TS3L110DR

TS3L110_10 TI | Alldatasheet

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QUAD SPDT HIGH-BANDWIDTH 10/100 BASE-T LAN SWITCH DIFFERENTIAL 8-CHANNEL TO 4-CHANNEL MULTIPLEXER/DEMULTIPLEXER SCDS176 − SEPTEMBER 2004 1POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 /C0068Wide Bandwidth (BW = 500 MHz Typ) /C0068Low Crosstalk (XTALK = −30 dB Typ) /C0068Bidirectional Data Flow, With Near-Zero Propagation Delay /C0068Low and Flat ON-State Resistance on = 4 /C0087 Typ, ron(flat) = 1 /C0087) /C0068Switching on Data I/O Ports (0 to 5 V) /C0068VCC Operating Range From 3 V to 3.6 V /C0068Ioff Supports Partial-Power-Down Mode Operation /C0068Data and Control Inputs Have Undershoot Clamp Diodes /C0068Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II /C0068ESD Performance Tested Per JESD 22 − 2000-V Human-Body Model (A114-B, Class II) − 1000-V Charged-Device Model (C101) /C0068Suitable for Both 10 Base-T/100 Base-T Signaling D, DBQ, DGV, OR PW PACKAGE (TOP VIEW) S IA0 IA1 YA IB0 IB1 YB GND VCC E ID0 ID1 YD IC0 IC1 YC RGY PACKAGE (TOP VIEW) 11 6 E ID0 ID1 YD IC0 IC1 IA0 IA1 YA IB0 IB1 YB S YC V GND CC description/ordering information The TI TS3L110 LAN switch is a 4-bit 1-of-2 multiplexer/demultiplexer with a single switch-enable (E ) input. When E is low, the switch is enabled, and the I port is connected to the Y port. When E is high, the switch is disabled, and the high-impedance state exists between the I and Y ports. The select (S) input controls the data path of the multiplexer/demultiplexer.

ORDERING INFORMATION

TA PACKAGE† ORDERABLE PART NUMBER TOP-SIDE MARKING QFN − RGY Tape and reel TS3L110RGYR TK110 SOIC D Tube TS3L110D TS3L110SOIC − D Tape and reel TS3L110DR TS3L110 −40°C to 85°C SSOP (QSOP) − DBQ Tape and reel TS3L110DBQR TK11040 C to 85 C TSSOP PW Tube TS3L110PW TK110TSSOP − PW Tape and reel TS3L110PWR TK110 TVSOP − DGV Tape and reel TS3L110DGVR TK110 † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Copyright © 2004, Texas Instruments Incorporated Please be aware that an important notice concerning avail ability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

QUAD SPDT HIGH-BANDWIDTH 10/100 BASE-T LAN SWITCH DIFFERENTIAL 8-CHANNEL TO 4-CHANNEL MULTIPLEXER/DEMULTIPLEXER SCDS176 − SEPTEMBER 2004

2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

description/ordering information (continued) This device can be used to replace mechanical relays in LAN applications. This device has low and flat ron, wide bandwidth, and low crosstalk, making it suitable for 10 Base-T, 100 Base-T, and various other LAN applications. The device can be used to route signals from a 10/100 Base-T ethernet transceiver to the RJ-45 LAN connectors in laptops or in docking stations. The device is designed for low channel-to-channel skew and low crosstalk. This device is fully specified for partial-power-down applications using I off. The I off feature ensures that damaging current will not backflow through the device when it is powered down. The device has isolation during power off. To ensure the high-impedance state during power up or power down, E should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. FUNCTION TABLE INPUTS INPUT/OUTPUT FUNCTIONE S INPUT/OUTPUT YX FUNCTION L L IX0 YX = IX0 L HI X 1 YX = IX1 H X Z Disconnect PIN DESCRIPTIONS PIN NAME DESCRIPTION IAn−IDn Data I/Os S Select input E Enable input YA−YD Data I/Os

