TSA5055T

TSA5055T PHILIPS | Alldatasheet

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Technical content

Product specification Supersedes data of November 1991 File under Integrated Circuits, IC02

1999 Aug 11

2.65 GHz bidirectional I2C-bus

1999 Aug 11 2

Philips Semiconductors Product specification

2.65 GHz bidirectional I2C-bus controlled

FEATURES

• Complete 2.65 GHz single-chip system
• Low power 5 V, 60 mA
• I2C-bus programming
• In-lock flag
• Varicap drive disable
• Low radiation
• 5-level Analog to Digital Converter (ADC)
• Address selection for Picture-In-Picture (PIP), DBS tuner, etc.
• 6 controllable outputs, 4 bidirectional
• Power-down flag
• Available in SOT109-1 (SO16) package
• Symmetrical or asymmetrical drive.

APPLICATIONS

• Satellite TV
• High IF cable tuning systems. GENERAL DESCRIPTION The TSA5055T is a single-chip PLL frequency synthesizer designed for satellite TV tuning systems. It may be used with a symmetrical input (pins 13 and 14) or with an asymmetrical input (pin 13). Control data is entered via the I 2C-bus; five serial bytes are required to address the device, select the oscillator frequency, program the six output ports and set the charge-pump current. Four of these ports can also be used as input ports (three general purpose I/O ports, one ADC). Digital information concerning these ports can be read out of the TSA5055T on the SDA line (one status byte) during a READ operation. A flag is set when the loop is ‘in-lock’ and is read during a READ operation. The device has one fixed I 2C-bus address and three programmable addresses, programmed by applying a specific voltage to port 3. The phase comparator operates at 7.8125 kHz when a 4 MHz crystal is used. QUICK REFERENCE DATA

ORDERING INFORMATION

SYMBOL PARAMETER MIN. TYP. MAX. UNIT V CC supply voltage 4.5 5 5.5 V ICC supply current − 60 80 mA fRF RF input frequency range 1 − 2.65 GHz VI (rms) input voltage level (RMS value) 1 to 1.8 GHz 50 − 300 mV 1.8 to 2.65 GHz 70 − 300 mV fXTAL crystal oscillator frequency 3.2 4 4.48 MHz zXTAL crystal oscillator impedance (absolute value) 600 1000 −Ω IO open-collector output current P7, P6, P5 and P4−− 10 mA output current P3 and P0 − 1 − mA Tamb ambient temperature −20 − +85 °C Tstg storage temperature −40 − +150 °C TYPE NUMBER PACKAGE NAME DESCRIPTION CODE TSA5055T SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1

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Philips Semiconductors Product specification This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... BLOCK DIAGRAM handbook, full pagewidth 15-BIT PROGRAMMABLE DIVIDER DIGITAL PHASE COMPARATOR CHARGE- PUMP LOGIC LATCH 3 CONTROL DATA GATE TTL LEVEL COMPARATORS 3-BIT ADC ADDRESS SELECTION I2C-BUS TRANSCEIVER POWER DOWN DETECTOR 15-BIT LATCH DIVIDER RATIO DIVIDER N = 512 OSCILLATOR

4 MHz

7.8125 kHz 7-BIT LATCH PORT INFORMATION IN-LOCK DETECTOR P0 P3 P4 P5 P6 P7 fREF fDIVPRESCALER PD UD TSA5055T MBC307 OS 1011 9 8 7 6 GND VCC Fig.1 Block diagram.

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W bit for selecting READ or WRITE mode. Table 1. The first bit of the first data byte transmitted charge-pump and port information (first bit = 1) will follow. dividing the output of the 4 MHz crystal oscillator by 512.

