpage MBE331 R Table 9 LOCK output / FL flag setting DESCRIPTION CONDITION MIN. MAX. UNIT Time span between actual phase lock and LOCK bit is LOW (or FL flag = 1) RSA = 1; RSB = 1 1024 1152 µs RSA = 1; RSB = 1 2048 2304 µs RSB = 0 1280 1440 µs Time span between the loop losing lock and LOCK bit is HIGH or (FL flag = 0) 0 300 µs

1996 Jan 23 15

Philips Semiconductors Product specification X w M θ AA 1 A 2 bp D H E Lp Q detail X E Z e c L v M A (A )3 A y pin 1 index UNIT A max. A 1 A 2 A 3 bp cD (1) E (1) (1)eH E LL p QZ ywv θ REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm inches 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 10.0 9.8 4.0 3.8 1.27 6.2 5.8 0.7 0.6 0.7 0.3 8 o o 0.25 0.1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 1.0 0.4 SOT109-1 91-08-13 95-01-23 076E07S MS-012AC 0.069 0.0098 0.0039 0.057 0.049 0.01 0.019 0.014 0.0098 0.0075 0.39 0.38 0.16 0.15 0.050 1.05 0.0410.24 0.23 0.028 0.020 0.028 0.0120.01 0.25 0.01 0.0040.039 0.016 0 2.5 5 mm scale SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1

1996 Jan 23 16

Philips Semiconductors Product specification UNIT A 1 A 2 A 3 bp cD (1) E (1) (1)eH E LL p QZ ywv θ REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm 0.15 1.4 1.2 0.32 0.20 0.20 0.13 6.6 6.4 4.5 6.2 0.65 0.45 0.48 0.18 o o0.13 0.1 DIMENSIONS (mm are the original dimensions) Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. 0.75 0.45 SOT266-1 90-04-05 95-02-25 w M θ A A 1 A 2 bp D H E Lp Q detail X E Z e c L v M A X (A )3 A y 0.25 11 0 20 11 pin 1 index 0 2.5 5 mm scale SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm SOT266-1 A max. 1.5

1996 Jan 23 17

Philips Semiconductors Product specification There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). Reflow soldering Reflow soldering techniques are suitable for all SO and SSOP packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250°C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. Wave soldering SO Wave soldering techniques can be used for all SO packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used.
• The longitudinal axis of the package footprint must be parallel to the solder flow.
• The package footprint must incorporate solder thieves at the downstream end. SSOP Wave soldering isnot recommended for SSOP packages. This is because of the likelihood of solder bridging due to closely-spaced leads and the possibility of incomplete solder penetration in multi-lead devices. If wave soldering cannot be avoided, the following conditions must be observed:
• A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used.
• The longitudinal axis of the package footprint must be parallel to the solder flow and must incorporate solder thieves at the downstream end. Even with these conditions, only consider wave soldering SSOP packages that have a body width of 4.4 mm, that is SSOP16 (SOT369-1) or SSOP20 (SOT266-1). M ETHOD (SO AND SSOP) During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260°C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150°C within 6 seconds. Typical dwell time is 4 seconds at 250°C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Repairing soldered joints Fix the component by first soldering two diagonally- opposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300°C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320°C.

1996 Jan 23 18

Philips Semiconductors Product specification These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. PURCHASE OF PHILIPS I 2C COMPONENTS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Where application information is given, it is advisory and does not form part of the specification. Purchase of Philips I 2C components conveys a license under the Philips’ I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011.

1996 Jan 23 19

Philips Semiconductors Product specification

Philips Semiconductors – a worldwide company Argentina: IEROD, Av. Juramento 1992 - 14.b, (1428) BUENOS AIRES, Tel. (541)786 7633, Fax. (541)786 9367 Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. (02)805 4455, Fax. (02)805 4466 Austria: Triester Str. 64, A-1101 WIEN, P.O. Box 213, Tel. (01)60 101-1236, Fax. (01)60 101-1211 Belgium: Postbus 90050, 5600 PB EINDHOVEN, The Netherlands, Tel. (31)40-2783749, Fax. (31)40-2788399 Brazil: Rua do Rocio 220 - 5th floor, Suite 51, CEP: 04552-903-SÃO PAULO-SP, Brazil, P.O. Box 7383 (01064-970), Tel. (011)821-2333, Fax. (011)829-1849 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS: Tel. (800) 234-7381, Fax. (708) 296-8556 Chile: Av. Santa Maria 0760, SANTIAGO, Tel. (02)773 816, Fax. (02)777 6730 China/Hong Kong: 501 Hong Kong Industrial Technology Centre,

72 Tat Chee Avenue, Kowloon Tong, HONG KONG,

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