TS5L100RGYRG4

TS5L100 TI | Alldatasheet

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/C0084/C0083/C0053/C0076/C0049/C0048/C0048 /C0081/C0085/C0065/C0068 /C0083/C0080/C0068/C0084 /C0087/C0073/C0068/C0069/C0262/C0066/C0065/C0078/C0068/C0087/C0073/C0068/C0084/C0072 /C0076/C0065/C0078 /C0083/C0087/C0073/C0084/C0067/C0072 /C0087/C0073/C0084/C0072 /C0076/C0079/C0087 /C0079/C0078/C0262/C0083/C0084/C0065/C0084/C0069 /C0082/C0069/C0083/C0073/C0083/C0084/C0065/C0078/C0067/C0069 SCDS163A − MAY 2004 − REVISED MAY 2004 1POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 /C0068Wide Bandwidth (BW = 300 MHz Min) /C0068Low Differential Crosstalk (XTALK = −60 dB Typ) /C0068Low Power Consumption (ICC = 3 /C0109A Max) /C0068Bidirectional Data Flow, With Near-Zero Propagation Delay /C0068Low ON-State Resistance (ron = 3 /C0087 Typ) /C0068VCC Operating Range From 6 V to 6.5 V /C0068Ioff Supports Partial-Power-Down Mode Operation /C0068Data and Control Inputs Provide Undershoot Clamp Diode /C0068Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II /C0068ESD Performance Tested Per JESD 22 − 2000-V Human-Body Model (A114-B, Class II) − 1000-V Charged-Device Model (C101) /C0068Suitable for Both 10 Base-T/100 Base-T Signaling D OR DBQ PACKAGE (TOP VIEW) S IA0 IA1 YA IB0 IB1 YB GND VCC E ID0 ID1 YD IC0 IC1 YC NC S IA0 IA1 YA IB0 IB1 YB GND NC NC VCC E ID0 ID1 YD IC IC1 YC NC PW PACKAGE (TOP VIEW) RGY PACKAGE (TOP VIEW) 11 6 E ID0 ID1 YD IC0 IC1 IA0 IA1 YA IB0 IB1 YB S YC V GND CC NC − No internal connection description/ordering information The TI TS5L100 LAN switch is a 4-bit 1-of-2 multiplexer/demultiplexer with a single switch-enable (E) input. When E is low, the switch is enabled and the I port is connected to the Y port. When E is high, the switch is disabled and the high-impedance state exists between the I and Y ports. The select (S) input controls the data path of the multiplexer/demultiplexer.

ORDERING INFORMATION

TA PACKAGE † ORDERABLE PART NUMBER TOP-SIDE MARKING QFN − RGY Tape and reel TS5L100RGYR TG100 SOIC − D Tube TS5L100D TS5L100 0°C to 70°C SOIC − D Tape and reel TS5L100DR TS5L100 0°C to 70°C SSOP (QSOP) − DBQ Tape and reel TS5L100DBQR TG100 TSSOP − PW Tube TS5L100PW TG100TSSOP − PW Tape and reel TS5L100PWR TG100 † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Copyright  2004, Texas Instruments Incorporated Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. /C0080/C0082/C0079/C0068/C0085/C0067/C0084/C0073/C0079/C0078 /C0068/C0065/C0084/C0065 /C0105/C0110/C0102/C0111/C0114/C0109/C0097/C0116/C0105/C0111/C0110 /C0105/C0115 /C0099/C0117/C0114/C0114/C0101/C0110/C0116 /C0097/C0115 /C0111/C0102 /C0112/C0117/C0098/C0108/C0105/C0099/C0097/C0116/C0105/C0111/C0110 /C0100/C0097/C0116/C0101/C0046 /C0080/C0114/C0111/C0100/C0117/C0099/C0116/C0115 /C0099/C0111/C0110/C0102/C0111/C0114/C0109 /C0116/C0111 /C0115/C0112/C0101/C0099/C0105/C0102/C0105/C0099/C0097/C0116/C0105/C0111/C0110/C0115 /C0112/C0101/C0114 /C0116/C0104/C0101 /C0116/C0101/C0114/C0109/C0115 /C0111/C0102 /C0084/C0101/C0120/C0097/C0115 /C0073/C0110/C0115/C0116/C0114/C0117/C0109/C0101/C0110/C0116/C0115 /C0115/C0116/C0097/C0110/C0100/C0097/C0114/C0100 /C0119/C0097/C0114/C0114/C0097/C0110/C0116/C0121/C0046 /C0080/C0114/C0111/C0100/C0117/C0099/C0116/C0105/C0111/C0110 /C0112/C0114/C0111/C0099/C0101/C0115/C0115/C0105/C0110/C0103 /C0100/C0111/C0101/C0115 /C0110/C0111/C0116 /C0110/C0101/C0099/C0101/C0115/C0115/C0097/C0114/C0105/C0108/C0121 /C0105/C0110/C0099/C0108/C0117/C0100/C0101 /C0116/C0101/C0115/C0116/C0105/C0110/C0103 /C0111/C0102 /C0097/C0108/C0108 /C0112/C0097/C0114/C0097/C0109/C0101/C0116/C0101/C0114/C0115/C0046