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Philips Semiconductors Product specification Table 1 Write data format; see notes 1 to 13 Notes 1. MA1 and MA0: programmable address bits (see Table 3). 2. A :Acknowledge bit. 3. N14 to N0: programmable divider bits. 4. N = N14 × 2 5. CP: charge-pump current. CP = 0: 50µA; CP = 1: 220µA. 6. P7 to P4 = 1: open-collector outputs are active. 7. P7 to P3 and P0 = 0: outputs are in high-impedance state. 8. P3 and P0 = 1: current-limited outputs are active. 9. T1, T0 and OS = 0, 0 and 0: normal operation. 10. T1 = 1: P6 = f REF and P7 = fDIV. 11. T0 = 1: 3-state charge-pump. 12. OS = 1: Operational amplifier output is switched off (varicap drive disable). 13. X: don’t care. BYTE MSB DATA BYTE LSB COMMAND Address 11000 M A 1 M A 0 0A b y t e 1 Programmable divider 0 N14 N13 N12 N11 N10 N9 N8 A byte 2 N7 N6 N5 N4 N3 N2 N1 N0 A byte 3 Charge-pump and test bits 1 CP T1 T0 1 1 1 OS A byte 4 Output ports, control bits P7 P6 P5 P4 P3 X X P0 A byte 5 READ mode: R/ W=1 ; see Table 2 Data can be read out of the TSA5055T by setting the R/W bit to 1. After the slave address has been recognized, the TSA5055T generates an Acknowledge signal (A) and the first data byte (status byte) is transferred to the SDA line (MSB first). Data is valid on the SDA line while the SCL clock signal is HIGH. A second data byte can be read out of the TSA5055T if the processor generates an Acknowledge signal on the SDA line. End of transmission will occur if the processor does not send an Acknowledge signal. The TSA5055T will then release the data line to allow the processor to generate a STOP condition. When ports P3 to P7 are used as inputs, they must be programmed to their high-impedance state. The POR flag (Power-On Reset) is set to 1 at power-on and when V CC goes below 3 V. The flag is reset when an end of data is detected by the TSA5055T (end of a READ sequence). Control of the loop is made possible with the in-lock flag FL, which indicates when the loop is phase-locked (FL = 1).

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Philips Semiconductors Product specification Table 2 Read data format (see notes 1 to 5) Notes 1. POR: Power-on reset flag (POR = 1 on power-on). 2. FL: in-lock flag (FL = 1 when the loop is phase-locked). 3. I2, I1 and I0: digital information for I/O ports P7, P5 and P4 respectively. 4. A2, A1 and A0: digital outputs of the 5-level ADC. Accuracy is 1⁄2 LSB (see Table 4). 5. MSB is transmitted first. Bits I2, I1 and I0 represent the status of the I/O ports P7, P5 and P4, respectively. A logic ‘0’ indicates a LOW level and a logic ‘1’ a HIGH level (TTL levels). A built-in 5-level ADC is available at I/O port P6. This ADC can be used to feed AFC information to the controller from the IF section of the receiver, as shown in Fig.4. The relationship between bits A2, A1, A0 and the input voltage at port P6 is given in Table 4. Table 3 Address selection Address selection; see Table 3 The module address contains programmable address bits (MA1 and MA0), which offer the possibility of having several synthesizers (up to three) in one system. The relationship between MA1 and MA0 and the input voltage at port P3 is given in Table 3. Table 4 ADC levels BYTE MSB DATA BYTE LSB COMMAND Address 11000 M A 1 M A 0 1A b y t e 1 Status byte POR FL I2 I1 I0 A2 A1 A0 − byte 2 MA1 MA0 VOLTAGE APPLIED ON PORT P3 0 0 0 to 0.1V CC 0 1 always valid 1 0 0.4V CC to 0.6VCC 1 1 0.9V CC to 13.5 V A2 A1 A0 VOLTAGE APPLIED ON PORT P6 1 0 0 0.6V CC to VCC 0 1 1 0.45V CC to 0.6VCC 0 1 0 0.3V CC to 0.45VCC 0 0 1 0.15V CC to 0.3VCC 0 0 0 0 to 0.15V CC

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Philips Semiconductors Product specification Fig.3 Symmetrical application diagram. handbook, full pagewidth FCE048 TSA5055T SCL I2C-bus 22 kΩ SATELLITE MIXER OSCILLATOR PART oscillator outputs varicap input 22 kΩ 1 nF 1 nF BC847B 0.1 µF VT +33 V +5 V +12 V SDA

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Philips Semiconductors Product specification Fig.4 Asymmetrical application diagram. handbook, full pagewidth FCE049 TSA5055T SCL I2C-bus 22 kΩ SATELLITE MIXER OSCILLATOR PART oscillator output varicap input 22 kΩ 1 nF 10 nF BC847B 0.1 µF VT +33 V +5 V +12 V SDA

