TS5N118PWG4

TS5N118_101 TI | Alldatasheet

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A NC OE GND VCC DBQ OR PW PACKAGE (TOP VIEW) NC − No internal connection DESCRIPTION/ORDERING INFORMATION TS5N118 1-OF-8 FET MULTIPLEXER/DEMULTIPLEXER HIGH-BANDWIDTH BUS SWITCH SCDS205 AUGUST 2005 PCI Interface Low and Flat ON-State Resistance on Characteristics Over Operating Range Differential Signal Interface on Ω Typ) Memory Interleaving to 10-V Switching on Data I/O Ports Bus Isolation Low-Distortion Signal Gating Bidirectional Data Flow With Near-Zero Propagation Delay Low Input/Output Capacitance Minimizes Loading and Signal Distortion io(OFF) pF Max, B Port) V CC Operating Range From 4.75 V to 5.25 V Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Performance Tested Per JESD 2000-V Human-Body Model (A114-B, Class II) 1000-V Charged-Device Model (C101) Supports Both Digital and Analog a high-bandwidth FET bus switch utilizing a charge pump to elevate the gate voltage of the pass transistor, providing a low and flat ON-state resistance on The low and flat ON-state resistance allows for minimal propagation delay and supports rail-to-rail switching on the data input/output (I/O) ports. The device also bus. Specifically designed to support high-bandwidth applications, the TS5N118 provides an optimized interface solution ideally suited for broadband communications, networking, and data-intensive computing systems. The TS5N118 is a 1-of-8 multiplexer/demultiplexer with a single output-enable OE input. The select (S0, S1, S2) inputs control the data path of the multiplexer/demultiplexer. When OE is low, the multiplexer/demultiplexer is enabled and the A port is connected to the B port, allowing bidirectional data flow between ports. When OE is high, the multiplexer/demultiplexer is disabled and a high-impedance state exists between the A and B ports. This device is fully specified for partial-power-down I off The I off circuitry prevents damaging current backflow through the device when it is powered down. The device has isolation during power off. To ensure the high-impedance state during power up or power down, OE should be tied to V CC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. ORDERING INFORMATION T A PACKAGE (1) ORDERABLE PART NUMBER TOP-SIDE MARKING SSOP (QSOP) DBQ Tape and reel TS5N118DBQR C to C YB118 TSSOP PW Tape and reel TS5N118PWR (1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical sheet. PRODUCTION DATA information is current as of publication date. Copyright 2005, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

www.ti.com B1A OE SW SW SW SW SW SW SW SW TS5N118 1-OF-8 FET MULTIPLEXER/DEMULTIPLEXER HIGH-BANDWIDTH BUS SWITCH SCDS205 AUGUST 2005 FUNCTION TABLE INPUTS INPUT/OUTPUT FUNCTION A OE L L L L A port port L L L H A port port L L H L A port port L L H H A port port L H L L A port port L H L H A port port L H H L A port port L H H H A port port H X X X Z Disconnect LOGIC DIAGRAM (POSITIVE LOGIC)

www.ti.com A EN(1) B (1) EN is the internal enable signal applied to the switch. Charge Pump VCC Absolute Maximum Ratings (1) Recommended Operating Conditions (1) TS5N118 1-OF-8 FET MULTIPLEXER/DEMULTIPLEXER HIGH-BANDWIDTH BUS SWITCH SCDS205 AUGUST 2005 SIMPLIFIED SCHEMATIC, EACH FET SWITCH (SW) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT V CC Supply voltage range 0.5 V V IN Control input voltage range (2) (3) 0.5 V V I/O Switch I/O voltage range (2) (3) (4) 0.5 V I I/O ON-state switch current (5) 100 mA Continuous current through V CC or GND 100 mA DBQ package θ JA Package thermal impedance (6) C/W PW package 108 T stg Storage temperature range 150 C (1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are with respect to ground, unless otherwise specified. (3) The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. (4) V I and V O are used to denote specific conditions for V I/O (5) I I and I O are used to denote specific conditions for I I/O (6) The package thermal impedance is calculated in accordance with JESD 51-7. MIN MAX UNIT V CC Supply voltage 4.75 5.25 V V IH High-level control input voltage 5.25 V V IL Low-level control input voltage 0.8 V V I/O Data input/output voltage V T A Operating free-air temperature C (1) All unused inputs of the device must be held at V CC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs literature number SCBA004.

