TS5V330CDR

TS5V330C_V01 TI | Alldatasheet

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D C IN VCC 1 16 3 14 4 13 5 12 6 11 7 10 8 9 S1A S2A DA S1B S2B DB EN S1D S2D DD S1C S2C TS5V330C www.ti.com SCDS276B –APRIL 2009–REVISED DECEMBER 2009 QUAD SPDTWIDEBANDWIDTHVIDEOSWITCHWITHLOW ON-STATERESISTANCE Check forSamples: TS5V330C 1FEATURES D, DB, DBQ, OR PW PACKAGE

• Low DifferentialGain and Phase (TOP VIEW) (TypicalD G = 0.24%,TypicalD P = 0.039°)
• Wide Bandwidth (TypicalBW > 288 MHz)
• Low Cross-Talk(TypicalXTALK = –87 dB)
• Low Power Consumption (Maximum ICC = 3 μA)
• BidirectionalData Flow,With Near-Zero PropagationDelay
• Low ON-StateResistance(TypicalrON = 3 Ω)
• VCC OperatingRange From 4.5V to5.5V
• IoffSupports Partial-Power-DownMode RGY PACKAGEOperation (TOP VIEW)• Data and ControlInputsProvideUndershoot Clamp Diode
• ControlInputsCan be Drivenby TTL or 5-V/3.3-VCMOS Outputs
• Latch-Up Performance Exceeds 100 mA Per JESD 78,Class II
• ESD Performance Tested Per JESD 22 – 2000-V Human-Body Model (A114-B,Class II) – 1000-V Charged-DeviceModel (C101)
• SuitableforBoth RGB and Composite Video Switching DESCRIPTION/ORDERING INFORMATION The TS5V330C isa 4-bit1-of-2multiplexer/demultiplexervideoswitchwitha singleswitch-enable(EN) input. The select(IN)inputcontrolsthe data path of the multiplexer/demultiplexer.When EN islow,the switchis enabledand theD portisconnectedtotheS port.When EN ishigh,theswitchisdisabledand a highimpedance stateexistsbetween theD and S ports. Low differentialgainand phase makes thisswitchidealforvideoapplications.The devicehas a wide bandwidth and low crosstalkwhich makes itsuitableforhighfrequencyvideoapplications.The devicecan be used for RGB and compositevideoswitchingapplications. Thisdeviceisfullyspecifiedforpartial-power-downapplicationsusingIoff.The Iofffeatureensuresthatdamaging currentwillnotbackflowthroughthedevicewhen itispowered down. The devicehas isolationduringpower off. To ensurethehigh-impedancestateduringpower up orpower down, EN shouldbe tiedtoVCC througha pullup resistor;theminimum valueoftheresistorisdeterminedby thecurrent-sinkingcapabilityofthedriver. Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsofTexas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 2009,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.

SCDS276B –APRIL 2009–REVISED DECEMBER 2009 www.ti.com

ORDERING INFORMATION

TA PACKAGE (1)(2) ORDERABLE PART NUMBER TOP-SIDE MARKING QFN – RGY Tape and reel TS5V330CRGYR TE330C Tube TS5V330CD SOIC – D TS5V330C Tape and reel TS5V330CDR –40°C to85°C SSOP – DB Tape and reel TS5V330CDBR TE330C SSOP (QSOP) – DBQ Tape and reel TS5V330CDBQR TE330C Tube TS5V330CPW TSSOP – PW TE330C Tape and reel TS5V330CPWR (1) Package drawings,thermaldata,and symbolizationareavailableatwww.ti.com/packaging. (2) Forthemost currentpackage and orderinginformation,see thePackage OptionAddendum attheend ofthisdocument,orsee theTI websiteatwww.ti.com. Table1.FUNCTION TABLE INPUTS INPUT/OUTPUT FUNCTIONAEN IN L L S1 D port= S1 port L H S2 D port= S2 port H X Z Disconnect Table2. PIN DESCRIPTIONS PIN NAME DESCRIPTION S1,S2 AnalogvideoI/Os D AnalogvideoI/Os IN Selectinput EN Switch-enableinput

