TS51224-M000WCSR

Semtech Corporation

Wireless Power Receiver and Battery Charger

Manufacturer: Semtech Corporation

Document: 20 Pages / 445Kb

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Technical content

Features

40V maximum input voltage
Single-cell Li-Ion or Li-Polymer charger with programmable charging current and topoff voltage
System rail available with deeply discharged battery
Integrated switches for narrow VDC power path management
Supports Qi, AirFuel Inductive and Resonant (PMA, A4WP) and proprietary charging standards
Up to 2W combined system/battery power
Better than 87% AC-DC efficiency to the system
Better than 83% AC-DC efficiency to the battery
Integrated switches for load modulation
Integrated frequency detection to support bidirectional communication
TX to RX CPU alert or reset signal
Integrated minimum load current sink
Thermal shutdown at 130⁰C junction temperature and over-current protection
Low external component count
Junction operating temperature -40⁰C to 125⁰C
Product is lead-free, halogen-free, RoHS / WEEE compliant Typical Application Circuit

Description

TS51224 is a fully-integrated wireless power receiver and battery charger for low-power, wearable applications that require a low-cost and space-saving solution. The TS51224 can operate by itself as a single-chip wireless power receiver in proprietary applications. It can also operate in conjunction with a wireless power controller or an application microcontroller to support the Qi, PMA or A4WP wireless charging standards as well as proprietary standards up to 2W combined system/battery power.

Applications

Wearables o Watches o Bracelets o Fitness Bands o Smart Jewelry o Smart Glasses
Health Monitors
Electric Toothbrushes
Tablets
Wireless Keyboard and Mouse
Medical Applications
Wireless Headsets
ID Tags
Augmented Reality

June 19, 2017 Re v. 1. 0 Semtech www.semtech.com 2 of 20 Ball Configuration Figure 1: TS51224 Ball Configuration (Top view with ball 1 designator)

June 19, 2017 Re v. 1. 0 Semtech www.semtech.com 3 of 20 Ball Description Ball Number Ball Name Function Description A4 BST Bootstrap capacitor Bootstrap capacitor for buck regulator high-side driver, capacitor between BST pin and SW pin B4 CHG_DIS Charge disable Disables battery charging when pulled high A3 COMM1 Load modulation switch Pull-down for VAC1 modulation capacitor E3 COMM2 Load modulation switch Pull-down for VAC2 modulation capacitor C4 EOC End-of-Charge indicator Toggles low when the charger gets to the end-of- charge state A5 FB Feedback input BUCK feedback input and blocki ng FET input D3 FREQ Frequency detector output Open drain output signal, divided-by-8 version of the frequency of the input AC power signal B1, D1 GND Power ground Ground D5 ISP Current Sense Negative battery terminal connection and current sensing node E4 MOD_CFG Modulation configuration Configures the internal modulator to start up in standalone mode or in bypass mode. Also configures the PDC voltage in standalone mode. D4 MOD_EN MCU modulation input Active high input to the modulator selection logic, with internal 100kΩ pull-down. If repeated transitions are detected on this pin, the integrated modulator is bypassed and MOD_EN controls the COMM switches. B3 nALERT MCU interrupt output/reset signal Active low open drain output activated when TX sends an ALERT command A2, B2, D2, E2 PDC Input power Rectified input volt age C1, C2 SW Switching node BUCK regulator switching n ode B5 SYSOUT System output power System output power c onnection C3 THERM Thermistor connection Thermistor connection used for system temperature monitoring E5 TOP_SET Topoff voltage configuration Configures the topoff voltage of the charger A1 VAC1 Coil input AC power input from the resonato r coil E1 VAC2 Coil input AC power input from the resonato r coil C5 VBAT Battery node Positive battery terminal conn ection

June 19, 2017 Re v. 1. 0 Semtech www.semtech.com 4 of 20 Functional Block Diagram Figure 2: TS51224 Block Diagram Half Sync Rectifier COMM Switch SYSOUT SW BST PDC VAC1 VAC2 COMM1 COMM2 GND Frequency Detection Minimum Load Buck Regulator Data Modulator nALERT TX to RX Alert/Reset FREQ MOD_EN MOD_CFG Div/8 THERM CHG_DIS TOP_SET VBAT ISP Charging Controller WARN 0.5V SHUTDOWN 0.225V FB EOC

