TS3DV520RHURG4 | DigiCamel IC Datasheet

Online Datasheet

Read TS3DV520RHURG4 online.

DATASHEET SEARCH SITE | WWW.ALLDATASHEET.COM

Document overview

Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
PDF pages: 20

Technical content

(TOP VIEW) GND VCC NC GND GND VCC GND GND SEL VCC 0B1 1B1 0B2 1B2 GND 2B1 3B1 2B2 3B2 GND VCC 4B1 5B1 4B2 5B2 GND 6B1 7B1 6B2 7B2 VCC GND NC GND NC NC VCC GND GND 8B1 9B1 GND 8B2 9B2 VCC GND TS3DV520 www.ti.com SCDS197D –DECEMBER 2005–REVISED OCTOBER 2009 5-CHANNELDIFFERENTIAL10:20MULTIPLEXERSWITCHFORDVI/HDMIAPPLICATIONS Check forSamples: TS3DV520 1FEATURES

Compatible With HDMI v1.2a(Type A) DVI 1.0 High-Speed DigitalInterface – Wide Bandwidth ofOver 1.65Gbps (Bandwidth 2.4Gbps Typ) – 165-MHz Speed Operation – SerialData Stream at10× PixelClock Rate – Supports AllVideo Formats up to1080p and SXGA (1280× 1024 at75 Hz) – TotalRaw Capacity4.95Gbps (SingleLink) – HDCP Compatible
Low Crosstalk(XTALK = –41 dB Typ)
Low Bit-to-BitSkew (tsk(o)= 0.1ns Max)
Low and FlatON-StateResistance (ron = 6 Ω Max, ron(flat)= 0.5Ω Typ)
Low Input/OutputCapacitance (CON = 7.8pF Typ)
Rail-to-RailSwitchingon Data I/OPorts (0to5 V)
VCC OperatingRange From 3 V to3.6V
IoffSupports Partial-Power-DownMode Operation
Latch-Up Performance Exceeds 100 mA Per JESD 78,Class II
ESD Performance Tested Per JESD 22 – 2000-V Human-Body Model (A114-B,Class II) NC – No internalconnection– 1000-V Charged-DeviceModel (C101)

APPLICATIONS

DVI/HDMI SignalSwitching
DifferentialDVI,HDMI SignalMultiplexingfor Audio/VideoReceiversand High-Definition Televisions(HDTVs)
10/100/1000Base-T SignalSwitching
Hub and Router SignalSwitching DESCRIPTION/ORDERING INFORMATION The TS3DV520 isa 20-bitto10-bitmultiplexer/demultiplexerdigitalvideoswitchwitha singleselect(SEL)input. SEL controlsthe data path of the multiplexer/demultiplexer.The deviceprovidesfivedifferentialchannelsfor digitalvideosignalswitching.Thisdevicecan alsobe used toreplacemechanicalrelaysinLAN applicationsand allowsforsignalsto be routedfrom a 10/100/1000Base-T transceiverto the RJ-45 connectorsinlaptopsor dockingstations. Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsofTexas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 2005–2009,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.

Digital□TV HDMI Receiver TS3DV520 DVD□Player STB Digital□TV HDMI Receiver TS3DV520 DVD□Player STB TS3DV520 SCDS197D –DECEMBER 2005–REVISED OCTOBER 2009 www.ti.com This deviceprovideslow and flatON-stateresistance(ron) and excellentON-stateresistancematch. Low input/outputcapacitance,highbandwidth,lowskew,and lowcrosstalkamong channelsmake thisdevicesuitable forvariousdigitalvideoapplications,such as DVI and HDMI. Thisdeviceisfullyspecifiedforpartial-power-downapplicationsusingIoff.The Iofffeatureensuresthatdamaging currentwillnotbackflowthroughthedevicewhen itispowered down. The devicehas isolationduringpower off. Table1. ORDERING INFORMATION (1) TA PACKAGE (2) ORDERABLE PART NUMBER TOP-SIDE MARKING –40°C to85°C TQFN Tape and reel TS3DV520RHUR SD520 (1) Forthemost currentpackage and orderinginformation,see thePackage OptionAddendum attheend ofthisdocument,orsee theTI web siteatwww.ti.com. (2) Package drawings,thermaldata,and symbolizationareavailableatwww.ti.com/packaging. FUNCTION TABLE INPUT INPUT/OUTPUT FUNCTIONSEL An L nB1 An = nB1 nB2 high-impedancemode H nB2 An = nB2 nB1 high-impedancemode PIN DESCRIPTION NAME DESCRIPTION An Data I/O nBm Data I/O SEL Selectinput