www.ti.com Electrical Characteristics (1) Switching Characteristics Dynamic Characteristics TS5N118 1-OF-8 FET MULTIPLEXER/DEMULTIPLEXER HIGH-BANDWIDTH BUS SWITCH SCDS205 AUGUST 2005 over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP (2) MAX UNIT I IN Control inputs V CC 5.25 V IN to V CC µ A V O to Switch OFF, V CC 5.25 V I V IN V CC or GND I OZ (3) µ A V CC V O Open, V I to V I I/O I CC V CC 5.25 V IN V CC or GND mA Switch ON or OFF, C in Control inputs V CC V IN V or pF Switch OFF, 120 A port V CC V I/O V or V IN V CC or GND, C io(OFF) pF Switch OFF, B port V CC V I/O V or V IN V CC or GND, Switch ON, 160 C io(ON) V CC V I/O V or pF V IN V CC or GND, V I I O mA 7.5 V CC 4.75 r on (4) V I I O mA 7.5 Ω TYP at V CC V V I I O mA 12.5 (1) V IN and I IN refer to control inputs. V I V O I I and I O refer to data pins (2) All typical values are at V CC V (unless otherwise noted), T A (3) For I/O ports, the parameter I OZ includes the I/O leakage current. (4) Measured by the voltage drop between the A and B terminals at the indicated current through the switch. ON-state resistance is determined by the lower of the voltages of the two or terminals. over recommended operating free-air temperature range (unless otherwise noted) (see Figure V CC V FROM TO 0.25 V PARAMETER UNIT (INPUT) (OUTPUT) MIN MAX t pd (1) A or B B or A 0.1 ns t pd(s) S A 200 ns S B 200 t en ns OE A or B 200 S B 200 t dis ns OE A or B 200 (1) The propagation delay is the calculated RC time constant of the typical ON-state resistance of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance). over recommended operating free-air temperature range, V CC V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP (1) MAX UNIT Bandwidth (BW) (2) R L Ω V I 0.632 V (P-P), See Figure MHz OFF isolation ISO R L Ω V I 0.632 V (P-P), f MHz, See Figure dB Crosstalk TALK R L Ω V I 0.632 V (P-P), f MHz, See Figure dB (1) All typical values are at V CC V (unless otherwise noted), T A (2) Bandwidth is the frequency at which the gain is dB below the DC gain.

www.ti.com TYPICAL PERFORMANCE 0 1 2 3 4 5 6 7 8 9 10 VI − V TA = 25° C ron − ON-State Resistance − Ω −12 −10 −70 −60 −50 −40 −30 −20 −10 Gain − dB f − Frequency − MHz 0.1 500 Phase Margin − Deg 1 10 100 Gain Phase TS5N118 1-OF-8 FET MULTIPLEXER/DEMULTIPLEXER HIGH-BANDWIDTH BUS SWITCH SCDS205 AUGUST 2005 Figure Typical r on vs V I V CC V and I O mA Figure Frequency Response vs Bandwidth

www.ti.com TYPICAL PERFORMANCE −40 −20 100 120 140 160 −100 −80 −60 −40 −20 Gain − dB f − Frequency − MHz 0.1 500 Phase Margin − Deg 1 10 100 Gain Phase −120 −100 −80 −60 −40 −20 −180 −140 −100 −60 −20 100 140 180 Gain − dB 0.1 500 Phase Margin − Deg 1 10 100 Gain Phase f − Frequency − MHz TS5N118 1-OF-8 FET MULTIPLEXER/DEMULTIPLEXER HIGH-BANDWIDTH BUS SWITCH SCDS205 AUGUST 2005 Figure Frequency Response vs OFF Isolation Figure Frequency Response vs Crosstalk

www.ti.com PARAMETER MEASUREMENT INFORMATION VOH VOL CL (see Note A) TEST CIRCUIT

2 VCC

S1 at 2 × VCC (see Note B) Output Waveform 2 S1 at GND (see Note B) tPZL tPZH tPLZ tPHZ VCC 0 V VOH VOL 0 V VOL + VΔ VOH − VΔ 0 V Output Control (VIN) VCC VOH VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES (tpd(s)) VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES Output NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ /char????????10 MHz, ZO = 50 Ω , tr </char????????25 ns, tf </char????????25 ns. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd(s). The tpd propagation delay is the calculated RC time constant of the typical ON-state resistance of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance). H. All parameters and waveforms are not applicable to all devices. 50 Ω VG1 VCC DUT 50 Ω VIN 50 Ω VG2 50 Ω VI TEST RLS1 VΔCL VCC VI tPHZ/tPZH tPLZ/tPZL tpd(s)† Open 100 Ω 100 Ω 100 Ω VCC GND VCC 35 pF 35 pF 35 pF 0.3 V 0.3 V Output Control (VIN) Input Generator Input Generator VCC/2 VCC/2 VCC/2 VCC/2 VCC/2 VCC/2 VCC/2 VCC/2 VO † tpds is measured with Demux inputs at opposite voltage levels, i.e. VB1 = 5 V, VB2 = GND. TS5N118 1-OF-8 FET MULTIPLEXER/DEMULTIPLEXER HIGH-BANDWIDTH BUS SWITCH SCDS205 AUGUST 2005 Figure Test Circuit and Voltage Waveforms

