TS3A4742DGKR

TS3A4741_14 TI1 | Alldatasheet

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DGK□PACKAGE□.□.□.TS3A4741 (TOP VIEW) GND IN2 COM1 NO1 NO2 COM2 IN1 DCN□PACKAGE□.□.□.TS3A4741 (TOP VIEW) COM2 NO2 IN1 GND IN2 NO1 COM1 DGK□PACKAGE□.□.□.TS3A4742 (TOP VIEW) GND IN2 COM1 NC1 NC2 COM2 IN1 DCN□PACKAGE□.□.□.TS3A4742 (TOP VIEW) COM2 NC2 IN1 GND IN2 NC1 COM1 DESCRIPTION/ORDERING INFORMATION TS3A4741 TS3A4742 0.9- Ω LOW-VOLTAGE SINGLE-SUPPLY DUAL SPST ANALOG SWITCHES SCDS228D AUGUST 2006 REVISED JANUARY 2008 www.ti.com Power Routing Low ON-State Resistance on Battery-Powered Systems 0.9 Ω Max (3-V Supply) Audio and Video Signal Routing 1.5 Ω Max (1.8-V Supply) Low-Voltage Data-Acquisition Systems 0.4- Ω Max r on Flatness (3-V Supply) Communications Circuits 1.6-V to 3.6-V Single-Supply Operation PCMCIA Cards Available in SOT-23 and MSOP Packages Cellular Phones High Current-Handling Capacity (100 mA Modems Continuous) Hard Drives 1.8-V CMOS Logic Compatible (3-V Supply) Fast Switching: t ON ns, t OFF ns The TS3A4741/TS3A4742 are low ON-state resistance on low-voltage, dual single-pole/single-throw (SPST) analog switches that operate from a single 1.6-V to 3.6-V supply. These devices have fast switching speeds, handle rail-to-rail analog signals, and consume very low quiescent power. The digital logic input is 1.8-V CMOS compatible when using a single 3-V supply. The TS3A4741 has two normally open (NO) switches, and the TS3A4742 has two normally closed (NC) switches. Both devices are available in 8-pin SOT-23 and MSOP packages. ORDERING INFORMATION T A PACKAGE (1) (2) ORDERABLE PART NUMBER TOP-SIDE MARKING TS3A4741DGKR JYR MSOP DGK Reel of 2500 TS3A4742DGKR L7R C to C TS3A4741DCNR 8BLR SOT-23 DCN Reel of 3000 TS3A4742DCNR 8BPR (1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging (2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com FUNCTION TABLE NO TO COM, NC TO COM, IN COM TO NO COM TO NC (TS3A4741) (TS3A4742) L OFF ON H ON OFF Please be aware that an important notice concerning availability, standard warranty, and use in critical sheet. UNLESS OTHERWISE NOTED this document contains Copyright 2006 2008, Texas Instruments Incorporated PRODUCTION DATA information current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

www.ti.com ABSOLUTE MINIMUM AND MAXIMUM RATINGS (1) PACKAGE THERMAL IMPEDANCE TS3A4741 TS3A4742 0.9- Ω LOW-VOLTAGE SINGLE-SUPPLY DUAL SPST ANALOG SWITCHES SCDS228D AUGUST 2006 REVISED JANUARY 2008 over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT V Supply voltage reference to GND (2) 0.3 V V NO V COM Analog and digital voltage range 0.3 V 0.3 V V IN I NO On-state switch current V NO V COM to V 100 100 mA I COM I Continuous current through V or GND 100 mA I GND Peak current pulsed at ms, 10% duty cycle COM, V NO V COM 200 mA T A Operating temperature range C T J Junction temperature 150 C T stg Storage temperature range 150 C (1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) Signals on COM or NO exceeding V or GND are clamped by internal diodes. Limit forward diode current to maximum current rating. UNIT DCN package θ JA Package thermal impedance (1) C/W DGK package (1) The package thermal impedance is measured in accordance with JESD 51-7. Submit Documentation Feedback Copyright 2006 2008, Texas Instruments Incorporated Product Folder Link(s): TS3A4741 TS3A4742