/C0084/C0083/C0053/C0076/C0049/C0048/C0048 /C0081/C0085/C0065/C0068 /C0083/C0080/C0068/C0084 /C0087/C0073/C0068/C0069/C0262/C0066/C0065/C0078/C0068/C0087/C0073/C0068/C0084/C0072 /C0076/C0065/C0078 /C0083/C0087/C0073/C0084/C0067/C0072 /C0087/C0073/C0084/C0072 /C0076/C0079/C0087 /C0079/C0078/C0262/C0083/C0084/C0065/C0084/C0069 /C0082/C0069/C0083/C0073/C0083/C0084/C0065/C0078/C0067/C0069 SCDS163A − MAY 2004 − REVISED MAY 2004

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description/ordering information (continued) This device can be used to replace mechanical relays in LAN applications. This device has low ron, wide bandwidth, and low differential crosstalk, making it suitable for 10 Base-T, 100 Base-T, and various other LAN applications. This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging current will not backflow through the device when it is powered down. The device has isolation during power off. To ensure the high-impedance state during power up or power down, E should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. FUNCTION TABLE INPUTS INPUT/OUTPUT FUNCTIONE S INPUT/OUTPUT YX FUNCTION L L IX0 YX = IX0 L HI X 1 YX = IX1 H X Z Disconnect PIN DESCRIPTIONS PIN NAME DESCRIPTION IAn−IDn Data I/Os S Select input E Enable input YA−YD Data I/Os

/C0084/C0083/C0053/C0076/C0049/C0048/C0048 /C0081/C0085/C0065/C0068 /C0083/C0080/C0068/C0084 /C0087/C0073/C0068/C0069/C0262/C0066/C0065/C0078/C0068/C0087/C0073/C0068/C0084/C0072 /C0076/C0065/C0078 /C0083/C0087/C0073/C0084/C0067/C0072 /C0087/C0073/C0084/C0072 /C0076/C0079/C0087 /C0079/C0078/C0262/C0083/C0084/C0065/C0084/C0069 /C0082/C0069/C0083/C0073/C0083/C0084/C0065/C0078/C0067/C0069 SCDS163A − MAY 2004 − REVISED MAY 2004 3POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 logic diagram (positive logic) YA IA0 IA1 IB0 IB1 IC0 IC1 ID0 ID1 E S YC YB YD Control Logic

/C0084/C0083/C0053/C0076/C0049/C0048/C0048 /C0081/C0085/C0065/C0068 /C0083/C0080/C0068/C0084 /C0087/C0073/C0068/C0069/C0262/C0066/C0065/C0078/C0068/C0087/C0073/C0068/C0084/C0072 /C0076/C0065/C0078 /C0083/C0087/C0073/C0084/C0067/C0072 /C0087/C0073/C0084/C0072 /C0076/C0079/C0087 /C0079/C0078/C0262/C0083/C0084/C0065/C0084/C0069 /C0082/C0069/C0083/C0073/C0083/C0084/C0065/C0078/C0067/C0069 SCDS163A − MAY 2004 − REVISED MAY 2004

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absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltages are with respect to ground, unless otherwise specified. 2. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 3. VI and VO are used to denote specific conditions for VI/O. 4. II and IO are used to denote specific conditions for II/O. 5. The package thermal impedance is calculated in accordance with JESD 51-7. 6. The package thermal impedance is calculated in accordance with JESD 51-5. recommended operating conditions (see Note 7) MIN MAX UNIT VCC Supply voltage 6 6.5 V VIH High-level control input voltage (E, S) 2.5 6.5 V VIL Low-level control input voltage (E, S) 0 0.8 V TA Operating free-air temperature 0 70 °C NOTE 7: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

