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Sample & Buy T echnical Documents Tools & Software Support & Community TS3USB3000 SCDS337B –DECEMBER 2012–REVISED DECEMBER 2015 TS3USB3000DPDTUSB2.0High-SpeedandMobileHigh-DefinitionLink(MHL)6.1-GHz Switch
1 Features 3 Description
The TS3USB3000 device is a double-pole, double 1• VCC Range 2.7 V to 4.3 V throw (DPDT) multiplexer that includes a high-speed• Mobile Hi-Definition Link (MHL) Switch: Mobile High-Definition Link (MHL) switch and an USB – Bandwidth (–3 dB): 6.1 GHz 2.0 High-Speed (480 Mbps) switch in the same package. These configurations allow the system– RON (Typical): 5.7 Ω designer to use a common USB or Mico-USB– CON (Typical): 1.6 pF connector for both MHL video signals and USB data.
- USB Switch: The TS3USB3000 has a VCC range of 2.7 V to 4.3 V– Bandwidth (–3 dB): 6.1 GHz and supports overvoltage tolerance (OVT) feature, – RON (Typical): 4.6 Ω which allows the I/O pins to withstand overvoltage conditions (up to 5.5 V). The power-off protection– CON (Typical): 1.4 pF feature forces all I/O pins to be in high-impedance• Current Consumption: 30 µA (Typical) mode when power is not present, allowing full
- Special Features: isolation of the signal lines under such condition without excessive leakage current. The select pins of– IOFF Protection Prevents Current Leakage in TS3USB3000 are compatible with 1.8-V controlPowered-Down State (VCC and VBUS = 0 V) voltage, allowing them to be directly interfaced with– 1.8-V Compatible Control Inputs (SEL, OE) the General-Purpose I/O (GPIO) from a mobile – Overvoltage Tolerance (OVT) on all I/O Pins processor. up to 5.5 V Without External Components The TS3USB3000 comes with a small 10-pin UQFN– Overvoltage Protection When 9 V Short to package with only 2.0 mm × 1.5 mm is size, whichD-Pin makes it a perfect candidate to be used in mobile applications.• ESD Performance: – 3.5-kV Human Body Model (A114B, Class II) Device Information (1) – 1-kV Charged-Device Model (C101) PART NUMBER PACKAGE BODY SIZE (NOM)
- 10-Pin UQFN Package (2.0 mm × 1.5 mm, TS3USB3000 UQFN (10) 1.50 mm × 2.00 mm 0.5 mm Pitch) (1) For all available packages, see the orderable addendum at the end of the data sheet.2 Applications
- Smartphones, Tablets, Mobile
- Portable Instrumentation
- Digital Still Cameras Functional Block Diagram An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.
SCDS337B –DECEMBER 2012–REVISED DECEMBER 2015 www.ti.com Table of Contents
4 Revision History
Changes from Revision A (April 2013) to Revision B Page
- Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device Changes from Original (December 2012) to Revision A Page
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Product Folder Links: TS3USB3000
/OE SEL1 910 VCC TS3USB3000 www.ti.com SCDS337B –DECEMBER 2012–REVISED DECEMBER 2015
5 Pin Configuration and Functions
NO. NAME
1 USB+ I/O USB Data (Differential +)
2 USB– I/O USB Data (Differential –)
3 MHL+ I/O MHL Data (Differential +)
4 MHL– I/O MHL Data (Differential –)
5 GND — Ground
6 OE I Output Enable (Active Low)
7 D– I/O Data Switch Output (Differential –)
8 D+ I/O Data Switch Output (Differential +)
9 SEL I Switch select (logic Low = D+/D– to USB+/USB– Logic High = D+/D– to MHL+/MHL-)
10 VCC — Supply Voltage
Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: TS3USB3000
SCDS337B –DECEMBER 2012–REVISED DECEMBER 2015 www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1) (2) MIN MAX UNIT VCC Supply voltage(3) –0.3 5.5 V VI/O Input/Output DC voltage(3) –0.3 5.5 V VD- D- DC voltage(4) –0.3 9 V VI Digital input voltage (SEL, /OE) –0.3 5.5 V IK Input/Output port diode current VI/O < 0 –50 mA IIK Digital logic input clamp current(3) VI < 0 –50 mA ICC Continuous current through VCC 100 mA IGND Continuous current through GND –100 mA Tstg Storage temperature –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum. (3) All voltages are with respect to ground, unless otherwise specified. (4) This rating only applies to the D- pin with respect to GND. VCC must be powered within the recommended operating conditions of 2.7 V to 4.3 V and the /OE pin must be logic high for this rating to be applicable. Any condition where VCC is unpowered or the /OE pin is not high must reference the rest of the Absolute Maximum Ratings Table.