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www.ti.com SCDS276B –APRIL 2009–REVISED DECEMBER 2009 PARAMETER DEFINITIONS PARAMETER DESCRIPTION rON Resistancebetween theD and S portswiththeswitchintheON-state IOZ Outputleakagecurrentmeasured attheD and S portswiththeswitchintheOFF-state IOS Shortcircuitcurrentmeasured attheI/Opins. VIN VoltageattheIN pin VEN VoltageattheEN pin C IN Capacitanceatthecontrolinputs(EN, IN) C OFF CapacitanceattheanalogI/Oportwhen theswitchisOFF C ON CapacitanceattheanalogI/Oportwhen theswitchisON VIH Minimum inputvoltageforlogichighforthecontrolinputs(EN, IN) VIL Minimum inputvoltageforlogiclowforthecontrolinputs(EN, IN) VH Hysteresisvoltageatthecontrolinputs(EN, IN) VIK I/Oand controlinputsdiodeclamp voltage(EN, IN) VI VoltageappliedtotheD orS pinswhen D orS istheswitchinput. VO VoltageappliedtotheD orS pinswhen D orS istheswitchoutput. IIH Inputhighleakagecurrentofthecontrolinputs(EN, IN) IIL Inputlowleakagecurrentofthecontrolinputs(EN, IN) II CurrentintotheD orS pinswhen D orS istheswitchinput. IO CurrentintotheD orS pinswhen D orS istheswitchoutput. Ioff Outputleakagecurrentmeasured attheD and S portswithVCC = 0 Propagationdelaymeasured between 50% ofthedigitalinputto90% oftheanalogoutputwhen switchisturnedtON ON. Propagationdelaymeasured between 50% ofthedigitalinputto90% oftheanalogoutputwhen switchisturnedtOFF OFF. BW FrequencyresponseoftheswitchintheON-statemeasured at–3 dB Unwanted signalcoupledfromchanneltochannel.Measured in–dB.XTALK = 20 LOG VOUT /VIN.ThisisaXTALK non-adjacentcrosstalk. O IRR Off-isolationistheresistance(measuredin–dB) between theinputand outputwiththeswitchOFF. Magnitudevariationbetween analoginputand outputpinswhen theswitchisON and theDC offsetofcomposite D G videosignalvariesattheanaloginputpin.InNTSC standardthefrequencyofthevideosignalis3.58MHz and DC offsetisfrom0 to0.714V. Phase variationbetween analoginputand outputpinswhen theswitchisON and theDC offsetofcomposite D P videosignalvariesattheanaloginputpin.InNTSC standardthefrequencyofthevideosignalis3.58MHz and DC offsetisfrom0 to0.714V. ICC Staticpower supplycurrent ICCD VariationofICC fora change infrequencyinthecontrolinputs(EN, IN) Thisistheincreaseinsupplycurrentforeach controlinputthatisatthespecifiedvoltagelevel,ratherthanVCC orΔICC GND. Copyright© 2009,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLink(s):TS5V330C

SCDS276B –APRIL 2009–REVISED DECEMBER 2009 www.ti.com LOGIC DIAGRAM (POSITIVE LOGIC) ABSOLUTE MAXIMUM RATINGS (1) overoperatingfree-airtemperaturerange(unlessotherwisenoted) MIN MAX UNIT VCC Supplyvoltagerange –0.5 7 V VIN Controlinputvoltagerange(2)(3) –0.5 7 V VI/O Outputvoltagerange(2)(3)(4) –0.5 7 V IIK Controlinputclamp current VIN < 0 –50 mA II/OK I/Oportclamp current VI/O< 0 –50 mA II/O ON-stateswitchcurrent(5) ±128 mA ContinuouscurrentthroughVCC orGND ±100 mA Tstg Storagetemperaturerange –65 150 °C (1) Stressesbeyond thoselistedunder"absolutemaximum ratings"may cause permanentdamage tothedevice.These arestressratings only,and functionaloperationofthedeviceattheseorany otherconditionsbeyond thoseindicatedunder"recommended operating conditions"isnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmay affectdevicereliability. (2) Allvoltagesarewithrespecttogroundunlessotherwisespecified. (3) The inputand outputvoltageratingsmay be exceeded iftheinputand outputclamp-currentratingsareobserved. (4) VIand VO areused todenotespecificconditionsforVI/O. (5) IIand IO areused todenotespecificconditionsforII/O.