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Philips Semiconductors Product specification In accordance with the Absolute Maximum Rating System (IEC 134). HANDLING All pins withstand the ESD test in accordance with“MIL-STD-883C”, category A (1000 V). THERMAL CHARACTERISTICS CHARACTERISTICS VCC = 5 V; Tamb =2 5°C; unless otherwise specified. SYMBOL PARAMETER MIN. MAX. UNIT VCC supply voltage −0.3 +6 V VO(PD) charge-pump (PD) output voltage −0.3 V CC V VI(Q1) crystal (Q1) input voltage −0.3 V CC V VI/O(SDA) serial data (SDA) input/output voltage −0.3 +6 V VI(SCL) serial clock (SCL) input voltage −0.3 +6 V VI/O(P7-P0) input/output ports (P7 to P3 and P0) voltage −0.3 +16 V VI(RFIN) prescaler inputs (RFIN1 and RFIN2) voltage −0.3 +2.5 V VO(UD) drive output (UD) voltage −0.3 V CC V IO(P4-P7) output ports (P7 to P4) current (open-collector) −1 +15 mA IO(SDA) serial data (SDA) output current (open-collector) −1+ 5m A Tstg storage temperature −40 +150 °C Tj maximum junction temperature − 150 °C SYMBOL PARAMETER CONDITIONS VALUE UNIT R th(j-a) from junction to ambient in free air 110 K/W SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VCC supply voltage range 4.5 5 5.5 V Tamb ambient temperature −20 − +85 °C fRF RF input frequency range 1 − 2.65 GHz N divider ratio 256 − 32767 ICC supply current − 60 80 mA fXTAL crystal oscillator frequency 3.2 4 4.48 MHz ZXTAL crystal oscillator impedance (pin 2) absolute value 600 1000 −Ω VXTAL(p-p) drive level on pin 2 (quartz Philips 4322 143 04093) (peak-to-peak value) − 110 − mV V I(rms) input voltage level (RMS value) VCC = 4.5 to 5.5 V; Tamb = −20 to +85°C; see typical sensitivity curve in Fig.5 f = 1 to 1.8 GHz 50/ −13 − 300/2.6 mV/dBm f = 1.8 to 2.65 GHz 70/ −10 − 300/2.6 mV/dBm R I prescaler input impedance see Smith chart in Fig.6 − 50 −Ω C I input capacitance − 2 − pF

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Philips Semiconductors Product specification

1. When a port is active, the collector voltage must not exceed 6 V. 2. Measured with a single open-collector active. Output ports P3 and P0 (current limited) I LO leakage current V o = 13.5 V −− 10 µA IOS output sink current V o = 13.5 V 0.7 1 1.5 mA Output ports P7 to P4 (open collector); see note 1 ILO leakage current V o = 13.5 V −− 10 µA VOL output voltage LOW I o = 10 mA; note 2 −− 0.7 V Input ports P6 and P3 IIH input current HIGH V IH = 13.5 V −− 10 µA IIL input current LOW V IL=0V −10 −− µ A Input ports P7, P5 and P4 VIH input voltage HIGH 2.7 −− V VIL input voltage LOW −− 0.8 V IIH input current HIGH V IH = 13.5 V −− 10 µA IIL input current LOW V IL=0V −10 −− µ A Bus inputs SCL and SDA VIH input voltage HIGH 3 − 5.5 V VIL input voltage LOW −− 1.5 V IIH input current HIGH V IH =5V ; VCC =0V −− 10 µA VIH =5V ; VCC =5V −− 10 µA IIL input current LOW V IL=0V ; VCC =0V −10 −− µ A VIL=0V ; VCC =5V −10 −− µ A Output SDA (open-collector) IOH leakage current V OH = 5.5 V −− 10 µA VOL output voltage I OL =3m A −− 0.4 V Charge-pump output PD IOH output current HIGH (absolute value) CP = 1 90 220 300 µA IOL output current LOW (absolute value) CP = 0 22 50 75 µA VO output voltage in-lock 1.5 − 2.5 V IO(leak) off-state leakage current T0 = 1 −5 − +5 nA Operational amplifier output UD (test mode: T0 = 1) VO output voltage V O(PD) =0V −− 100 mV output voltage when switched off T0 = 1; OS = 1; VO(PD) =2V −− 250 mV hFE operational amplifier current gain T0 = 1, OS = 0; VO(PD) =2V IO(UD) =1 0µA 2000 −− SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT IOU D()