2 SubmitDocumentationFeedback Copyright© 2005–2009,Texas InstrumentsIncorporated

ProductFolderLink(s):TS3DV520

SCDS197D –DECEMBER 2005–REVISED OCTOBER 2009 www.ti.com AbsoluteMaximum Ratings(1) overoperatingfree-airtemperaturerange(unlessotherwisenoted) MIN MAX UNIT VCC Supplyvoltagerange –0.5 4.6 V VIN Controlinputvoltagerange(2)(3) –0.5 7 V VI/O SwitchI/Ovoltagerange(2)(3)(4) –0.5 7 V IIK Controlinputclamp current VIN < 0 –50 mA II/OK I/Oportclamp current VI/O< 0 –50 mA II/O ON-stateswitchcurrent(5) ±128 mA ContinuouscurrentthroughVCC orGND ±100 mA θJA Package thermalimpedance(6) 31.8 °C/W Tstg Storagetemperaturerange –65 150 °C (1) Stressesbeyond thoselistedunder"absolutemaximum ratings"may cause permanentdamage tothedevice.These arestressratings only,and functionaloperationofthedeviceattheseorany otherconditionsbeyond thoseindicatedunder"recommended operating conditions"isnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmay affectdevicereliability. (2) Allvoltagesarewithrespecttoground,unlessotherwisespecified. (3) The inputand outputvoltageratingsmay be exceeded iftheinputand outputclamp-currentratingsareobserved. (4) VIand VO areused todenotespecificconditionsforVI/O. (5) IIand IO areused todenotespecificconditionsforII/O. (6) The package thermalimpedance iscalculatedinaccordancewithJESD 51-7. Recommended OperatingConditions(1) MIN MAX UNIT VCC Supplyvoltage 3 3.6 V VIH High-levelcontrolinputvoltage(SEL) 2 5.5 V VIL Low-levelcontrolinputvoltage(SEL) 0 0.8 V VI/O Input/outputvoltage 0 5.5 V TA Operatingfree-airtemperature –40 85 °C (1) Allunused inputsofthedevicemust be heldatVCC orGND toensureproperdeviceoperation.RefertotheTIapplicationreport, ImplicationsofSlow orFloatingCMOS Inputs,literaturenumber SCBA004.