www.ti.com ELECTRICAL CHARACTERISTICS FOR 3-V SUPPLY (1) (2) TS3A4741 TS3A4742 0.9- Ω LOW-VOLTAGE SINGLE-SUPPLY DUAL SPST ANALOG SWITCHES SCDS228D AUGUST 2006 REVISED JANUARY 2008 V 2.7 V to 3.6 T A C to V IH 1.4 V IL 0.5 V (unless otherwise noted) PARAMETER SYMBOL TEST CONDITIONS T A MIN TYP (3) MAX UNIT Analog Switch Analog signal range V COM V NO V V C 0.7 0.9 V 2.7 I COM 100 mA, ON-state resistance r on Ω V NO 1.5 V Full 1.1 C 0.03 0.05 ON-state resistance match V 2.7 I COM 100 mA, Δ r on Ω between channels (4) V NO 1.5 V Full 0.15 C 0.23 0.4 ON-state resistance V 2.7 I COM 100 mA, r on(flat) Ω flatness (5) V NO 1.5 V Full 0.5 C NO V 3.6 V COM 0.3 I NO(OFF) nA OFF leakage current (6) V NO 0.3 V Full C COM V 3.6 V COM 0.3 I COM(OFF) nA OFF leakage current (6) V NO 0.3 V Full C 2.5 0.01 2.5 COM V 3.6 V COM 0.3 I COM(ON) nA ON leakage current (6) V NO 0.3 or floating Full Dynamic C V NO 1.5 R L Ω Turn-on time t ON ns C L pF, See Figure Full C V NO 1.5 R L Ω Turn-off time t OFF ns C L pF, See Figure Full V GEN R GEN C L nF, Charge injection Q C C pC See Figure NO OFF capacitance C NO(OFF) f MHz, See Figure C pF COM OFF capacitance C COM(OFF) f MHz, See Figure C pF COM ON capacitance C COM(ON) f MHz, See Figure C pF Bandwidth BW R L Ω Switch ON C 125 MHz f MHz R L Ω C L pF, OFF isolation (7) O ISO C dB See Figure f MHz f MHz R L Ω C L pF, Crosstalk X TALK C dB See Figure f MHz R L Ω 0.04 f Hz to kHz, Total harmonic distortion THD C V COM V P-P R L 600 Ω 0.003 Digital Control Inputs (IN1, IN2) Input logic high V IH Full 1.4 V Input logic low V IL Full 0.5 V C 0.5 Input leakage current I IN V I or V nA Full Supply Power-supply range V 2.7 3.6 V C 0.075 Positive-supply current I V 3.6 V IN or V µ A Full 0.75 (1) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum. (2) Parts are tested at C and specified by design and correlation over the full temperature range. (3) Typical values are at V T A (4) Δ r on r on(max) r on(min) (5) Flatness is defined as the difference between the maximum and minimum value of r on as measured over the specified analog signal ranges. (6) Leakage parameters are 100% tested at the maximum-rated hot operating temperature and specified by correlation at T A (7) OFF isolation log COM NO V COM output, V NO input to OFF switch Copyright 2006 2008, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TS3A4741 TS3A4742

www.ti.com ELECTRICAL CHARACTERISTICS FOR 1.8-V SUPPLY (1) (2) TS3A4741 TS3A4742 0.9- Ω LOW-VOLTAGE SINGLE-SUPPLY DUAL SPST ANALOG SWITCHES SCDS228D AUGUST 2006 REVISED JANUARY 2008 V 1.65 V to 1.95 T A C to V IH V IL 0.4 V (unless otherwise noted) PARAMETER SYMBOL TEST CONDITIONS T A MIN TYP (3) MAX UNIT Analog Switch Analog signal range V COM V NO V V C 1.5 V 1.8 I COM mA, ON-state resistance r on Ω V NO 0.9 V Full C 0.09 0.15 ON-state resistance match V 1.8 I COM mA, Δ r on Ω between channels (4) V NO 0.9 V Full 0.25 C 0.7 0.9 ON-state resistance V 1.8 I COM mA, r on(flat) Ω flatness (5) V NO V Full 1.5 C 0.5 NO V 1.95 V COM 0.15 1.65 I NO(OFF) nA OFF leakage current (6) V NO 1.8 0.15 V Full C 0.5 COM V 1.95 V COM 0.15 1.65 I COM(OFF) nA OFF leakage current (6) V NO 1.8 0.15 V Full C 0.01 COM V 1.95 V COM 0.15 1.65 I COM(ON) nA ON leakage current (6) V NO 0.15 1.65 or floating Full Dynamic C V NO 1.5 R L Ω Turn-on time t ON ns C L pF, See Figure Full C V NO 1.5 R L Ω Turn-off time t OFF ns C L pF, See Figure Full V GEN R GEN C L nF, Charge injection Q C C 3.2 pC See Figure NO OFF capacitance C NO(OFF) f MHz, See Figure C pF COM OFF capacitance C COM(OFF) f MHz, See Figure C pF COM ON capacitance C COM(ON) f MHz, See Figure C pF Bandwidth BW R L Ω Switch ON C 123 MHz f MHz R L Ω C L pF, OFF isolation (7) O ISO C dB See Figure f 100 MHz f MHz R L Ω C L pF, Crosstalk X TALK C dB See Figure f 100 MHz R L Ω 0.14 f Hz to kHz, V COM Total harmonic distortion THD C V P-P R L 600 Ω 0.013 Digital Control Inputs (IN1, IN2) Input logic high V IH Full V Input logic low V IL Full 0.4 V C 0.1 Input leakage current I IN V I or V nA Full Supply Power-supply range V 1.65 1.95 V C 0.05 Positive-supply current I V I or V µ A Full 0.5 (1) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum. (2) Parts are tested at C and specified by design and correlation over the full temperature range. (3) Typical values are at T A (4) Δ r on r on(max) r on(min) (5) Flatness is defined as the difference between the maximum and minimum value of r on as measured over the specified analog signal ranges. (6) Leakage parameters are 100% tested at the maximum-rated hot operating temperature and specified by correlation at T A (7) OFF isolation log COM NO V COM output, V NO input to OFF switch Submit Documentation Feedback Copyright 2006 2008, Texas Instruments Incorporated Product Folder Link(s): TS3A4741 TS3A4742