June 19, 2017 Re v. 1. 0 Semtech www.semtech.com 5 of 20 Absolute Maximum Ratings Over operating free–air temperature range unless otherwise noted (1, 2) Parameter Value Unit COMM1, COMM2, PDC, VAC1, VAC2 -0.3 to 42 V BST -0.3 to (SW+6) V SW -1 to 42 V CHG_DIS, EOC, FB, FREQ, nALERT, MOD_EN, MOD_CFG, SYSOUT, THERM, TOP_SET, VBAT -0.3 to 6 V ISP -0.7 to 0.7 V Electrostatic Discharge—Human Body Model ±2 kV Electrostatic Discharge—Machine Model ±500 V Peak IR Reflow Temperature (10 to 30 seconds) 260 ° C Notes: (1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to network ground terminal GND. Recommended Operating Conditions Parameter Symbol Conditions Min Typ Max Unit PDC Capacitance (1) C IN 2.2 10 μF BUCK Output Capacitance (1) C OUT F SW =1.3MHz, IOUT_MAX = 50mA 8.8 44 μF BUCK Output Capacitance (1) C OUT F SW =1.3MHz, IOUT_MAX = 400mA 20 44 μF BUCK Bootstrap Capacitor C BST 17.6 47 nF Output Filter Inductor L OUT F SW =1.3MHz, I OUT_MAX = 50mA 1.5 3.3 μH Output Filter Inductor L OUT F SW =1.3MHz, IOUT_MAX = 400mA 1.5 4.7 μH RX Coil L IN F BR = 1MHz 11 μH RX Series Resonant Capacitor C s F BR = 1MHz 10 nF COMM Modulation Capacitors C C1 , C C2 F BR = 1MHz 1 nF Rectified Voltage V PDC 3.5 12 40 V Bridge Current I BR 50 300 mA Rectification Frequency F BR 100 1000 6780 kHz COMM Current I COMM 50 mA Charger Output Current I RANGE 500 mA Topoff Voltage Range V TOP_RANGE Valid set point range 4.1 4.4 V TOP_SET Pin Range V TOP_SET_RANGE Valid TOP_SET pin voltage range 0 3 V Buck Regulator Output Current I OUT_MAX 500 mA High Level Input Voltage V IH CHG_DIS, MOD_EN 1.3 5.5 V Low Level Input Voltage V IL CHG_DIS, MOD_EN 0 0.54 V Notes: (1) Specified capacitance includes allowance for voltage derating, tolerance, temperature, and aging. Select capacitors that meet the specified minimum capacitance.

June 19, 2017 Re v. 1. 0 Semtech www.semtech.com 6 of 20

Electrical Characteristics

Electrical Characteristics, TJ = -40°C to 85°C, unless otherwise noted Parameter Symbol Conditions Min Typ Max Unit Synchronous Rectifier Low-Side Bridge FET Drain- Source On-State Resistance R DSON_BR 400 mΩ High-Side Bridge Diode Forward Voltage V D_BR IBR = 150mA 500 mV Capacitive Modulation Switches COMM FET Drain-Source On-State Resistance RDSON_COMM I COMM = 50mA 10 Ω Power On Reset Power On Reset Voltage V PDC-POR Internal logic reset clear, internal logic/modulator ready 2.7 3.0 3.4 V Power On Reset Hysteresis V PDC-POR_HYST (1) 0.35 V Quiescent Current Quiescent Current, PWM mode Idd PWM PDC current, Buck Regulator PWM mode, V PDC =12V, VAC1=VAC2=0V, ILOAD =0A, MOD_EN=0, external feedback resistors, R TOTAL =1MΩ 15 mA Quiescent Current, PFM mode Idd PFM PDC current, Buck Regulator PFM mode, V PDC =12V, VAC1=VAC2=0V, ILOAD =0A, MOD_EN=0, external feedback resistors, R TOTAL =1MΩ 4 mA Quiescent Current, Buck Off, 10mA Current Source Off Idd BK_10mA_OFF PDC current, Buck Regulator OFF, V PDC =4.5V, VAC1=VAC2=0V, MOD_EN=0, 10mA current source off, external feedback resistors, R TOTAL =1MΩ 3 mA Quiescent Current, Buck Off, 10mA Current Source On Idd BK_OFF PDC current, Buck Regulator OFF, V PDC =4.5V, VAC1=VAC2=0V, MOD_EN=0, 10mA current source on, external feedback resistors, R TOTAL =1MΩ 13 mA

