100mW stereo headphone amplifier
Document overview
- Manufacturer or author: STMICROELECTRONICS
- PDF pages: 26
Technical content
100mW Stereo Headphone Amplifier ■ Operating from Vcc=2V to 5.5V ■ 100mW into 16Ω at 5V ■ 38mW into 16Ω at 3.3V ■ 11.5mW into 16Ω at 2V ■ Switch ON/OFF click reduction circuitry ■ High power supply rejection ratio: 85dB at 5V ■ High signal-to-noise ratio: 110dB(A) at 5V ■ High crosstalk immunity: 100dB (F=1kHz) ■ Rail-to-rail input and output ■ Unity-gain stable ■ Available in SO-8, MiniSO-8 & DFN8
Description
The TS482 is a dual audio power amplifier able to drive a 16 or 32 Ω stereo headset down to low voltages. It is delivering up to 100mW per channel (into 16 Ω loads) of continuous average power with 0.1% THD+N from a 5V power supply. The unity gain stable TS482 can be configured by external gain-setting resistors.
Applications
■ Stereo headphone amplifier ■ Optical storage ■ Computer motherboard ■ PDA, organizers & notebook computers ■ High-end TV, set-top box, DVD players ■ Sound cards Order Codes Typical application schematic TS482IST - MiniSO-8 TS482ID, TS482IDT - SO-8 OUT (1) VIN+ (1) GND VCC OUT (2) VIN- (2) VIN+ (2) VIN- (1) OUT (1) VIN+ (1) GND VCC OUT (2) VIN- (2) VIN+ (2) VIN- (1) TS482 3.9k 3.9k 3.9k 3.9k 100k 100k Vcc Vcc +220µF 220µF Right In Left In +RL=32Ohms +RL=32Ohms+ 1µF 2.2µF 2.2µF Cs 1µF Cin1 Cin2 Rin1 Cout2 Cout1 Rin2 Rfeed1 Rfeed2 Cb Rpol Rpol TS482 3.9k 3.9k 3.9k 3.9k 100k 100k Vcc Vcc +220µF 220µF Right In Left In +RL=32Ohms +RL=32Ohms+ 1µF 2.2µF 2.2µF Cs 1µF Cin1 Cin2 Rin1 Cout2 Cout1 Rin2 Rfeed1 Rfeed2 Cb Rpol Rpol TS482IQT - DFN8 4 5 6VIN + (1) GND V IN + (2) Vcc OUT (2) OUT (1) VIN - (2) VIN - (1) 4 5 6VIN + (1) GND V IN + (2) Vcc OUT (2) OUT (1) VIN - (2) VIN - (1) Part Number Temperature Range Package Packing Marking TS482ID/IDT -40, +85°C SO-8 T ube or T ape & Reel 482ITS482IST miniSO-8 T ape & Reel TS482IQT DFN8
1 Absolute Maximum Ratings
Table 1. Key parameters and their absolute maximum ratings Table 2. Operating conditions
- All voltages values are measured with respect to the ground pin.
- Pd has been calculated with Tamb = 25°C, Tjunction = 150°C.
- Attention must be paid to continuous power dissipation. Exposure of the IC to a short circuit on one or two
amplifiers simultaneously can cause excessive heating and the destruction of the device.
- When mounted on a 4-layer PCB.
2 Electrical Characteristics
Table 3. Electrical characteristics when V CC = +5V , GND = 0V, Tamb = 25°C (unless
- Fig. 68 to 79 show dispersion of these parameters.
Table 4. Electrical characteristics when V CC = +3.3V, GND = 0V, Tamb = 25°C (unless
- Fig. 68 to 79 show dispersion of these parameters.
- All electrical values are guaranteed with correlation measurements at 2V and 5V.
Table 5. Electrical characteristics when V CC = +2.5V, GND = 0V, Tamb = 25°C (unless
- Fig. 68 to 79 show dispersion of these parameters.
- All electrical values are guaranteed with correlation measurements at 2V and 5V.
Table 6. Electrical characteristics when V CC = +2V , GND = 0V, Tamb = 25°C (unless
- Fig. 68 to 79 show dispersion of these parameters.
Table 7. Components description
Table 8. Index of graphics
Figure 79. Worst case distribution of THD + N
3 Package Mechanical Data
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at:
3.1 SO-8 Package
DIM. mm. inch A 1.35 1.75 0.053 0.069 A1 0.10 0.25 0.04 0.010 A2 1.10 1.65 0.043 0.065 B 0.33 0.51 0.013 0.020 C 0.19 0.25 0.007 0.010 D 4.80 5.00 0.189 0.197 E 3.80 4.00 0.150 0.157 e 1.27 0.050 H 5.80 6.20 0.228 0.244 h 0.25 0.50 0.010 0.020 L 0.40 1.27 0.016 0.050 k ˚ (max.) ddd 0.1 0.04 SO-8 MECHANICAL DATA 0016023/C
3.2 MiniSO-8 Package
3.3 DFN8 Package
4 Revision history
June 2003 1 Initial release. Nov. 2005 2 The following changes were made in this revision: – Lead temperature for lead-free added see Table 1: Key parameters and their absolute maximum ratings on page 2 . – Formatting changes throughout. Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this p ublication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicr oelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners © 2005 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Ital y - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America