TS4148RYG TSC | Alldatasheet
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Terminal: Gold plated, solderable per MIL-STD-750, method 2026 guaranteed Unit (mm) Unit (inch) D High temperature soldering guaranteed: 260°C/10s Trr ns 4.0CJ -IR pF Junction and Storage Temperature Range Reverse Leakage Current Min -65 to + 175 Type Number Symbol VF °CTJ, TSTG V mA mA 0.5 2.0 °C/W Units V Max 375 I O 150 Tp=1sec square waveform V(BR) IFSM 8.3ms single half sine waveform RșJA B A C E D Version : G11
400mW High Speed SMD Switching Diode Small Signal Diode Rating and Sharacteristic Curves FIG 3 Admissible Power Dissipation Curve 100 200 300 400 500 0 25 50 75 100 125 150 175 200 Power Dissipation (mW) FIG 4 Typical Junction Capacitance 0.6 0.7 0.8 0.9 1.1 1.2 02468 1 0 Junction Capacitance (pF) Ambient Temperature (°C) Reverse Voltage (V) FIG 1 Typical Forward Characteristics 0.01 0.1 100 1000 Instantaneous Forward Current (A) FIG 5 Forward Resistance vs. Forward Current 100 1000 10000 0 0 1 10 100 Forward Current (mA) Dynamic Forward Resistance (Ƿ) Ta=25°C Ta=100° Instantaneous Forward Voltage (V) FIG 2 Reverse Current vs Reverse Voltage 0.01 0.1 100 0 20 40 60 80 100 120 Reverse Current (uA) Reverse Voltage (V) Ta=25°C Version : G11