June 19, 2017 Re v. 1. 0 Semtech www.semtech.com 7 of 20 Parameter Symbol Conditions Min Typ Max Unit Charger ISP Voltage VISP_1C 1C mode 20 25 30 mV VISP_0p5C 0.5C mode 10 12.5 15 mV VISP_0p1C Precharge (0.1C) mode 1.5 2.5 3.5 mV 1C Charge Voltage Threshold V 1C_Charge VBAT rising 3.05 3.15 3.25 V Charger Dropout V Drop_CHG SYSOUT-VBAT in 1C charging mode, PWM mode 100 mV On Resistance R ON,CHG (1) 100 mΩ Temperature Sense THERM Output Current I THERM 18 20 22 μA WARN Voltage VWARN,FALLING V THERM falling 0.485 0.505 0.525 V VWARN,RISING V THERM rising 0.776 0.805 0.834 V SHUTDOWN Voltage VSTOP,FALLING V THERM falling 0.22 0.235 0.25 V VSTOP,RISING V THERM rising 0.32 0.335 0.35 V Blocking Switch On Resistance R ON,BLK (1) 50 100 mΩ Off State Leakage I OFF 1 μA Topoff TOP_SET Pin Set Point Current I TOP T J = 25⁰C 17 20 23 μA Topoff Voltage Offset V TOP_OFFSET RTOP_SET = 0Ω 4.08 4.1 4.12 V

June 19, 2017 Re v. 1. 0 Semtech www.semtech.com 8 of 20 Parameter Symbol Conditions Min Typ Max Unit Buck Regulator Input PDC Under-voltage Lockout V PDC-UVLO Buck Regulator = Off 4.3 V PDC Under-voltage Lockout Hysteresis V PDC-UVLO-HYST Buck Regulator = Off 180 mV CHG_DIS, MOD_EN Digital Input s Pull-Down Resistance R PD 68 100 144 kΩ EOC, FREQ, nALERT Open Drain Output EOC High Level Output Leakage I OH_LEAK_EOC VIO = 5V 5 μA FREQ, nALERT High Level Output Leakage I OH_LEAK VIO = 5V 0.01 1 μA Low Level Output Voltage V OD_OL I SINK = 3mA (2) 0.4 V Thermal Protection Thresholds Thermal Shutdown Junction Temperature T SD (1) 130 146 °C Thermal Shutdown Hysteresis T SD_HYST (1) 10 °C Notes: (1) This parameter is not tested in production. (2) nALERT only tested as pass / fail. Regulator Characteristics Electrical Characteristics, T J = -40°C to 85°C, V PDC =12V, F SW =1.3MHz, L OUT =4.7μH, C OUT =44μF, C BST =22nF, unless otherwise noted Parameter Symbol Conditions Min Typ Max Unit SYSOUT Precharge Voltage VOUT-PWM VBAT < 3.1V, PWM mode 3.2 3.3 3.5 V High-Side Switch ON Resistance R DSON_HS I SW = -0.15A (1) 450 mΩ Low-Side Switch ON Resistance R DSON_LS I SW = 0.15A (1) 300 mΩ Output Over Current Detect I OCD 1320 mA Buck Switching Frequency F sw 1.17 1.33 1.46 MHz Soft Start Ramp Time T SS (2) 2.5 ms Notes: (1) RDSON is characterized at 500mA and tested at lower current in production. (2) This parameter is not tested in production.