4 SubmitDocumentationFeedback Copyright© 2005–2009,Texas InstrumentsIncorporated

ProductFolderLink(s):TS3DV520

www.ti.com SCDS197D –DECEMBER 2005–REVISED OCTOBER 2009 ElectricalCharacteristics(1) forhigh-frequencyswitchingoverrecommended operatingfree-airtemperaturerange,VCC = 3.3V ± 0.3V (unlessotherwisenoted) PARAMETER TEST CONDITIONS MIN TYP (2) MAX UNIT VIK SEL VCC = 3.6V, IIN = –18 mA –0.7 –1.2 V IIH SEL VCC = 3.6V, VIN = VCC ±1 μA IIL SEL VCC = 3.6V, VIN = GND ±1 μA Ioff VCC = 0, VO = 0 to3.6V, VI= 0 1 μA ICC VCC = 3.6V, II/O= 0, SwitchON orOFF 250 500 μA C IN SEL f= 1 MHz, VIN = 0 2 2.5 pF C OFF B port VI= 0, f= 1 MHz, Outputsopen, SwitchOFF 2.5 3 pF C ON VI= 0, f= 1 MHz, Outputsopen, SwitchON 7.8 8.5 pF ron VCC = 3 V, 1.5V ≤ VI ≤ VCC , IO = –40 mA 3.5 6 Ω ron(flat)(3) VCC = 3 V, VI= 1.5V and VCC , IO = –40 mA 0.5 Ω Δron (4) VCC = 3 V, 1.5V ≤ VI ≤ VCC , IO = –40 mA 0.4 1 Ω (1) VI,VO ,II,and IO refertoI/Opins.VIN referstothecontrolinputs. (2) AlltypicalvaluesareatVCC = 3.3V (unlessotherwisenoted),TA = 25°C. (3) ron(flat)isthedifferenceofron ina givenchannelatspecifiedvoltages. (4) Δron isthedifferenceofron fromcenter(A4,A5)portstoany otherport. SwitchingCharacteristics overrecommended operatingfree-airtemperaturerange,VCC = 3.3V ± 0.3V,R L = 200 Ω,C L = 10 pF (unlessotherwisenoted)(seeFigure4 and Figure5) FROM TOPARAMETER MIN TYP (1) MAX UNIT(INPUT) (OUTPUT) tpd (2) A orB B orA 0.25 ns tPZH ,tPZL SEL A orB 0.5 15 ns tPHZ ,tPLZ SEL A orB 0.5 9 ns tsk(o) (3) A orB B orA 0.05 0.1 ns tsk(p) (4) 0.05 0.1 ns (1) AlltypicalvaluesareatVCC = 3.3V (unlessotherwisenoted),TA = 25°C. (2) The propagationdelayisthecalculatedRC timeconstantofthetypicalON-stateresistanceoftheswitchand thespecifiedload capacitancewhen drivenby an idealvoltagesource(zerooutputimpedance). (3) Outputskew between centerport(A4 toA5)toany otherport (4) Skew between oppositetransitionsofthesame outputina givendevice|tPHL – tPLH | Dynamic Characteristics overrecommended operatingfree-airtemperaturerange,VCC = 3.3V ± 0.3V (unlessotherwisenoted) PARAMETER TEST CONDITIONS TYP (1) UNIT XTALK R L = 100 Ω, f= 250 MHz, See Figure7 –41 dB O IRR R L = 100 Ω, f= 250 MHz, See Figure8 –39 dB BW R L = 100 Ω, See Figure6 1.2 GHz (1) AlltypicalvaluesareatVCC = 3.3V (unlessotherwisenoted),TA = 25°C. Copyright© 2005–2009,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLink(s):TS3DV520

−100 −80 −60 −40 −20 Frequency (MHz) 0.1 1 100010 100 Attenuation (dB) 10,000 −12 −10 Frequency (MHz) 0.1 1 1000 10 100 Frequency (MHz) 10,000 Gain (dB) 0 1 2 3 4 5 6 VCOM (V) ron (/C0087) −100 −80 −60 −40 −20 Frequency (MHz) 0.1 1 100010 100 Attenuation (dB) 10,000 TS3DV520 SCDS197D –DECEMBER 2005–REVISED OCTOBER 2009 www.ti.com OPERATING CHARACTERISTICS Figure1.Gain/Phase vs Frequency Figure2.OFF Isolationvs Frequency Figure3.Crosstalkvs Frequency Figure4.ron and V0 vs V1

6 SubmitDocumentationFeedback Copyright© 2005–2009,Texas InstrumentsIncorporated

ProductFolderLink(s):TS3DV520

www.ti.com SCDS197D –DECEMBER 2005–REVISED OCTOBER 2009

APPLICATION INFORMATION

(see Note A) TEST CIRCUIT 2 × VCC Open GND R L R L NOTES: A. C L includes probe and jig capacitance. B. W aveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. W aveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤/charBnZrBnZrBnZrBnZrBnZrBnZrBnZrBnZr10 MHz, ZO = 50 W , tr ≤/charBnZrBnZrBnZrBnZrBnZrBnZrBnZrBnZr2.5 ns, tf ≤/charBnZrBnZrBnZrBnZrBnZrBnZrBnZrBnZr2.5 ns. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. 50 Ω VG1 VCC DUT 50 Ω VIN 50 Ω VG2 50 Ω VI TEST R LS1 V∆C LVCC VI tPLZ /tPZL 3.3 V ±/charBnZrBnZrBnZrBnZrBnZrBnZrBnZrBnZr0.3 V 2 × VCC 200 Ω GND 10 pF 0.3 V Input Generator Input Generator VO tPHZ /tPZH 3.3 V ±/charBnZrBnZrBnZrBnZrBnZrBnZrBnZrBnZr0.3 V GND 200 Ω VCC 10 pF 0.3 V tPZL VOH −0.3 V VOLT AGE W AVEFORMS ENABLE AND DISABLE TIMES VCC /2 VCC /2 Output Control (VIN) 1.25 V 2.5 V VOH VOL +0.3 V VOH VOL 0 V 1.25 V tPZH tPLZ tPHZ Output W aveform 2 S1 at GND (see Note B) Output W aveform 1 S1 at 2 /C0121 VCC (see Note B) VOL TS3DV520 SCDS197D –DECEMBER 2005–REVISED OCTOBER 2009 www.ti.com PARAMETER MEASUREMENT INFORMATION (Enableand DisableTimes) Figure5.TestCircuitand VoltageWaveforms

