TS3USB30ERSWR

TS3USB30E_13 TI1 | Alldatasheet

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(TOP VIEW) 1 2 310 D1+ D2+ D1– D2– GND OE VCC S RSW PACKAGE (BOTTOM VIEW) D1+ D1– D+1 2 310 58 67 D2+ D2– GND S VCC OE TS3USB30E www.ti.com SCDS255E –DECEMBER 2008–REVISED AUGUST 2012 ESDPROTECTED,HIGH-SPEEDUSB2.0(480-Mbps) 1:2MULTIPLEXER/DEMULTIPLEXERSWITCHWITHSINGLEENABLE Check forSamples: TS3USB30E 1FEATURES

• VCC Operationat3 V to4.3V
• 1.8-VCompatible Control-PinInputs
• IOFF Supports PartialPower-Down-Mode Operation – D+/D– Pins Tolerateup to5.25V
• rON = 10 Ω Max
• ΔrON = 0.35Ω Typ
• C io(ON)= 7.5pF Typ
• Low Power Consumption (1μA Max)
• –3 dB Bandwidth = 900 MHz Typ
• Latch-Up Performance Exceeds 100 mA Per JESD 78,Class II(1)
• ESD Performance Tested Per JESD 22 – 8000-V Human-Body Model (A114-B, Class II) – 1000-V Charged-DeviceModel (C101)
• ESD Performance I/OPorttoGND (2) – 15000-V Human-Body Model
• Packaged in10-pinTQFN (1.4mm × 1.8mm)

APPLICATIONS

• Routes SignalsforUSB 1.0,1.1,and 2.0 DGS PACKAGE (TOP VIEW) (1) ExceptOE and S inputs (2) High-voltageHBM isperformedinadditiontothestandard HBM testing(A114-B,ClassII)and appliestoI/Oportstested withrespecttoGND only. Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 2008–2012,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.

D1– D2+ D2– Control S OE TS3USB30E SCDS255E –DECEMBER 2008–REVISED AUGUST 2012 www.ti.com DESCRIPTION/ORDERING INFORMATION The TS3USB30E isa high-bandwidthswitchspeciallydesignedfortheswitchingofhigh-speedUSB 2.0signals in handset and consumer applications,such as cellphones, digitalcameras, and notebooks withhubs or controllerswithlimitedUSB I/Os.The wide bandwidth(900 MHz) of thisswitchallowssignalsto pass with minimum edge and phase distortion.The devicemultiplexesdifferentialoutputsfroma USB hostdevicetoone of two correspondingoutputs.The switchisbidirectionaland offerslittleorno attenuationofthehigh-speedsignals attheoutputs.Itisdesignedforlowbit-to-bitskew and highchannel-to-channelnoiseisolation,and iscompatible withvariousstandards,such as high-speedUSB 2.0(480Mbps). The TS3USB30E integratesESD protectioncellson allpins,isavailableina tinyμQFN package (1.8mm × 1.4mm), a DGS package,and ischaracterizedoverthefreeairtemperaturerangeof–40°C to85°C.

ORDERING INFORMATION

TA PACKAGE (1)(2) ORDERABLE PART NUMBER TOP-SIDE MARKING (3) UQFN – RSW Tape and reel TS3USB30ERSWR LY_,L6_ –40°C to85°C VSSOP – DGS Tape and reel TS3USB30EDGSR L6R (1) Package drawings,thermaldata,and symbolizationareavailableatwww.ti.com/packaging. (2) Forthemost currentpackage and orderinginformation,see thePackage OptionAddendum attheend ofthisdocument,orsee theTI websiteatwww.ti.com. (3) RSW: The actualtop-sidemarkinghas one additionalcharacterthatdesignatestheassembly/testsite. PIN DESCRIPTION NAME DESCRIPTION OE Bus-switchenable S Selectinput D+, D –,Dn+, Dn – Data ports TRUTH TABLE S OE FUNCTION X H Disconnect L L D = D1 H L D = D2 BLOCK DIAGRAM