www.ti.com TYPICAL PERFORMANCE 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 VCOM (V) ron /C0040Ω /C0041 V+ = 2.7 V V+ = 1.8 V 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 VCOM (V) ron (/C0087/C0041 85/C0053C 25/C0053C ±40/C0053C 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 VCOM (V) ron (/C0087) 85/C0053C 25/C0053C ±40/C0053C 1.00 10.00 100.00 1000.00 TA (°C) INC /ICOM (pA) −40°C 25 °C 85 °C NO/NC (OFF) COM (ON) VCOM (V) Q C (pC) V+ = 1.8 V V+ = 3 V V+ (V) tON /tOFF (ns) tON tOFF TS3A4741 TS3A4742 0.9- Ω LOW-VOLTAGE SINGLE-SUPPLY DUAL SPST ANALOG SWITCHES SCDS228D AUGUST 2006 REVISED JANUARY 2008 Figure r on vs V COM Figure r on vs V COM 1.8 Figure r on vs V COM 2.7 Figure I ON and I OFF vs Temperature 3.6 Figure Q C vs V COM Figure t ON and t OFF vs Supply Voltage Copyright 2006 2008, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TS3A4741 TS3A4742

www.ti.com TA (°C) tON/tOFF (ns) −40°C 25 °C 85 °C TON = 1.8 V TOFF = 1.8 V TON = 3 V TOFF = 3 V 0.001 0.010 0.100 1.000 10.000 100.000 1000.000 I+ (nA) V+ (V) 85/C0053C 25/C0053C ±40/C0053C −14 −12 −10 Gain (dB) Frequency (MHz) 0.1 1 100010 100 −90 −80 −70 −60 −50 −40 −30 −20 −10 Attenuation (dB) Frequency (MHz) 0.1 1 100010 100 0.0000 0.0004 0.0008 0.0012 0.0016 0.0020 0.0024 0.0028 0.0032 0.0036 0.0040 THD (%) Frequency (kHz) 10 100 100K1K 10K 0.036 0.037 0.038 0.039 0.040 0.041 0.042 THD (%) Frequency (kHz) 10 100 100K1K 10K TS3A4741 TS3A4742 0.9- Ω LOW-VOLTAGE SINGLE-SUPPLY DUAL SPST ANALOG SWITCHES SCDS228D AUGUST 2006 REVISED JANUARY 2008 TYPICAL PERFORMANCE (continued) Figure t ON and t OFF vs Temperature Figure I vs V Figure Gain vs Frequency Figure 10. OFF Isolation vs Frequency Figure 11. Total Harmonic Distortion vs Frequency Figure 12. Total Harmonic Distortion vs Frequency L Ω L 600 Ω Submit Documentation Feedback Copyright 2006 2008, Texas Instruments Incorporated Product Folder Link(s): TS3A4741 TS3A4742

www.ti.com −120 −100 −80 −60 −40 −20 Attenuation (dB) Frequency (MHz) 0.1 1 100010 100 TS3A4741 TS3A4742 0.9- Ω LOW-VOLTAGE SINGLE-SUPPLY DUAL SPST ANALOG SWITCHES SCDS228D AUGUST 2006 REVISED JANUARY 2008 TYPICAL PERFORMANCE (continued) Figure 13. Crosstalk vs Frequency PIN