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www.ti.com SCDS276B –APRIL 2009–REVISED DECEMBER 2009 PACKAGE THERMAL IMPEDANCE overoperatingfree-airtemperaturerange(unlessotherwisenoted) UNIT D package(1) 73 DB package(1) 82 θJA Package thermalimpedance DBQ package(1) 90 °C/W PW package(1) 108 RGY package(2) 39 (1) The package thermalimpedance iscalculatedinaccordancewithJESD 51-7. (2) The package thermalimpedance iscalculatedinaccordancewithJESD 51-5. RECOMMENDED OPERATING CONDITIONS (1) MIN MAX UNIT VCC Supplyvoltage 4 5.5 V VIH High-levelcontrolinputvoltage(EN, IN) 2 5.5 V VIL Low-levelcontrolinputvoltage(EN, IN) 0 0.8 V VANALOG Analoginput/outputvoltage 0 Vcc V TA Operatingfree-airtemperature –40 85 °C (1) Allunused controlinputsofthedevicemust be heldatVCC orGND toensureproperdeviceoperation.RefertotheTIapplicationreport, ImplicationsofSlow orFloatingCMOS Inputs,literaturenumber SCBA004. Copyright© 2009,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLink(s):TS5V330C

SCDS276B –APRIL 2009–REVISED DECEMBER 2009 www.ti.com ELECTRICAL CHARACTERISTICS (1) overrecommended operatingfree-airtemperaturerange(unlessotherwisenoted) PARAMETER TEST CONDITIONS MIN TYP (2) MAX UNIT VIK EN, IN VCC = 4.5V, IIN = –18 mA –1.8 V VH EN, IN 400 mV IIH EN, IN VCC = 5.5V, VIN and VEN = VCC ±1 μA IIL EN, IN VCC = 5.5V, VIN and VEN = GND ±1 μA VO = 0 to5.5V,IOZ (3) VCC = 5.5V, SwitchOFF ±10 μAVI= 0, VO = 0 to5.5V,IOS VCC = 5.5V, SwitchON ±110 mAVI= 0, Ioff VCC = 0, VO = 0 to5.5V, VI= 0 ±1 μA ICC VCC = 5.5V, II/O= 0, SwitchON orOFF 3 μA ΔICC EN, IN VCC = 5.5V, One inputat3.4V, OtherinputsatVCC orGND 2.5 mA VCC = 5.5V, mA/ICCD D and S portsareopen, VIN switching50% dutycycle 0.25VEN = GND, MHz C in EN, IN VIN orVEN = 0 f= 1 MHz 3.5 pF D port SwitchOFF, 8.5 C OFF VI/O= 3 V or0, VIN = VCC orGND pF S port SwitchON, 5.5 C ON VI= 0, f= 1 MHz, outputsopen, SwitchON 16.5 pF VI= 1 V, IO = 13 mA, R L = 75 Ω 3 7 rON (4) VCC = 4.5V Ω VI= 2 V, IO = 26 mA, R L = 75 Ω 3 10 (1) VI,VO ,II,and IO refertotheI/Opins. (2) AlltypicalvaluesareatVCC = 5 V (unlessotherwisenoted),TA = 25°C. (3) ForI/Oports,theparameterIOZ includestheinputleakagecurrent. (4) Measured by thevoltagedropbetween theD and S terminalsattheindicatedcurrentthroughtheswitch.ON-stateresistanceis determinedby thelowerofthevoltagesofthetwo (S orD) terminals. SWITCHING CHARACTERISTICS overrecommended operatingfree-airtemperaturerange,VCC = 5 V ±10%, R L = 75 Ω,C L = 20 pF (unlessotherwisenoted) (seeFigure5) FROM TOPARAMETER MIN TYP MAX UNIT(INPUT) (OUTPUT) tON S D 1.5 6.0 ns tOFF S D 1.5 5.9 ns DYNAMIC CHARACTERISTICS overrecommended operatingfree-airtemperaturerange,VCC = 5 V ±10% (unlessotherwisenoted) PARAMETER TEST CONDITIONS MIN TYP (1) MAX UNIT D G R L = 150 Ω,f= 3.58MHz, see Figure6 0.24 % D P R L = 150 Ω,f= 3.58MHz, see Figure6 0.039 ° BW R L = 150 Ω,see Figure7 250 MHz XTALK R IN = 10 Ω,R L = 150 Ω,f= 10 MHz, see Figure7 –87 dB O IRR R L = 150 Ω,f= 10 MHz, see Figure7 –54 dB (1) AlltypicalvaluesareatVCC = 5 V (unlessotherwisenoted),TA = 25°C.