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www.ti.com SCDS255E –DECEMBER 2008–REVISED AUGUST 2012 ABSOLUTE MAXIMUM RATINGS (1)(2) overoperatingfree-airtemperaturerange(unlessotherwisenoted) MIN MAX UNIT VCC Supplyvoltagerange –0.5 7 V VIN Controlinputvoltagerange(3) –0.5 7 V Dn+, Dn – –0.5 VCC + 0.3 VI/O SwitchI/Ovoltagerange(3)(4) D+, D – when VCC > 0 –0.5 VCC + 0.3 V D+, D – when VCC = 0 –0.5 5.25 IIK Controlinputclamp current VIN < 0 –50 mA II/OK I/Oportclamp current VI/O< 0 –50 mA II/O ON-stateswitchcurrent(5) ±64 mA ContinuouscurrentthroughVCC orGND ±100 mA Tstg Storagetemperaturerange –65 150 °C (1) Stressesbeyond thoselistedunder"absolutemaximum ratings"may cause permanentdamage tothedevice.These arestressratings only,and functionaloperationofthedeviceattheseorany otherconditionsbeyond thoseindicatedunder"recommended operating conditions"isnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmay affectdevicereliability. (2) Allvoltagesarewithrespecttoground,unlessotherwisespecified. (3) The inputand outputvoltageratingsmay be exceeded iftheinputand outputclamp-currentratingsareobserved. (4) VIand VO areused todenotespecificconditionsforVI/O. (5) IIand IO areused todenotespecificconditionsforII/O. PACKAGE THERMAL IMPEDANCE (1) TYP UNIT DGS package 56.5 θJA Package thermalimpedance °C/W RSW package 175 (1) The package thermalimpedance iscalculatedinaccordancewithJESD 51-7. RECOMMENDED OPERATING CONDITIONS (1) MIN MAX UNIT VCC Supplyvoltage 3 4.3 V VCC = 3 V to3.6V 1.3 VIH High-levelcontrolinputvoltage V VCC = 4.3V 1.7 VCC = 3 V to3.6V 0.5 VIL Low-levelcontrolinputvoltage V VCC = 4.3V 0.7 VI/O Data input/outputvoltage 0 VCC V TA Operatingfree-airtemperature –40 85 °C (1) Allunused controlinputsofthedevicemust be heldatVCC orGND toensureproperdeviceoperation.RefertotheTIapplicationreport, ImplicationsofSlow orFloatingCMOS Inputs,literaturenumber SCBA004. Copyright© 2008–2012,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:TS3USB30E

SCDS255E –DECEMBER 2008–REVISED AUGUST 2012 www.ti.com ELECTRICAL CHARACTERISTICS (1) overoperatingfree-airtemperaturerange(unlessotherwisenoted) PARAMETER TEST CONDITIONS MIN TYP (2) MAX UNIT VIK VCC = 3 V, II= –18 mA –1.2 V IIN Controlinputs VCC = 4.3V,0 V, VIN = 0 to4.3V ±1 μA VCC = 4.3V, VO = 0 to3.6V,IOZ (3) ±1 μAVI= 0, SwitchOFF VCC = 0 V, VO = 0 to4.3V,IOFF D+ and D – ±2 μAVI= 0, VIN = VCC orGND ICC VCC = 4.3V, II/O= 0, SwitchON orOFF 1 μA ΔICC (4) Controlinputs VCC = 4.3V, VIN = 2.6V 10 μA C in Controlinputs VCC = 0 V, VIN = VCC orGND 1 pF C io(OFF) VCC = 3.3V, VI/O= 3.3V or0, SwitchOFF 2 pF C io(ON) VCC = 3.3V, VI/O= 3.3V or0, SwitchON 7.5 pF ron (5) VCC = 3 V, VI= 0.4, IO = –8 mA 6 10 Ω Δron VCC = 3 V, VI= 0.4, IO = –8 mA 0.35 Ω ron(flat) VCC = 3 V, VI= 0 V or1 V, IO = –8 mA 2 Ω (1) VIN and IIN refertocontrolinputs.VI,VO ,II,and IO refertodatapins. (2) AlltypicalvaluesareatVCC = 3.3V (unlessotherwisenoted),TA = 25°C. (3) ForI/Oports,theparameterIOZ includestheinputleakagecurrent. (4) Thisistheincreaseinsupplycurrentforeach inputthatisatthespecifiedTTL voltagelevel,ratherthanVCC orGND. (5) Measured by thevoltagedropbetween theA and B terminalsattheindicatedcurrentthroughtheswitch.ON-stateresistanceis determinedby thelowerofthevoltagesofthetwo (A orB) terminals.