8 SubmitDocumentationFeedback Copyright© 2005–2009,Texas InstrumentsIncorporated

ProductFolderLink(s):TS3DV520

(see Note A) TEST CIRCUIT 2 × VCC Open GND R L R L VOH VOL VOLT AGE W AVEFORMS OUTPUT SKEW (t sk(o)) Data Out at YB 1 or YB2 NOTES: A. C L includes probe and jig capacitance. B. W aveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. W aveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤/charBnZrBnZrBnZrBnZrBnZrBnZrBnZrBnZr10 MHz, ZO = 50 W , tr ≤/charBnZrBnZrBnZrBnZrBnZrBnZrBnZrBnZr2.5 ns, tf ≤/charBnZrBnZrBnZrBnZrBnZrBnZrBnZrBnZr2.5 ns. D. The outputs are measured one at a time, with one transition per measurement. 50 Ω VG1 VCC DUT 50 Ω VIN 50 Ω VG2 50 Ω VI TEST R LS1 V∆C L 3.3 V ±/charBnZrBnZrBnZrBnZrBnZrBnZrBnZrBnZr0.3 V VCC VI tsk(p) tsk(o) 3.3 V ±/charBnZrBnZrBnZrBnZrBnZrBnZrBnZrBnZr0.3 V Open Open 200 Ω 200 Ω VCC or GND VCC or GND 10 pF 10 pF Input Generator Input Generator VO (VOH + VOL )/2 VOH VOL Data Out at XB 1 or XB2 (VOH + VOL )/2 3.5 V 1.5 V Data In at Ax or Ay 2.5 V tPLHx tPHLx tsk(o) tsk(o) tPLHy tPHLy tsk(o) = /C0124tPLHy − tPLHx /C0124 or /C0124tPHLy − tPHLx /C0124 VOH VOL VOLT AGE W AVEFORMS PULSE SKEW (t sk(p)) Output (VOH + VOL )/2 Input 2.5 V tPLH tPHL tsk(p) = /C0124tPLH − tPLH /C0124 3.5 V 1.5 V TS3DV520 www.ti.com SCDS197D –DECEMBER 2005–REVISED OCTOBER 2009 PARAMETER MEASUREMENT INFORMATION (Skew) Figure6.TestCircuitand VoltageWaveforms Copyright© 2005–2009,Texas InstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLink(s):TS3DV520

(HP8753ES) EXT TRIGGER BIAS P1 P2 DUT A 0 SEL 0B 1 VSEL VCC VBIAS C L = 10 pF (see Note A) NOTE A: C L includes probe and jig capacitance. TS3DV520 SCDS197D –DECEMBER 2005–REVISED OCTOBER 2009 www.ti.com PARAMETER MEASUREMENT INFORMATION Figure7.TestCircuitforFrequency Response (BW) Frequencyresponseismeasured attheoutputoftheON channel.For example,when VSEL = 0 and A0 isthe input,theoutputismeasured at0B1.Allunused analogI/Oportsareleftopen. HP8753ES setup Average= 4 RBW = 3 kHz VBIAS = 0.35V ST = 2 s P1 = 0 dBM