6.2 ESD Ratings
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±3500ElectrostaticV(ESD) Vdischarge Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
VCC Supply voltage 2.7 4.3 V VI/O (USB) Analog voltage 0 3.6 V VI/O (MHL) VI Digital input voltage (SEL, OE) 0 VCC V TRAMP (VCC) Power supply ramp time requirement (VCC) 100 1000 μs/V TA Operating free-air temperature -40 85 ºC
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6.4 Thermal Information
THERMAL METRIC (1) RSE (UQFN) UNIT
10 PINS
RθJA Junction-to-ambient thermal resistance 191.6 °C/W RθJC(top) Junction-to-case (top) thermal resistance 94.3 °C/W RθJB Junction-to-board thermal resistance 117.5 °C/W ψJT Junction-to-top characterization parameter 7.4 °C/W ψJB Junction-to-board characterization parameter 117.4 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
6.5 Electrical Characteristics
TA = –40°C to 85°C, Typical values are at VCC = 3.3V, TA = 25°C, (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT MHL SWITCH RON ON-state resistance VCC = 2.7 V VI/O = 1.65 V, ION = –8 mA 5.7 9 Ω ON-state resistance matchΔRON VCC = 2.7 V VI/O = 1.65 V, ION = –8 mA 0.1 Ωbetween + and – paths RON (FLAT) ON-state resistance flatness VCC = 2.7 V VI/O = 1.65 V to 3.45V, ION = –8 mA 1 Ω Switch OFF, VMHL+/MHL– = 1.65 V to 3.45 V,IOZ OFF leakage current VCC = 4.3 V –2 2 µA VD+/D– = 0 V Switch ON or OFF, VMHL+/MHL– = 1.65 V to
3.45 V,IOFF Power-off leakage current VCC = 0 V –10 10 µA
VD+/D– = NC Switch ON, VMHL+/MHL– = 1.65 V to 3.45 V,ION ON leakage current VCC = 4.3 V –2 2 µAVD+/D– = NC USB SWITCH RON ON-state resistance VCC = 2.7 V VI/O = 0.4 V, ION = –8 mA 4.6 7.5 Ω ON-state resistance matchΔRON VCC = 2.7 V VI/O = 0.4 V, ION = –8 mA 0.1 Ωbetween + and – paths RON (FLAT) ON-state resistance flatness VCC = 2.7 V VI/O = 0 V to 0.4 V, ION = –8 mA 1 Ω Switch OFF, VUSB+/USB– = 0 V to 3.6 V,IOZ OFF leakage current VCC = 4.3 V –2 2 µAVD+/D– = 0 V Switch ON or OFF, VUSB+/USB– = 0 V to 3.6 V,IOFF Power-off leakage current VCC = 0 V –10 10 µA VD+/D– = NC Switch ON, VUSB+/USB– = 0 V to 3.6 V,ION ON leakage current VCC = 4.3 V –2 2 µAVD+/D– = NC DIGITAL CONTROL INPUTS (SEL, OE) VIH Input logic high VCC = 2.7 V to 4.3 V 1.3 V VIL Input logic low VCC = 2.7 V to 4.3 V 0.6 V IIN Input leakage current VCC = 4.3 V, VI/O = 0 V to 3.6 V, VIN = 0 to 4.3 V –10 10 μA Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: TS3USB3000
(2) CL includes probe and jig capacitance.
6.6 Dynamic Characteristics
6.7 Timing Requirements
Figure 1. Timing Diagram
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6.8 Typical Characteristics
Figure 2. ON-Resistance vs VI for MHL Switch Figure 3. ON-Resistance vs VI for USB Switch Figure 5. Differential S21 vs Frequency for USB SwitchFigure 4. Differential S21 vs Frequency for MHL Switch Figure 6. Off Isolation vs Frequency for MHL Path Figure 7. Off Isolation vs Frequency for USB Path
Figure 8. Cross Talk vs Frequency for MHL Path Figure 9. Cross Talk vs Frequency for USB Path
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7 Parameter Measurement Information
Figure 10. ON-State Resistance (RON) Figure 11. OFF Leakage Current (IOZ) Figure 12. Bandwidth (BW)
SCDS337B –DECEMBER 2012–REVISED DECEMBER 2015 www.ti.com
8 Detailed Description
8.1 Overview
The TS3USB3000 device is a 2-channel SPDT switch specially designed for the switching of high-speed MHL and USB 2.0 and 3.0 signals in handset and consumer applications, such as cell phones, digital cameras, and notebooks with hubs or controllers with limited USB I/Os. The wide bandwidth (6.1 GHz) of this switch allows signals to pass with minimum edge and phase distortion. The device multiplexes differential outputs from a USB host device to one of two corresponding outputs or from one USB connector to two processors or controllers. The switch is bidirectional and offers little or no attenuation of the high-speed signals at the outputs. The device also has a low power mode that will reduce the power consumption to 5 μA for portable applications with a battery or limited power budget. The device is designed for low bit-to-bit skew and high channel-to-channel noise isolation, and is compatible with various standards, such as high-speed USB 2.0 (480 Mbps). The TS3USB221A device integrates ESD protection cells on all pins, is available in a tiny UQFN package (2 mm × 1.5 mm) and is characterized over the free-air temperature range from –40°C to 85°C.