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www.ti.com SCDS255E –DECEMBER 2008–REVISED AUGUST 2012 DYNAMIC ELECTRICAL CHARACTERISTICS overoperatingrange,TA = –40°C to85°C, VCC = 3.3V ± 10%, GND = 0 V PARAMETER TEST CONDITIONS TYP (1) UNIT XTALK Crosstalk R L = 50 Ω,f= 240 MHz, See Figure10 –54 dB O ISO OFF isolation R L = 50 Ω,f= 240 MHz, See Figure9 –40 dB BW Bandwidth(–3 dB) R L = 50 Ω,C L = 5 pF,See Figure11 900 MHz (1) ForMax orMin conditions,use theappropriatevaluespecifiedunderElectricalCharacteristicsfortheapplicabledevicetype. SWITCHING CHARACTERISTICS overoperatingrange,TA = –40°C to85°C, VCC = 3.3V ± 10%, GND = 0 V PARAMETER TEST CONDITIONS MIN TYP (1) MAX UNIT R L = 50 Ω,C L = 5 pF,tpd Propagationdelay(2)(3) 0.25 nsSee Figure12 R L = 50 Ω,C L = 5 pF,tON Lineenabletime,SEL toD, nD 30 nsSee Figure8 R L = 50 Ω,C L = 5 pF,tOFF Linedisabletime,SEL toD, nD 25 nsSee Figure8 R L = 50 Ω,C L = 5 pF,tON Lineenabletime,OE toD, nD 30 nsSee Figure8 R L = 50 Ω,C L = 5 pF,tOFF Linedisabletime,OE toD, nD 25 nsSee Figure8 R L = 50 Ω,C L = 5 pF,tSK(O) Outputskew between centerporttoany otherport(2) 50 psSee Figure13 Skew between oppositetransitionsofthesame output R L = 50 Ω,C L = 5 pF,tSK(P) 20 ps(tPHL – tPLH )(2) See Figure13 R L = 50 Ω,C L = 5 pF, tJ Totaljitter(2) tR = tF = 500 ps at480 Mbps 20 ps (PRBS = 215 – 1) (1) ForMax orMin conditions,use theappropriatevaluespecifiedunderElectricalCharacteristicsfortheapplicabledevicetype. (2) Specifiedby design (3) The bus switchcontributesno propagationaldelayotherthantheRC delayoftheon resistanceoftheswitchand theloadcapacitance. The timeconstantfortheswitchaloneisoftheorderof0.25ns for10-pFload.Sincethistimeconstantismuch smallerthantherise/fall timesoftypicaldrivingsignals,itadds verylittlepropagationaldelaytothesystem.Propagationaldelayofthebus switch,when used in a system,isdeterminedby thedrivingcircuiton thedrivingsideoftheswitchand itsinteractionswiththeloadon thedrivenside. Copyright© 2008–2012,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:TS3USB30E

–120 –100 –80 –60 –40 –20 Frequency (Hz) Attenuation (dB) –90 –80 –70 –60 –50 –40 –30 –20 –10 Frequency (Hz) Attenuation (dB) –14 –12 –10 Frequency (Hz) Gain (dB) TS3USB30E SCDS255E –DECEMBER 2008–REVISED AUGUST 2012 www.ti.com

APPLICATION INFORMATION

Figure1.Gain vs Frequency Figure2.OFF Isolation Figure3.Crosstalk

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Differential Signal (V) Time ( 10 ) (s)x 0.5 –0.5 0.4 0.4 1.0 1.6 –0.4 0.3 –0.3 0.2 0.2 0.8 1.4 2.0 –0.2 0.1 –0.1 0.0 0.0 0.6 1.2 1.8 Differential Signal (V) Time ( 10 ) (s)x 0.5 –0.5 0.4 0.4 1.0 1.6 –0.4 0.3 –0.3 0.2 0.2 0.8 1.4 2.0 –0.2 0.1 –0.1 0.0 0.0 0.6 1.2 1.8 Differential Signal (V) Time ( 10 ) (s)x 0.5 –0.5 0.4 0.4 1.0 1.6 –0.4 0.3 –0.3 0.2 0.2 0.8 1.4 2.0 –0.2 0.1 –0.1 0.0 0.0 0.6 1.2 1.8 TS3USB30E www.ti.com SCDS255E –DECEMBER 2008–REVISED AUGUST 2012 Figure4.Eye Pattern:480-Mbps USB SignalWith Figure5.Eye Pattern:480-Mbps USB SignalWith No Switch (Through Path) Switch NC Path Figure6.Eye Pattern:480-Mbps USB SignalWith Switch NO Path Copyright© 2008–2012,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:TS3USB30E