10 SubmitDocumentationFeedback Copyright© 2005–2009,Texas InstrumentsIncorporated

ProductFolderLink(s):TS3DV520

(HP8753ES) R L = 100 Ω EXT TRIGGER BIAS P1 P2 DUT A 0 SEL 0B 1 VSEL VCC VBIAS A 1 1B 2 NOTES: A. C L includes probe and jig capacitance. B. A 50-Ω termination resistor is needed to match the loading of the network analyzer. 1B 1 R L = 100 Ω 2B 1 3B 1 A 2 A 3 0B 2 3B 2 2B 2 TS3DV520 www.ti.com SCDS197D –DECEMBER 2005–REVISED OCTOBER 2009 PARAMETER MEASUREMENT INFORMATION Figure8.TestCircuitforCrosstalk(XTALK ) Crosstalkismeasured attheoutputofthenonadjacentON channel.For example,when VSEL = 0 and A0 isthe input,theoutputismeasured at1B1.Allunused analoginput(A)portsare connectedtoGND, and output(B) portsareconnectedtoGND through50-Ω pulldownresistors. HP8753ES setup Average= 4 RBW = 3 kHz VBIAS = 0.35V ST = 2 s P1 = 0 dBM Copyright© 2005–2009,Texas InstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLink(s):TS3DV520

(HP8753ES) R L = 100 Ω EXT TRIGGER BIAS P1 P2 DUT A 0 SEL 0B 1 VSEL VCC VBIAS 0B 2 NOTES: A. C L includes probe and jig capacitance. B. A 50-Ω termination resistor is needed to match the loading of the network analyzer. A 1 1B 1 1B 2 TS3DV520 SCDS197D –DECEMBER 2005–REVISED OCTOBER 2009 www.ti.com PARAMETER MEASUREMENT INFORMATION Figure9.TestCircuitforOFF Isolation(OIRR) OFF isolationismeasured attheoutputoftheOFF channel.For example,when VSEL = VCC and A0 istheinput, the outputis measured at 0B2. Allunused analog input(A) portsare leftopen, and output(B) portsare connectedtoGND through50-Ω pulldownresistors. HP8753ES setup Average= 4 RBW = 3 kHz VBIAS = 0.35V ST = 2 P1 = 0 dBM

12 SubmitDocumentationFeedback Copyright© 2005–2009,Texas InstrumentsIncorporated

ProductFolderLink(s):TS3DV520

www.ti.com 29-May-2013 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples TS3DV520ERHUR ACTIVE WQFN RHU 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 SD520E TS3DV520RHUR ACTIVE WQFN RHU 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 SD520 TS3DV520RHURG4 ACTIVE WQFN RHU 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 SD520 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

www.ti.com 29-May-2013 Addendum-Page 2 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 2-Jun-2011 Pack Materials-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TS3DV520ERHUR WQFN RHU 56 2000 346.0 346.0 35.0 TS3DV520RHUR WQFN RHU 56 2000 346.0 346.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 2-Jun-2011 Pack Materials-Page 2