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-0.40 0.00 0.0 1.0 V (V)BIAS Differential Phase (°)Differential Gain (%) -0.455 -0.405 -0.35 -0.30 -0.25 -0.20 -0.15 -0.10 -0.05 -0.450 -0.445 -0.440 -0.435 -0.430 -0.425 -0.420 -0.415 -0.410 Differential phase at 0.714 V, 0.427° Differential gain at 0.714 V, 0.24% 1 10 100 1000 Frequency (MHz) Phase (°)Gain (dB) -70 -60 -50 -40 -30 -20 -10 Phase at = –3 dB, –35° Gain at -3 dB , 288 MHz -90 Frequency (MHz) Phase (°) Off Isolation (dB) 160 -80 -70 -60 -50 -40 -30 -20 -10 100 120 140 Off Isolation at 10 M z, –54.66 dB Phase at 10 MHz, 94.7° H 1 10 100 1000 Frequency (MHz) -90 Phase (°) Crosstalk (dB) 250 -80 -70 -60 -50 -40 -30 -20 -10 100 150 200 Phase at 10 MHz, –92.25° –46.99 dBCrosstalk at -10 MHz, Frequency (MHz) 1 10 100 1000 Frequency (MHz) TS5V330C www.ti.com SCDS276B –APRIL 2009–REVISED DECEMBER 2009 TYPICAL PERFORMANCE Figure1.Frequency Response Figure2.DifferentialGain/Phase vs VBIAS Figure3.OFF-Isolationvs Frequency Figure4.Crosstalkvs Frequency Copyright© 2009,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLink(s):TS5V330C

(see Note A) TEST CIRCUIT RL 50 Ω VG1 VCC D D UT 50 Ω VIN IN VS2 S2 EN VS1 VOLTAGE WAVEFORMS t and t TIMESON OFF tON tOFF 3 V 0 V 3 V 0 V Output Control (VIN) Analog Output Waveform (V )O 50% 50% 90% 90% TEST CLRL VS2 5 V ± 0.5 V 5 V ± 0.5 V 5 V ± 0.5 V 5 V ± 0.5 V VCC VS1 tON tOFF 75 Ω 75 Ω 75 Ω 75 Ω GND GND GND GND 3 V 3 V 3 V 3 V 20 pF 20 pF 20 pF 20 pF Input Generator VO TS5V330C SCDS276B –APRIL 2009–REVISED DECEMBER 2009 www.ti.com PARAMETER MEASUREMENT INFORMATION A. C L includesprobeand jigcapacitance. B. Allinputpulsesare suppliedby generatorshaving the followingcharacteristics:PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5ns,tf≤2.5ns. C. The outputsaremeasured one ata timewithone transitionpermeasurement. Figure5. TestCircuitand VoltageWaveforms

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Ω TS5V330C www.ti.com SCDS276B –APRIL 2009–REVISED DECEMBER 2009 PARAMETER MEASUREMENT INFORMATION (continued) Foradditionalinformation,refertotheTIapplicationreport,MeasuringDifferentialGain and Phase,literaturenumber SLOA040. Figure6. TestCircuitforDifferentialGain/Phase Measurement The differentialgainand phase ismeasured attheoutputoftheON channel.For example,when VIN = 0,VEN = 0,and D A istheinput,theoutputismeasured atS1A. HP8753ES Setup Average= 20 RBW = 300 Hz Smoothing= 2% VBIAS = 0 to1 V ST = 1.381s. P1 = –7 dBM CW frequency= 3.58MHz Copyright© 2009,Texas InstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLink(s):TS5V330C

Ω TS5V330C SCDS276B –APRIL 2009–REVISED DECEMBER 2009 www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) Figure7. TestCircuitforFrequency Response, Crosstalk,and OFF-Isolation The frequencyresponseismeasured attheoutputoftheON channel.For example,when VIN = 0,VEN = 0,and D A istheinput,theoutputismeasured atS1A.Allunused analogI/OportsareheldatVCC orGND. The crosstalkismeasured attheoutputofthenon-adjacentON channel.For example,when VIN = 0,VEN = 0, and D A istheinput,theoutputismeasured atS1B.Allunused analogI/OportsareheldatVCC orGND. The off-isolationismeasured attheoutputoftheOFF channel.For example,when VIN = 0,VEN = VCC ,and D A is theinput,theoutputismeasured atS1A.Allunused analogI/OportsareheldatVCC orGND. HP8753ES Setup Average= 4 RBW = 3 kHz Smoothing= 0% VBIAS = 0.35V ST = 2 s P1 = 0 dBM