CL(2) RL VIN VCC GND 1D or 2D VOUT1 1D or 2D D VCC VIN 50 Ω RL CL 5 pFtON TEST VCC50 Ω 5 pFtOFF 50% tON tOFF 50% 90% 90% Logic Input (VSEL or VOE) 1.8 V Switch Output (VOUT1 or VOUT2) CL(2) RL (1) All input pulses are supplied by generators having the following characteristics: PRR≤ 10 MHz, ZO = 50 Ω , tr /c605 ns, tf /c605 ns. (2) CL includes probe and jig capacitance. VOH VOL OE VOUT2 VOE(1) VSEL(1) S USB Connector Set□Top□Box (STB)□CPU or□DSP Processor USB2.0 Controller DVR□or Mass□Storage Controller TS3USB30E Control 1D+ 1D– VCC 2D+ 2D– S OE TS3USB30E SCDS255E –DECEMBER 2008–REVISED AUGUST 2012 www.ti.com Figure7.ApplicationDiagram PARAMETER MEASUREMENT INFORMATION Figure8.Turn-On (tON )and Turn-OffTime (tOFF )

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D 50 /C0087 50 /C0087 VOUT1 VIN Channel ON: 1D to D Network Analyzer Setup Source Power = 0 dBm (632-mV P-P at 50-/C0087 load) DC Bias = 350 mV Network Analyzer Source Signal VCTRL = GND S GND 50 /C0087 50 /C0087 VOUT1 VIN Channel ON: 1D to D Network Analyzer Setup Source Power = 0 dBm (632-mV P-P at 50-/C0087 load) DC Bias = 350 mV 50 /C0087 VCC GND VOUT2 Source Signal Channel OFF: 2D to D Network Analyzer VSEL VSEL = VCC S D VOUT1 VIN Channel OFF: 1D to D Network Analyzer Setup Source Power = 0 dBm (632-mV P-P at 50-/C0087 load) DC Bias = 350 mV 50 /C0087 VCC GND 50 /C0087 50 /C0087 Network Analyzer Source Signal VSEL VSEL = VCC S TS3USB30E www.ti.com SCDS255E –DECEMBER 2008–REVISED AUGUST 2012 PARAMETER MEASUREMENT INFORMATION (continued) Figure9.OFF Isolation(OISO) Figure10.Crosstalk(XTALK ) Figure11.Bandwidth (BW) Copyright© 2008–2012,Texas InstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:TS3USB30E

Pulse Skew tSK(P) Output Skew tSK(P) VOL VOH VOH VOL VOH VOL 400 mV TS3USB30E SCDS255E –DECEMBER 2008–REVISED AUGUST 2012 www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) Figure12.PropagationDelay Figure13.Skew Test

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VSEL = VCC or GND VBIAS = VCC or GND Capacitance is measured at 1D, 2D, D, and S inputs during ON and OFF conditions. Capacitance Meter VIN VOUT2 VOUT1 D S Channel OFF OFF-State Leakage Current VSEL = VIH or VIL VCC GND VSEL D VIN VOUT2 VOUT1 S VCC IIN ron /C0043 VIN /C0042VOUT2 or VOUT1 IIN /C0087 GND Channel ON VSEL D VIN VSEL = VIH or VIL VOUT2 VOUT1 S TS3USB30E www.ti.com SCDS255E –DECEMBER 2008–REVISED AUGUST 2012 PARAMETER MEASUREMENT INFORMATION (continued) Figure14.ON-StateResistance(ron) Figure15.OFF-StateLeakage Current Figure16.Capacitance Copyright© 2008–2012,Texas InstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:TS3USB30E

SCDS255E –DECEMBER 2008–REVISED AUGUST 2012 www.ti.com

REVISION HISTORY

Changes from RevisionD (September 2010)toRevisionE Page

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www.ti.com 20-May-2013 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples HPA02206RSWR ACTIVE UQFN RSW 10 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 (LY7 ~ LYO) TS3USB30EDGSR ACTIVE VSSOP DGS 10 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 L6R TS3USB30ERSWR ACTIVE UQFN RSW 10 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 (LY7 ~ LYO) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

www.ti.com 20-May-2013 Addendum-Page 2 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 19-Nov-2012 Pack Materials-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TS3USB30EDGSR VSSOP DGS 10 2500 358.0 335.0 35.0 TS3USB30ERSWR UQFN RSW 10 3000 180.0 180.0 30.0 TS3USB30ERSWR UQFN RSW 10 3000 203.0 203.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 19-Nov-2012 Pack Materials-Page 2

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