Texas InstrumentsIncorporatedand itssubsidiaries(TI)reservetherighttomake corrections,enhancements,improvementsand other changes toitssemiconductorproductsand servicesperJESD46, latestissue,and todiscontinueany productorserviceperJESD48, latest issue.Buyersshouldobtainthelatestrelevantinformationbeforeplacingordersand shouldverifythatsuch informationiscurrentand complete.Allsemiconductorproducts(alsoreferredtohereinas “components”)aresoldsubjecttoTI’s termsand conditionsofsale suppliedatthetimeoforderacknowledgment. TIwarrantsperformanceofitscomponents tothespecificationsapplicableatthetimeofsale,inaccordancewiththewarrantyinTI’s terms and conditionsofsaleofsemiconductorproducts.Testingand otherqualitycontroltechniquesareused totheextentTIdeems necessary tosupportthiswarranty.Exceptwhere mandated by applicablelaw,testingofallparametersofeach component isnotnecessarily performed. TIassumes no liabilityforapplicationsassistanceorthedesignofBuyers’products.Buyersareresponsiblefortheirproductsand applicationsusingTIcomponents.To minimizetherisksassociatedwithBuyers’productsand applications,Buyersshouldprovide adequatedesignand operatingsafeguards. TIdoes notwarrantorrepresentthatany license,eitherexpressorimplied,isgrantedunderany patentright,copyright,mask work right,or otherintellectualpropertyrightrelatingtoany combination,machine,orprocessinwhichTIcomponents orservicesareused.Information publishedby TIregardingthird-partyproductsorservicesdoes notconstitutea licensetouse such productsorservicesora warrantyor endorsementthereof.Use ofsuch informationmay requirea licensefroma thirdpartyunderthepatentsorotherintellectualpropertyofthe thirdparty,ora licensefromTIunderthepatentsorotherintellectualpropertyofTI. ReproductionofsignificantportionsofTIinformationinTIdatabooks ordatasheetsispermissibleonlyifreproductioniswithoutalteration and isaccompaniedby allassociatedwarranties,conditions,limitations,and notices.TIisnotresponsibleorliableforsuch altered documentation.Informationofthirdpartiesmay be subjecttoadditionalrestrictions. ResaleofTIcomponents orserviceswithstatementsdifferentfromorbeyond theparametersstatedby TIforthatcomponent orservice voidsallexpressand any impliedwarrantiesfortheassociatedTIcomponent orserviceand isan unfairand deceptivebusinesspractice. TIisnotresponsibleorliableforany such statements. Buyeracknowledgesand agreesthatitissolelyresponsibleforcompliancewithalllegal,regulatoryand safety-relatedrequirements concerningitsproducts,and any use ofTIcomponents initsapplications,notwithstandingany applications-relatedinformationorsupport thatmay be providedby TI.Buyerrepresentsand agreesthatithas allthenecessaryexpertisetocreateand implementsafeguardswhich anticipatedangerousconsequencesoffailures,monitorfailuresand theirconsequences,lessenthelikelihoodoffailuresthatmightcause harm and takeappropriateremedialactions.BuyerwillfullyindemnifyTIand itsrepresentativesagainstany damages arisingoutoftheuse ofany TIcomponents insafety-criticalapplications. Insome cases,TIcomponents may be promotedspecificallytofacilitatesafety-relatedapplications.Withsuch components,TI’s goalisto helpenablecustomerstodesignand createtheirown end-productsolutionsthatmeet applicablefunctionalsafetystandardsand requirements.Nonetheless,such components aresubjecttotheseterms. No TIcomponents areauthorizedforuse inFDA ClassIII(orsimilarlife-criticalmedicalequipment)unlessauthorizedofficersoftheparties have executeda specialagreementspecificallygoverningsuch use. OnlythoseTIcomponents whichTIhas specificallydesignatedas militarygradeor“enhanced plastic”aredesignedand intendedforuse in military/aerospaceapplicationsorenvironments.Buyeracknowledgesand agreesthatany militaryoraerospaceuse ofTIcomponents whichhave not been so designatedissolelyattheBuyer's risk,and thatBuyerissolelyresponsibleforcompliancewithalllegaland regulatoryrequirementsinconnectionwithsuch use. TIhas specificallydesignatedcertaincomponents as meetingISO/TS16949 requirements,mainlyforautomotiveuse.Inany case ofuse of non-designatedproducts,TIwillnotbe responsibleforany failuretomeet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotiveand Transportationwww.ti.com/automotive Amplifiers amplifier.ti.com Communicationsand Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP ® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energyand Lighting www.ti.com/energy Clocksand Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space,Avionicsand Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Videoand Imaging www.ti.com/video RFID www.ti-rfid.com OMAP ApplicationsProcessors www.ti.com/omap TIE2E Community e2e.ti.com WirelessConnectivity www.ti.com/wirelessconnectivity MailingAddress:Texas Instruments,PostOfficeBox 655303,Dallas,Texas 75265 Copyright© 2013,Texas InstrumentsIncorporated

Product Information

TS3DV520RHURG4 specifications and overview.

Summary

5-CHANNEL DIFFERENTIAL 10:20 MULTIPLEXER SWITCH FOR DVI/HDMI APPLICATIONS

Description

5-CHANNEL DIFFERENTIAL 10:20 MULTIPLEXER SWITCH FOR DVI/HDMI APPLICATIONS

Source title TS3DV520RHURG4 Datasheet(PDF) - Texas Instruments

Related Parts

More parts from the same family.

Browse manufacturer