DESCRIPTION

NO. TS3A4741 TS3A4742 NAME (DGK) (DCN) (DGK) (DCN) COM1, COM2 Common GND Digital ground IN1, IN2 Digital control to connect COM to NO or NC NC1, NC2 Normally closed NO1, NO2 Normally open V Power supply Copyright 2006 2008, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TS3A4741 TS3A4742

www.ti.com APPLICATION INFORMATION Logic Inputs Analog Signal Levels Layout TS3A4741 TS3A4742 0.9- Ω LOW-VOLTAGE SINGLE-SUPPLY DUAL SPST ANALOG SWITCHES SCDS228D AUGUST 2006 REVISED JANUARY 2008 Proper power-supply sequencing is recommended for all CMOS devices. Do not exceed the absolute maximum ratings, because stresses beyond the listed ratings can cause permanent damage to the device. Always sequence V on first, followed by NO, NC, or COM. Although it is not required, power-supply bypassing improves noise margin and prevents switching noise propagation from the V supply to other components. A 0.1- µ F capacitor, connected from V to GND, is adequate for most applications. The TS3A4741 logic inputs can be driven up to 3.6 regardless of the supply voltage. For example, with a 1.8-V supply, IN may be driven low to GND and high to 3.6 Driving IN rail to rail minimizes power consumption. Analog signals that range over the entire supply voltage to GND) can be passed with very little change in r on (see Typical Operating Characteristics). The switches are bidirectional, so the NO, NC, and COM pins can be used as either inputs or outputs. High-speed switches require proper layout and design procedures for optimum performance. Reduce stray inductance and capacitance by keeping traces short and wide. Ensure that bypass capacitors are as close to the device as possible. Use large ground planes where possible. Submit Documentation Feedback Copyright 2006 2008, Texas Instruments Incorporated Product Folder Link(s): TS3A4741 TS3A4742

www.ti.com PARAMETER MEASUREMENT INFORMATION VNONO GND COMIN VCOM 50 /c87 35□pFa 35□pF 50% 90% 50% 90% tOFFtON t <□5□ns t R F <□5□ns VNO VCOM VIH +□0.5□V IN RGEN NO GND COMIN VO C 1000□pF L a VI VGEN VI VO /c68VO TS3A4741 TS3A4742 0.9- Ω LOW-VOLTAGE SINGLE-SUPPLY DUAL SPST ANALOG SWITCHES SCDS228D AUGUST 2006 REVISED JANUARY 2008 Figure 14. Switching Times Figure 15. Charge Injection C Copyright 2006 2008, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TS3A4741 TS3A4742

www.ti.com NO GND COMINAs Required 1-MHz Capacitance Analyzer NO GND COMIN Network Analyzer Measurements□are□standardized□against short□at□socket□terminals.□OFF□isolation□is measured□between□COM□and□OFF□terminals on□each□switch.□Bandwidth□is□measured□between COM□and□ON□terminals□on□each□switch.□Signal direction□through□switch□is□reversed;□worst values□are□recorded. OFF□isolation□=□20□log Add□50- termination□for OFF□isolation V /VO I (1) /c87 50 /c87 50 /c87 50 /c87 50 /c87 VI VO

0.1 F/c109

(1) TS3A4741 TS3A4742 0.9- Ω LOW-VOLTAGE SINGLE-SUPPLY DUAL SPST ANALOG SWITCHES SCDS228D AUGUST 2006 REVISED JANUARY 2008 PARAMETER MEASUREMENT INFORMATION (continued) Figure 16. NO and COM Capacitance Figure 17. OFF Isolation, Bandwidth, and Crosstalk Submit Documentation Feedback Copyright 2006 2008, Texas Instruments Incorporated Product Folder Link(s): TS3A4741 TS3A4742

www.ti.com NO COM V+/2 IN 600 /c87 Audio Analyzer Signal Source CL =□50□pF RL =□600 /c87 Channel□ON:□COM□to□NO VSOURCE =□V+ P-P VI = V +/2 fSOURCE =□20□Hz□to□20□kHz -V+/2 CL (A) 600 /c87 TS3A4741 TS3A4742 0.9- Ω LOW-VOLTAGE SINGLE-SUPPLY DUAL SPST ANALOG SWITCHES SCDS228D AUGUST 2006 REVISED JANUARY 2008 PARAMETER MEASUREMENT INFORMATION (continued) C L includes probe and jig capacitance. Figure 18. Total Harmonic Distortion (THD) Copyright 2006 2008, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TS3A4741 TS3A4742

www.ti.com 16-Aug-2012 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) TS3A4741DCNR ACTIVE SOT-23 DCN 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3A4741DGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3A4741DGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3A4742DCNR ACTIVE SOT-23 DCN 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3A4742DGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3A4742DGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

www.ti.com 16-Aug-2012 Addendum-Page 2 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 16-Aug-2012 Pack Materials-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TS3A4741DCNR SOT-23 DCN 8 3000 202.0 201.0 28.0 TS3A4741DGKR VSSOP DGK 8 2500 358.0 335.0 35.0 TS3A4742DCNR SOT-23 DCN 8 3000 202.0 201.0 28.0 TS3A4742DGKR VSSOP DGK 8 2500 358.0 335.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 16-Aug-2012 Pack Materials-Page 2

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