QUAD SPDT HIGH-BANDWIDTH 10/100 BASE-T LAN SWITCH DIFFERENTIAL 8-CHANNEL TO 4-CHANNEL MULTIPLEXER/DEMULTIPLEXER SCDS176 − SEPTEMBER 2004 3POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 logic diagram (positive logic) YA IA0 IA1 IB0 IB1 IC0 IC1 ID0 ID1 E S YC YB YD Control Logic

QUAD SPDT HIGH-BANDWIDTH 10/100 BASE-T LAN SWITCH DIFFERENTIAL 8-CHANNEL TO 4-CHANNEL MULTIPLEXER/DEMULTIPLEXER SCDS176 − SEPTEMBER 2004

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absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditi ons” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltages are with respect to ground, unless otherwise specified. 2. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 3. V I and VO are used to denote specific conditions for VI/O. 4. I I and IO are used to denote specific conditions for II/O. 5. The package thermal impedance is calculated in accordance with JESD 51-7. 6. The package thermal impedance is calculated in accordance with JESD 51-5. recommended operating conditions (see Note 7) MIN MAX UNIT VCC Supply voltage 3 3.6 V VIH High-level control input voltage (E, S) 2 5.5 V VIL Low-level control input voltage (E, S) 0 0.8 V VI/O Input/output voltage 0 5.5 V TA Operating free-air temperature −40 85 °C NOTE 7: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

QUAD SPDT HIGH-BANDWIDTH 10/100 BASE-T LAN SWITCH DIFFERENTIAL 8-CHANNEL TO 4-CHANNEL MULTIPLEXER/DEMULTIPLEXER SCDS176 − SEPTEMBER 2004 5POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 electrical characteristics over recommended operating free-air temperature range, VCC = 3.3 V /C0043 0.3 V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP† MAX UNIT VIK E, S VCC = 3.6 V, IIN = −18 mA −1.8 V IIH E, S VCC = 3.6 V, VIN = 5.5 V ±1 μA IIL E, S VCC = 3.6 V, VIN = GND ±1 μA Ioff VCC = 0, VO = 0 to 5.5 V , VI = 0 1 μA ICC VCC = 3.6 V, II/O = 0, Switch ON or OFF 0.7 1.5 mA Cin E, S f = 1 MHz, VIN = 0 2.5 3.5 pF C I port VI = 0, f = 1 MHz, Outputs open, Switch OFF 3.5 5 pFCio(OFF) Y port VI = 0, f = 1 MHz, Outputs open, Switch OFF 5.5 7 pF Cio(ON) I or Y port VI = 0, f = 1 MHz, Outputs open, Switch ON 10.5 13 pF ron VCC = 3 V 1.25 V ≤ VI ≤ VCC, II = −10 mA to −30 mA 4 8 Ω ron(flat)‡ VCC = 3 V VI = 1.25 V and VCC, II = −10 mA to −30 mA 1 Ω Δron§ VCC = 3 V, 1.25 V ≤ VI ≤ VCC, II = −10 mA to −30 mA 0.9 2 Ω VI, VO, II, and IO refer to I/O pins. VIN refers to the control inputs. † All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C. ‡ ron(flat) is the difference of ron in a given channel at specified voltages. § Δron is the difference of ron in a given device. switching characteristics over recommended operating free-air temperature range, VCC = 3.3 V /C0043 0.3 V, RL = 200 Ω, CL = 10 pF (unless otherwise noted) (see Figures 5 and 6) PARAMETER FROM (INPUT) TO (OUTPUT) MIN TYP† MAX UNIT tpd¶ I or Y Y or I 0.25 ns tPZH, tPZL E or S I or Y 0.5 7 ns tPHZ, tPLZ E or S I or Y 0.5 5 ns tsk(p)# I or Y Y or I 0.1 0.2 ns † All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C. ¶ The propagation delay is the calculated RC time constant of the typical ON-state resistance of the switch and the specified load capacitance when driven by an ideal voltage source (zero output impedance). # Skew between opposite transitions of the same output |tPHL − tPLH|. This parameter is not production tested. dynamic characteristics over recommended operating free-air temperature range, VCC = 3.3 V /C0043 0.3 V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP† MAX UNIT XTALK RL = 100 Ω, f = 250 MHz, see Figure 7 −26 dB OIRR RL = 100 Ω, f = 250 MHz, see Figure 8 −28 dB BW RL = 100 Ω, see Figure 6 500 MHz † All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C.