June 19, 2017 Re v. 1. 0 Semtech www.semtech.com 9 of 20 Functional Description TS51224 is a fully-integrated wireless power receiv er that can operate as a single-chip solution in pr oprietary applications. It can also operate in conjunction wi th a wireless charger controller or an application microcontroller to support the Qi, PMA or A4WP standards as well as pr oprietary standards up to 2W for 5V output and up t o 5W for higher output voltages. Operating in conjunction with TS80 002 as a wireless power transmitter and with a char ging controller on the RX side, TS51224 can support bidirectional c ommunication for data upload from the RX to the TX side. A TX to RX alert or reset function is also included so TS80002 can issue an interrupt or a reset signal to the RX MCU if the RX MCU becomes unresponsive. Rectifier TS51224 includes a high-efficiency rectifier to con vert the input AC power signal to a DC output level for powering a high-efficiency step-down DC-DC converter and an in tegrated data modulator. The rectifier bridge is b uilt to minimize power dissipation across load current of interest. The primary side of the bridge can stand-off up t o 40V with AC input running at 6.78MHz. On the secondary side, a capac itive load on the PDC pin is used to filter the vol tage signal on both sides of the bridge rectifier. The integrated data modulator and the external MCU communicate to the transmitter side using the capacitive modulation scheme. Integrated Modulator The integrated Data Modulator can be configured to operate in standalone or bypass mode. In standalone mode, the integrated modulator sends data messages to the TX side using a proprietary protocol to control the re ctified voltage level on the PDC pin. In bypass mode, the external MCU controls the data packets to the TX side. For example, if the device is configured for standalone mode at power u p, the system can receive power without external MC U support, and once PDC is high enough to operate the buck reg ulator and the MCU, the MCU can take over the commu nication with the transmitter by bypassing the integrated mo dulator. Modulator mode reverts back to the standa lone mode when the MCU communication with the transmitter sta lls. When the PDC output load current is low (buck regulator is off), an internal 10mA load is enabled to allow data communication to take place in optimal conditions. 40V Input Buck Regulator The integrated Buck regulator is a current-mode syn chronous step-down power supply with integrated pow er switches, internal compensation, and fault protection. It is powered by the DC output of the Wireless power rec eiver bridge. The regulator is designed to handle a wide range of inp ut and output voltages. The regulator is optimized for high efficiency power conversion with low R DSON integrated synchronous switches. Low power at lig ht output loads is attained by the regulator automatic transitions bet ween PFM and PWM modes. The regulator will automat ically turn off when the RX AC power input is removed. Blocking FET An integrated low impedance FET in the TS51224 prov ides blocking from SYSOUT to FB. In cases where AC power is not applied, the battery is directly connected to SYSOU T. In this condition, the blocking FET is off, pre venting conduction from SYSOUT to PDC. If AC power is applied and PDC is greater than the batter voltage, then the block ing FET will be on and the SMPS will regulate the SYSOUT voltage. Charger TS51224 includes a linear regulator to manage batte ry charging current. The charger operates by sensi ng the voltage drop across a sense resistor and regulating this to a DC value. Battery charging is controlled by the integrated state machine. When charging at a 1C rate, the SMPS will regulate SYSOUT to be sufficiently higher than VBA T to allow full charging currents. When the battery is very low (< 3.3V), the SMPS will regulate SYSOUT to be equal to 3.3V and the charger will regulate the battery current to the 0.1C rate.

June 19, 2017 Re v. 1. 0 Semtech www.semtech.com 12 of 20 Detailed Ball Description BST – Bootstrap input This terminal provides the bootstrap voltage requir ed for the high-side NMOS switch of the buck regula tor. An external ceramic capacitor placed between the BST and SW pin s will provide the necessary gate drive voltage for the high-side switch. In normal operation, the capacitor is re-ch arged on every low-side synchronous switching actio n. For the case where the switch mode approaches 100% duty cycle fo r the high-side FET, the buck regulator will automa tically reduce the duty cycle to a minimum off time on every 8th cycle to allow the BST capacitor to re-charge. CHG_DIS – Charge disable signal This input terminal allows an external microcontroller to disable charging by pulling the pin high. COMM1, COMM2 – Modulation capacitor switches COMM1 and COMM2 pins are momentarily grounded when the system or the device communicates to the wirele ss power transmitter. When the COMM1/2 switches clos e, this shifts the impedance seen by the RX coil L IN and this shift is in turn reflected as a change in TX coil current th at can be detected by the transmitter’s demodulator . Depending on the MOD_CFG pin configuration and activity on the M OD_EN pin, the integrated modulator or the MOD_EN p in controls the COMM1/2 switches. EOC – End of charge indicator When charging, this pin will be pulled low by an in tegrated NMOS. When the battery is fully charged, the NMOS will release. An external resistor should be connected to a system rail to allow this voltage to pull to the rail. FB – Buck regulator output feedback This is the input terminal for the buck regulator o utput voltage feedback and the power input for the blocking FET. The SMPS will regulate the FB voltage at all times when enabled. FREQ – Frequency detector output This is an open drain output which outputs a clock reference running at the frequency of the input AC power signal divided by 8. GND – Ground Ground reference. This pin will conduct both correl ated and uncorrelated switching currents during pow er transfer mode from the COMM1/2 pins switching and the buck o perating in PWM mode, as well as switching current from the internal oscillator and the integrated modulator. PCB layout must provide low resistance to the groun d plane for stable operation. ISP – Charging current sense node This terminal is the negative battery terminal. A sense resistor placed between ISP and ground will s et the 1C charging current. The integrated charger will regulate the voltage on the ISP pin to set the charging current.