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www.ti.com 11-Nov-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) TS5V330CDBQR Active Production SSOP (DBQ) | 16 2500 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 85 TE330C TS5V330CDBQR.B Active Production SSOP (DBQ) | 16 2500 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 85 TE330C TS5V330CDR Active Production SOIC (D) | 16 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 TS5V330C TS5V330CDR.B Active Production SOIC (D) | 16 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 TS5V330C TS5V330CPWR Active Production TSSOP (PW) | 16 2000 | LARGE T&R Yes NIPDAU | SN Level-1-260C-UNLIM -40 to 85 TE330C TS5V330CPWR.B Active Production TSSOP (PW) | 16 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 TE330C TS5V330CPWRG4 Active Production TSSOP (PW) | 16 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 TE330C TS5V330CPWRG4.B Active Production TSSOP (PW) | 16 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 TE330C (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1

www.ti.com 11-Nov-2025 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 7-Oct-2025 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 7-Oct-2025 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TS5V330CDBQR SSOP DBQ 16 2500 353.0 353.0 32.0 TS5V330CDR SOIC D 16 2500 353.0 353.0 32.0 TS5V330CPWR TSSOP PW 16 2000 356.0 356.0 35.0 TS5V330CPWRG4 TSSOP PW 16 2000 353.0 353.0 32.0 Pack Materials-Page 2

www.ti.com PACKAGE OUTLINE C 14X 0.65 4.55 16X 0.30 0.17 6.6

6.2 TYP

1.2 MAX

0.15 0.05 0.25 GAGE PLANE 0 -8 4X (0 -12 ) B 4.5 4.3 NOTE 4 A 5.1 4.9 NOTE 3 0.75 0.50 (0.15) TYP TSSOP - 1.2 mm max heightPW0016A SMALL OUTLINE PACKAGE 4220204/B 12/2023

0.1 C A B

0.1 C NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO-153. SEATING PLANE A 20 DETAIL A TYPICAL SCALE 2.500

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0.05 MAX

0.05 MIN

16X (1.5) 16X (0.45) 14X (0.65) (5.8) (R0.05) TYP TSSOP - 1.2 mm max heightPW0016A SMALL OUTLINE PACKAGE 4220204/B 12/2023 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 10X SYMM SYMM 8 9 15.000 METALSOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK OPENING EXPOSED METALEXPOSED METAL SOLDER MASK DETAILS NON-SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED

www.ti.com EXAMPLE STENCIL DESIGN 16X (1.5) 16X (0.45) 14X (0.65) (5.8) (R0.05) TYP TSSOP - 1.2 mm max heightPW0016A SMALL OUTLINE PACKAGE 4220204/B 12/2023 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE: 10X SYMM SYMM 8 9

www.ti.com PACKAGE OUTLINE C TYP-.244.228 -6.195.80[ ] .069 MAX [1.75] 14X .0250 [0.635] 16X -.012.008 -0.300.21[ ] .175 [4.45] TYP-.010.005 -0.250.13[ ] - 8 -.010.004 -0.250.11[ ] (.041 ) [1.04] .010 [0.25] GAGE PLANE -.035.016 -0.880.41[ ] A NOTE 3 -.197.189 -5.004.81[ ] B NOTE 4 -.157.150 -3.983.81[ ] SSOP - 1.75 mm max heightDBQ0016A SHRINK SMALL-OUTLINE PACKAGE 4214846/A 03/2014 NOTES: 1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed .006 inch, per side. 4. This dimension does not include interlead flash. 5. Reference JEDEC registration MO-137, variation AB. 1 16 .007 [0.17] C A B PIN 1 ID AREA SEATING PLANE .004 [0.1] C SEE DETAIL A DETAIL A TYPICAL SCALE 2.800

www.ti.com EXAMPLE BOARD LAYOUT .002 MAX [0.05] ALL AROUND .002 MIN [0.05] ALL AROUND (.213) [5.4] 14X (.0250 ) [0.635] 16X (.063) [1.6] 16X (.016 ) [0.41] SSOP - 1.75 mm max heightDBQ0016A SHRINK SMALL-OUTLINE PACKAGE 4214846/A 03/2014 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. METAL SOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDER MASK DETAILS OPENING SOLDER MASK METAL SOLDER MASK DEFINED LAND PATTERN EXAMPLE SCALE:8X SYMM 8 9 SEE DETAILS

www.ti.com EXAMPLE STENCIL DESIGN 16X (.063) [1.6] 16X (.016 ) [0.41] 14X (.0250 ) [0.635] (.213) [5.4] SSOP - 1.75 mm max heightDBQ0016A SHRINK SMALL-OUTLINE PACKAGE 4214846/A 03/2014 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON .005 INCH [0.127 MM] THICK STENCIL SCALE:8X SYMM SYMM 8 9

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