6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

Figure 1. Gain/Phase vs Frequency Figure 2. OFF Isolation vs Frequency

8 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

NOTES: A. C L includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns. D. The outputs are measured one at a time, with one transition per measurement. E. t PLZ and tPHZ are the same as tdis. F. t PZL and tPZH are the same as ten. Figure 5. Test Circuit and Voltage Waveforms

NOTES: A. C L includes probe and jig capacitance. Figure 6. Test Circuit and Voltage Waveforms

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NOTE A: C L includes probe and jig capacitance. Figure 7. Test Circuit for Frequency Response (BW) input, the output is measured at IA0. All unused analog I/O ports are left open.

NOTES: A. C L includes probe and jig capacitance. B. A 50- Ω termination resistor is needed to match the loading of the network analyzer. Figure 8. Test Circuit for Crosstalk (XTALK) and output (I) ports are connected to GND through 50-Ω pulldown resistors.

12 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

NOTES: A. C L includes probe and jig capacitance. B. A 50- Ω termination resistor is needed to match the loading of the network analyzer. Figure 9. Test Circuit for OFF Isolation (OIRR) GND through 50-Ω pulldown resistors.

Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) TS3L110D ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3L110DBQR ACTIVE SSOP/ QSOP DBQ 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TS3L110DBQRE4 ACTIVE SSOP/ QSOP DBQ 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TS3L110DBQRG4 ACTIVE SSOP/ QSOP DBQ 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TS3L110DE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3L110DG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3L110DGVR ACTIVE TVSOP DGV 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3L110DGVRE4 ACTIVE TVSOP DGV 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3L110DGVRG4 ACTIVE TVSOP DGV 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3L110DR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3L110DRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3L110DRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3L110PW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3L110PWE4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3L110PWG4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3L110PWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3L110PWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3L110PWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3L110RGYR ACTIVE VQFN RGY 16 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TS3L110RGYRG4 ACTIVE VQFN RGY 16 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR (1)The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2)Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontentfor the latest availability information and additional product content details. PACKAGE OPTION ADDENDUM www.ti.com 21-Dec-2009 Addendum-Page 1

TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS):TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br):TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. PACKAGE OPTION ADDENDUM www.ti.com 21-Dec-2009 Addendum-Page 2

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 30-Jul-2010 Pack Materials-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TS3L110DGVR TVSOP DGV 16 2000 346.0 346.0 29.0 TS3L110DR SOIC D 16 2500 333.2 345.9 28.6 TS3L110PWR TSSOP PW 16 2000 346.0 346.0 29.0 TS3L110RGYR VQFN RGY 16 3000 346.0 346.0 29.0 PACKAGE MATERIALS INFORMATION www.ti.com 30-Jul-2010 Pack Materials-Page 2

MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE

24 PINS SHOWN

3,70 3,50 4,90 5,10 20DIM PINS ** 4073251/E 08/00 1,20 MAX Seating Plane 0,05 0,15 0,25 0,50 0,75 0,23 0,13 11 2 24 13 4,30 4,50 0,16 NOM Gage Plane A 7,90 7,70 382416 4,90 5,103,70 3,50 A MAX A MIN 6,60 6,20 11,20 11,40 9,60 9,80 0,08 M0,070,40 0°–8° NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. D. Falls within JEDEC: 24/48 Pins – MO-153 14/16/20/56 Pins – MO-194

MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE

14 PINS SHOWN

0,65 M0,10 0,10 0,25 0,50 0,75 0,15 NOM Gage Plane 9,80 9,60 7,90 7,70 2016 6,60 6,40 4040064/F 01/97 0,30 6,60 6,20 0,19 4,30 4,50 0,15 A 1,20 MAX 5,10 4,90 3,10 2,90 A MAX A MIN DIM PINS ** 0,05 4,90 5,10 Seating Plane 0°–8° NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-153

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