/C0084/C0083/C0053/C0076/C0049/C0048/C0048 /C0081/C0085/C0065/C0068 /C0083/C0080/C0068/C0084 /C0087/C0073/C0068/C0069/C0262/C0066/C0065/C0078/C0068/C0087/C0073/C0068/C0084/C0072 /C0076/C0065/C0078 /C0083/C0087/C0073/C0084/C0067/C0072 /C0087/C0073/C0084/C0072 /C0076/C0079/C0087 /C0079/C0078/C0262/C0083/C0084/C0065/C0084/C0069 /C0082/C0069/C0083/C0073/C0083/C0084/C0065/C0078/C0067/C0069 SCDS163A − MAY 2004 − REVISED MAY 2004 5POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 electrical characteristics over recommended operating free-air temperature range, VCC = 6 V to 6.5 V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP † MAX UNIT VIK E, S VCC = 6 V, IIN = −18 mA −1.8 V Vhys E, S 150 mV VO VI = 4.5 V, E = low, R L = 100 Ω, see Figure 11 3.7 4.06 V IIH E, S VCC = 6.5 V, VIN = VCC ±1 µA IIL E, S VCC = 6.5 V, VIN = GND ±1 µA IOZ ‡ VCC = 6.5 V, VO = 0 to 6.5 V, VI = 0, Switch OFF ±1 µA IOS § VCC = 6.5 V, VO = 0 to 0.5 VCC , VI = 0, Switch ON 50 mA Ioff VCC = 0, VO = 0 to 6.5 V, VI = 0 1 µA ICC VCC = 6.5 V, II/O = 0, Switch ON or OFF 3 µA ∆ICC E, S VCC = 6.5 V, One input at 3.4 V, Other inputs at VCC or GND 6 mA ICCD VCC = 6.5 V, I and Y ports open, VIN input switching 50% duty cycle 0.35 mA/ MHz C IN E, S f = 1 MHz 3.5 pF C OFF I port VI = 0, f = 1 MHz, Switch OFF 4.5 pFC OFF Y port VI = 0, f = 1 MHz, Outputs open, Switch OFF 6.5 pF C ON VI = 0, f = 1 MHz, Outputs open, Switch ON 14 pF ron VI = 4.5 V, Switch ON, R L = 100 Ω, see Figure 11 7.5 11.2 19 Ωron M2 VI = 4.5 V, Switch ON, R L = 100 Ω, see Figure 11 2 3 6 Ω ∆ron VI = 4.5 V, Switch ON 1 2 Ω VI, VO , II, and IO refer to I/O pins. VIN refers to the control inputs. † All typical values are at VCC = 6.2 V (unless otherwise noted), TA = 25°C. ‡ For I/O ports, IOZ includes the input leakage current. § The IOS test is applicable to only one ON channel at a time. The duration of this test is less than one second. switching characteristics over recommended operating free-air temperature range, VCC = 6 V to 6.5 V, RL = 100 Ω, CL = 35 pF (unless otherwise noted) (see Figure 7) PARAMETER FROM (INPUT) TO (OUTPUT) MIN MAX UNIT tON S Y 7 ns tOFF S Y 4 ns † All typical values are at VCC = 6.2 V (unless otherwise noted), TA = 25°C. dynamic characteristics over recommended operating free-air temperature range, VCC = 6 V to 6.5 V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP † MAX UNIT XTALK (Diff) R L = 100 Ω, f = 10 MHz, see Figure 12, tr = tf = 2 ns −40 −60 dB XTALK R L = 100 Ω, f = 30 MHz, see Figure 9 −50 dB O IRR R L = 100 Ω, f = 30 MHz, see Figure 10 −40 dB BW R L = 100 Ω, see Figure 8 350 MHz † All typical values are at VCC = 6.2 V (unless otherwise noted), TA = 25°C.

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Figure 1. ron and VO vs VI Over Temperature (VCC = 6 V)

Figure 2. ron and VO vs VI (VCC = 6.2 V and TA = 25/C0053C)

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Figure 3. Gain/Phase vs Frequency

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Figure 6. Differential Crosstalk

NOTES: A. C L includes probe and jig capacitance. B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns. C. The outputs are measured one at a time, with one transition per measurement. Figure 7. Test Circuit and Voltage Waveforms

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Figure 8. Test Circuit for Frequency Response (BW) input, the output is measured at IA0. All unused analog I/O ports are left open.

† A 50-Ω termination resistor is needed for the network analyzer. Figure 9. Test Circuit for Crosstalk (XTALK ) are connected to GND through 50-Ω pulldown resistors.

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† A 50-Ω termination resistor is needed for the network analyzer. Figure 10. Test Circuit for Off Isolation (OIRR) GND through 50-Ω pulldown resistors.

Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) TS5L100D ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS5L100DBQR ACTIVE SSOP/ QSOP DBQ 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1YEAR TS5L100DBQRE4 ACTIVE SSOP/ QSOP DBQ 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1YEAR TS5L100DE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS5L100DR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS5L100DRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS5L100PW ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS5L100PWE4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS5L100PWR ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS5L100PWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS5L100RGYR ACTIVE QFN RGY 16 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1YEAR TS5L100RGYRG4 ACTIVE QFN RGY 16 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1YEAR (1)The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontentfor the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS):TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br):TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. PACKAGE OPTION ADDENDUM www.ti.com 30-Aug-2005 Addendum-Page 1

MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE

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0,65 M0,10 0,10 0,25 0,50 0,75 0,15 NOM Gage Plane 9,80 9,60 7,90 7,70 2016 6,60 6,40 4040064/F 01/97 0,30 6,60 6,20 0,19 4,30 4,50 0,15 A 1,20 MAX 5,10 4,90 3,10 2,90 A MAX A MIN DIM PINS ** 0,05 4,90 5,10 Seating Plane 0°–8° NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-153

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