June 19, 2017 Re v. 1. 0 Semtech www.semtech.com 13 of 20 Detailed Ball Description MOD_CFG – Modulation configuration PDC voltage and modulation control scheme for communication are configured by the MOD_CFG pin. Bypass Mode When the MOD_CFG pin is grounded (voltage < 250mV), the internal data modulator is bypassed and the ex ternal MCU is required to drive the MOD_EN pin to control the communication with the power transmitter. Thus , the MCU must be fully active prior to the device generating a stable output voltage V OUT . The external MCU will set V PDC by sending data packets to the transmitter. Stand-alone Mode If the MOD_CFG pin is grounded through an external precision resistor (voltage > 250mV), the voltage o n the MOD_CFG pin determines the nominal rectified voltag e on the PDC pin. In this mode, the integrated mod ulator generates the wireless power control packets and dr ives the COMM1/2 switches after power-on reset. Th is mode is referred to as the stand-alone mode as it does not require an external MCU to control the communicatio n with the transmitter during receiver power up and for normal operation. While in stand-alone mode, the device also monitors the MOD_EN pin to detect if the external MCU wants to take control of the communication with the power transmi tter. If at least 8 pulses with a delay of less tha n 25ms between each pulse are detected on the MOD_EN pin, the devi ce enters the (integrated modulator) bypass mode. O nce in bypass mode and the MOD_EN pin activity stalls (les s than 8 pulses in a 250 ms window), the device exi ts the bypass mode and returns to stand-alone mode and the integr ated modulator resumes communication with the power transmitter. MOD_CFG Pin Connection RX Data Communication Modulator COMM1/2 Pin Drive V PDC Internal Modulator Bypass Internal Modulator Fallback Grounded External MCU MOD_EN Set by External MCU’s power control data packet Integrated modulator always bypassed Integrated modulator always bypassed Resistor R MOD_CFG to Ground Integrated modulator Integrated modulator RMOD_CFG / 5000 If MOD_EN pin pulses 8 times with delay < 25ms between pulses, COMM1/2 pins responsive to MOD_EN input If MOD_EN pin pulses less than 8 times within 250ms window, COMM1/2 pins responsive to the integrated modulator MOD_EN – MCU modulation input This is an active high CMOS input to drive the COMM 1 and COMM2 pins to modulate the coil current to co mmunicate with the wireless power transmitter. MOD_EN signal is generated by the external MCU and its output swi ng must conform to the input levels specified in the Electr ical Characteristics section for the MOD_EN pin. Activity on the MOD_EN is also sampled by the control logic to tran sition between Stand-alone and Bypass modes as outl ined in the MOD_CFG pin description. nALERT – MCU reset/interrupt nALERT is an open drain output which is asserted lo w when the transmitter sends an ALERT command to th e receiver to reset the MCU or to generate an interrupt. During the power up sequence, nALERT pin is pulled high by the external pull-up resistor, thus only the power transmitter ALERT command is allowed to assert this pin low.

June 19, 2017 Re v. 1. 0 Semtech www.semtech.com 14 of 20 Detailed Ball Description PDC – Rectified input signal This terminal is the rectified output of the RX AC input voltage and serves as the DC supply for the d evice. It is recommended that a 10μF bypass capacitor rated for the maximum PDC voltage (> 2.2μF capacitance accoun ting for voltage derating, aging, and tolerance) be placed c lose to the device for best performance. Since thi s is the main power supply for the IC, good layout practices need to be followed for this connection. SW – Switching output This is the switching node of the buck regulator. It should be connected directly to the output filte r inductor L OUT and bootstrap capacitor with a short, wide trace. SW p in switches between V PDC and GND at the switching frequency, thus it is considered a noise source on the PCB. Route high impedance and quiet traces away from the SW trace. SYSOUT – System output supply This terminal is the system power supply. When AC input power is not available, SYSOUT is shorted to VBAT through the integrated charger FET. When AC power is applied, SYSOUT will be regulated to either 3.3V when the ba ttery is low or ~150mV above battery up to the topoff voltage. THERM – Thermistor connection This terminal allows temperature monitoring of the external system using a thermistor. When the syste m temperature reaches the warning level, the 1C charging level will be cut in half. At the shutdown level, charging will stop. TOP_SET – Topoff voltage setpoint The battery topoff voltage is set by placing a resi stor to ground on this pin. The IC will provide a 20μA DC output current. The topoff voltage will be set according to the following equation. VTOP = VTOP_OFFSET + ITOP * (RTOP_SET / 10) VAC1, VAC2 – AC Power input from resonant LC network These terminals are connected to the wireless power supply receiver coil and resonant capacitor. It is recommended that the PCB traces are robust to handle high peak currents during power up maximum power transfer. VBAT – Battery connection This pin is the positive battery terminal. The charger will supply output current to this pin during charging.