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Philips Semiconductors Product specification Fig.5 Typical input sensitivity curve. VCC = 5 V; Tamb =2 5°C. handbook, halfpage 0 800 1600 3200 −27 −39 −15 FCE060 2400 −10 dBm 2650 f (MHz) Vi (dBm) guaranteed operating area Fig.6 Smith chart of typical input impedance. VCC = 5 V; reference value = 50Ω . handbook, full pagewidth 0.2 0.5 0.2 0.5 + j − j FCE061

1 GHz

2 GHz

2.65 GHz

0.5 10.2 10 52

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Philips Semiconductors Product specification FLOCK FLAG DEFINITION (FL) When the FL flag is 1, the maximum frequency deviation (Δf) from stable frequency can be expressed as follows: where: KVCO = oscillator slope (Hz/V) ICP = charge-pump current (A) KO =4 × 106 C1 and C2 = loop filter capacitors. Δ f K VCO K O ±= Fig.7 Loop filter. handbook, halfpage R MGA032 Flock flag settings Flock flag application

• KVCO = 50 MHz/V
• ICP = 220µA
• C1 = 180 nF
• C2 = 39 nF
• Δ f= ±85.8 kHz. PARAMETER MIN. MAX. UNIT Time span between actual phase lock and FL-flag setting 1024 1152 µs Time span between the loop losing lock and FL-flag resetting 0 128 µs

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Philips Semiconductors Product specification Fig.8 RF input amplifier. RF IN1 Vref RF IN2 FCE051 600 Ω600 Ω Fig.9 Current amplifier. PD UD OS FCE052 VCC Vref 200 Ω 170 Ω Fig.10 Input/output ports, pins 6 to 11. (1) This resistor is implemented only for P0 and P3. (2) These components are not implemented for P0. FCE053 VCC 6-11 (1) (2) (2) (2) 4SDA 1 kΩ FCE054 VCC Fig.11 I2C SDA.

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Philips Semiconductors Product specification Fig.12 I2C SCL. 5SCL 1 kΩ FCE055 VCC Fig.13 Reference oscillator. 3Q2 FCE056 VCC 2Q1

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Philips Semiconductors Product specification X w M θ AA 1 A 2 bp D H E Lp Q detail X E Z e c L v M A (A )3 A y pin 1 index UNIT A max. A 1 A 2 A 3 bp cD (1) E (1) (1)eH E LL p QZ ywv θ REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm inches 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 10.0 9.8 4.0 3.8 1.27 6.2 5.8 0.7 0.6 0.7 0.3 8 o o 0.25 0.1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 1.0 0.4 SOT109-1 95-01-23 97-05-22 076E07S MS-012AC 0.069 0.010 0.004 0.057 0.049 0.01 0.019 0.014 0.0100 0.0075 0.39 0.38 0.16 0.15 0.050 1.05 0.0410.244 0.228 0.028 0.020 0.028 0.0120.01 0.25 0.01 0.0040.039 0.016 0 2.5 5 mm scale SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1

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Philips Semiconductors Product specification Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250°C. The top-surface temperature of the packages should preferable be kept below 230°C. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results:

• Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave.
• For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint longitudinal axis ispreferred to be parallel to the transport direction of the printed-circuit board; – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end.
• For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250°C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320°C.

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Philips Semiconductors Product specification Suitability of surface mount IC packages for wave and reflow soldering methods Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”. 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. PACKAGE SOLDERING METHOD WAVE REFLOW (1) BGA, SQFP not suitable suitable HLQFP , HSQFP , HSOP , HTSSOP , SMS not suitable(2) suitable PLCC (3), SO, SOJ suitable suitable LQFP , QFP , TQFP not recommended (3)(4) suitable SSOP , TSSOP , VSO not recommended (5) suitable

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Philips Semiconductors Product specification These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. PURCHASE OF PHILIPS I 2C COMPONENTS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification. Purchase of Philips I 2C components conveys a license under the Philips’ I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011.

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Philips Semiconductors Product specification

© Philips Electronics N.V. SCA All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Internet: http://www.semiconductors.philips.com 1999 67 Philips Semiconductors – a worldwide company For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria:Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773 Belgium: see The Netherlands Brazil:see South America Bulgaria:Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 68 9211, Fax. +359 2 68 9102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381, Fax. +1 800 943 0087 China/Hong Kong: 501 Hong Kong Industrial Technology Centre,

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