8.2 Functional Block Diagram
8.3 Feature Description
8.3.1 Low Power Mode
The TS3USB3000 has a low power mode that reduces the power consumption to 5 μA while the device is not in use. To put the device in low power mode and disable the switch, the bus-switch enable pin OE must be supplied with a logic High signal.
8.3.2 Overvoltage Protection When 9-V Short to D– Pin
This section describes how to protect the TS3USB3000 and the surrounding system when the D– pin is exposed to voltages greater than 5-V and less than 9-V. Voltages higher than 9-V damages the device. In charging applications it is possible for the USB plug to be inserted in such a way that the VBUS pin shorts to the D- pin of the connector. If there are peripherals on the D- pin that cannot tolerate conditions up to 9-V they can be damaged or destroyed. The TS3USB3000 can be used to protect the system from excess voltage if the correct precautions are taken.
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Product Folder Links: TS3USB3000
5 V Æ 9 V
recommended operating conditions and the OE pin is high.
- After a charger is connected to the USB port, the AP detects that a DCP is attached.
- The AP pulls the OE pin high to disable the switches.
- The AP communicates to the Charger that it can negotiate for a faster charging mode with VBUS at 9-V.
- The TS3USB3000 is now in a low-power state with the switches disabled and can protect the AP.
Figure 13. Potential VBUS to D- Short Example
8.3.2.1 Pin Leakage
Figure 14. Potential Leakage Path D- to VCC
8.4 Device Functional Modes
8.4.1 High Impedance Mode
be supplied with a logic High signal. Table 1. Function Table
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9 Application and Implementation
validate and test their design implementation to confirm system functionality.
9.1 Application Information
signals from on connector to two different locations.
9.2 Typical Application
which goes to the HDMI to MHL bridge. The TS3USB3000 has internal 6-MΩ pulldown resistors on SEL and OE. and the USB ID line that is needed for USB OTG (USB On-The-Go) application. Figure 15. Typical TS3USB3000 Application
9.2.1 Design Requirements
on OE enables the switch when power is applied to VCC.
9.2.2 Detailed Design Procedure
9.2.3 Application Curves
Figure 16. Eye Pattern: 0.7 Gbps With No Device Figure 17. Time Interval Error Histogram: 0.7 Gbps With Figure 19. Time Interval Error Histogram: 0.7 Gbps forFigure 18. Eye Pattern: 0.7 Gbps for MHL Switch
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Figure 27. Time Interval Error Histogram: 3 Gbps for MHLFigure 26. Eye Pattern: 3 Gbps for MHL Switch Figure 29. Time Interval Error Histogram: 4.5 Gbps WithFigure 28. Eye Pattern: 4.5 Gbps With No Device Figure 30. Eye Pattern: 4.5 Gbps for MHL Switch Figure 31. Time Interval Error Histogram: 4.5 Gbps for
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Figure 32. 480-Mbps USB 2.0 Eye Pattern With No Device Figure 33. 480-Mbps USB 2.0 Eye Pattern for USB Switch
10 Power Supply Recommendations
frequency noise to provide better load regulation across the frequency spectrum.
11 Layout
11.1 Layout Guidelines
differential impedance for optimal performance. lines; through-hole pins are not recommended. reduces reflections on the signal traces by minimizing impedance discontinuities. mounting holes, magnetic devices or ICs that use or duplicate clock signals. the stub must be less than 200 mm. Route all high-speed USB signal traces over continuous GND planes, with no interruptions. Avoid crossing over anti-etch, commonly found with plane splits.
recommended; two signal layers separated by a ground and power layer as shown in Figure 34. Figure 34. Four-Layer Board Stack-Up number of signal vias reduces EMI by reducing inductance at high frequencies.
11.2 Layout Example
Figure 35. Package Layout Diagram
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12 Device and Documentation Support
12.1 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.
12.2 Trademarks
E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners.
12.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
12.4 Glossary
SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback 19 Product Folder Links: TS3USB3000
www.ti.com 24-Feb-2016 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples TS3USB3000MRSER ACTIVE UQFN RSE 10 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 DRJ TS3USB3000RLSR PREVIEW UQFN RLS 10 3000 TBD Call TI Call TI -40 to 85 TS3USB3000RSER ACTIVE UQFN RSE 10 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 DSJ (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
www.ti.com 24-Feb-2016 Addendum-Page 2 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 21-Oct-2015 Pack Materials-Page 1
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TS3USB3000MRSER UQFN RSE 10 3000 203.0 203.0 35.0 TS3USB3000RSER UQFN RSE 10 3000 203.0 203.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 21-Oct-2015 Pack Materials-Page 2
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