June 19, 2017 Re v. 1. 0 Semtech www.semtech.com 15 of 20 Regulator Internal Protection Details Regulator Output Current Limit The current through the high-side FET is sensed on a cycle by cycle basis and if current limit is reac hed, it will turn off the high-side FET in mid-cycle. In addition, the device senses the FB pin to identify hard short condition s and will direct the SW output to skip 4 cycles if current limit occurs when FB is low. This allows current built up in the inductor during the minimum on-time to decay sufficiently. Current lim it is always active when the regulator is enabled a nd the soft start function ensures current limit does not prevent regulator startup. Under extended over-current conditions (such as a s hort), the buck regulator switching will automatica lly be disabled. Once the over current condition is removed, the device automatically returns to normal operation. Thermal Shutdown If the die temperature exceeds T SD , SW outputs will tri-state to protect the device a nd its load from damage. Once the device cools to TSD – TSD_HYST , the buck regulator will attempt to start up again. Reference Soft Start Internal references are ramped to prevent the outpu t from overshoot during initial startup. During th e soft start ramp, current limit is still active, and protects the device in case of a shorted output. Output Overvoltage If the output of the regulator exceeds 3% of the se t regulation voltage, the SW output tri-states to p rotect the device from damage. This check occurs at the start of eac h switching cycle. If overvoltage occurs mid-cycle , the switching for that cycle completes and the SW output tri-states on the next cycle. PDC Under-Voltage Lockout Buck regulator is off until PDC is over 4V with 300mV hysteresis.

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Package Information

0.10 C 0.08 C

0.05 C A B

CONTROLLING DIMENSIONS ARE IN MILLIMETERS NOTES: A B C A B C INDEX AREA A1 CORNER SEATING 1 2 3 PLANE 5 25X Ø 0.26±0.03 Ball Diameter 2.30±0.03 0.525±0.05 D E 0.40 0.40 1.60 1.60 2.30±0.03 0.20±0.03 Figure 9: Package Outline Drawing

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Ordering Information

Device Part Number Description 25 Ball WCSP Package (5x5 ball array, 0.4mm ball pitch) TS51224-M000WCSR Wireless Power Receiver, external resistor feedback Tape & Reel (3000 parts/reel)

June 19, 2017 Re v. 1. 0 Semtech www.semtech.com 20 of 20 IMPORTANT NOTICE Information relating to this product and the application or design described herein is believed to be reliable, however such information is provided as a guide onl y and Semtech assumes no liability for any errors in this document, or for the application or design described herein. Semtech reserves the right to make changes to the product or this document at any time without notice. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. Semtech warrants performance of its products to the specifications applicable at the time of sale, and all sales are made in accord ance with Semtech’s standard terms and conditions of sale. SEMTECH PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHOR IZED OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS, OR I N NUCLEAR APPLICATIONS IN WHICH THE FAILURE COULD BE REASONABLY EXPECTED TO RESULT IN PERSONAL INJURY, LOSS OF LIFE OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. INCLUSION OF SEMTECH PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE UNDERTAKEN SOLELY AT THE CUSTOMER’S OWN RISK. Shoul d a customer purchase or use Semtech products for any such unauthorized application, the customer shall indemnify and hold Semtech and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs damages and attorney fees which could arise. The Semtech name and logo are registered trademarks of the Semtech Corporation. All other trademarks and trade names mentioned may be marks and names of Sem tech or their respective companies. Semtech reserves the right to make changes to, or discontinue any pr oducts described in this document without further n otice. Semtech makes no warranty, representation or guaran tee, express or implied, regarding the suitability of its products for any particular purpose. All rights reserved. © Semtech 2017 Contact Information Semtech Corporation

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