www.ti.com PARAMETER MEASUREMENT INFORMATION VCC GND B2−B8 A Channel ON: B1 to A Network Analyzer Setup Source Power = 0 dBM (632-mV P-P at 50- load) DC Bias = 350 mV Network Analyzer Source Signal B2−B8 A Channel OFF: B2−B8 to A Network Analyzer Setup Source Power = 0 dBM (632-mV P-P at 50- load) DC Bias = 350 mV VCC GND Network Analyzer Source Signal B2−B8 A Channel ON: B1 to A Network Analyzer Setup Source Power = 0 dBM (632-mV P-P at 50- load) DC Bias = 350 mV VCC GND Source Signal Channel OFF: B2−B8 to A Network Analyzer TS5N118 1-OF-8 FET MULTIPLEXER/DEMULTIPLEXER HIGH-BANDWIDTH BUS SWITCH SCDS205 AUGUST 2005 Figure Bandwidth (BW) Figure OFF Isolation ISO Figure Crosstalk TALK

www.ti.com MECHNICAL DATA DBQ (R-PDSO-G) 4073301/F 02/2002 0.069 (1,75) MAX Seating Plane 0.004 (0,10) 0.010 (0,25) 0.010 (0,25) 0.016 (0,40) 0.035 (0,89) 0.244 (6,20) 0.228 (5,80) 1 12 24 13 0.150 (3,81) 0° −8° Gauge Plane 0.012 (0,30) 0.008 (0,20) 0.197 (5,00) (4,80) 0.189 A MAX A MIN PINS DIM 16 0.337 (8,56) (8,74) 0.344 20 24 A (8,74) 0.344 (8,56) 0.337 0.394 (10,01) 0.386 (9,80) M0−137 VARIATION AB AD AE AFD 0.004 (0,10) NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15). D. Falls within JEDEC MO−137. TS5N118 1-OF-8 FET MULTIPLEXER/DEMULTIPLEXER HIGH-BANDWIDTH BUS SWITCH SCDS205 AUGUST 2005

www.ti.com MECHNICAL DATA PW (R-PDSO-G**)

14 PINS SHOWN

0,65 M0,10 0,10 0,25 0,50 0,75 0,15 NOM Gage Plane 9,80 9,60 7,90 7,70 2016 6,60 6,40 4040064/F 01/97 0,30 6,60 6,20 0,19 4,30 4,50 0,15 A 1,20 MAX 5,10 4,90 3,10 2,90 A MAX A MIN DIM PINS ** 0,05 4,90 5,10 Seating Plane 0° − 8° NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-153 TS5N118 1-OF-8 FET MULTIPLEXER/DEMULTIPLEXER HIGH-BANDWIDTH BUS SWITCH SCDS205 AUGUST 2005

Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) TS5N118DBQR ACTIVE SSOP/ QSOP DBQ 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TS5N118DBQRE4 ACTIVE SSOP/ QSOP DBQ 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TS5N118DBQRG4 ACTIVE SSOP/ QSOP DBQ 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TS5N118PW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS5N118PWE4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS5N118PWG4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS5N118PWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS5N118PWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS5N118PWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (1)The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2)Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontentfor the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS):TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br):TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. PACKAGE OPTION ADDENDUM www.ti.com 24-May-2007 Addendum-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 30-Jul-2010 Pack Materials-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TS5N118PWR TSSOP PW 16 2000 346.0 346.0 29.0 PACKAGE MATERIALS INFORMATION www.ti.com 30-Jul-2010 Pack Materials-Page 2

MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 0,65 M0,10 0,10 0,25 0,50 0,75 0,15 NOM Gage Plane 9,80 9,60 7,90 7,70 2016 6,60 6,40 4040064/F 01/97 0,30 6,60 6,20 0,19 4,30 4,50 0,15 A 1,20 MAX 5,10 4,90 3,10 2,90 A MAX A MIN DIM PINS ** 0,05 4,90 5,10 Seating Plane 0°–8° NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-153

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