TS3A27518ERTWR

TS3A27518E TI | Alldatasheet

Document overview

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Technical content

TS3A27518E 6-Channel (qSPI), 1:2 Multiplexer and Demultiplexer with Integrated IEC L-4 ESD and 1.8-V Logic Compatible Control Inputs

1 Features

• 1.65 V to 3.6 V single-supply operation
• Isolation in power-down mode, VCC = 0
• Low-capacitance switches, 21.5 pF (typical)
• Bandwidth up to 240 MHz for high-speed rail-to-rail signal handling
• Crosstalk and OFF isolation of –62 dB
• 1.8 V logic compatible control inputs
• 3.6 V tolerant control inputs
• Latch-up performance exceeds 100 mA per JESD 78, Class II
• ESD performance tested per JESD 22 – 2500-V human-body model (A114-B, Class II) – 1500-V charged-device model (C101)
• ESD performance: NC/NO ports – ±6-kV contact discharge (IEC 61000-4-2)
• 24-WQFN (4.00 mm × 4.00 mm) and 24-TSSOP (7.90 mm × 6.60 mm) packages

2 Applications

• SD-SDIO and MMC two-port MUX
• PC VGA video MUX-video systems
• Audio and video signal routing

3 Description

The TS3A27518E is a bidirectional, 6-channel, 1:2 multiplexer-demultiplexer designed to operate from 1.65 V to 3.6 V. This device can handle both digital and analog signals, and can transmit signals up to V CC in either direction. The TS3A27518E has two control pins, each controlling three 1:2 muxes at the same time, and an enable pin that put all outputs in high-impedance mode. The control pins are compatible with 1.8 V logic thresholds and are backward compatible with 2.5 V and 3.3 V logic thresholds. The TS3A27518E allows any SD, SDIO, and multimedia card host controllers to expand out to multiple cards or peripherals because the SDIO interface consists of 6-bits: CMD, CLK, and Data[0:3] signals. This device will support other 6-bit interfaces such a qSPI. The TS3A27518E has two control pins that give additional flexibility to the user. For example, the ability to mux two different audio-video signals in equipment such as an LCD television, an LCD monitor, or a notebook docking station. Device Information(1) PART NUMBER PACKAGE BODY SIZE (NOM) TS3A27518E WQFN (24) 4.00 mm × 4.00 mm TSSOP (24) 7.90 mm × 6.60 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Processor GND VDD VDDVI/O Control logic IN2 GND JTAG DEBUG, SPI, GPIO COM1RAM CPU Peripherals 0.1µF EN NO1 NO2 NO3 NO4 qSPI Device #1 SIO0 SIO1 SIO2 SIO3NO5 NO6 SLCK CS NC1 NC2 NC3 NC4 qSPI Device #2 SIO0 SIO1 SIO2 SIO3NC5 NC6 SLCK CS COM2 COM3 COM4 COM5 COM6 IN1 Typical Application TS3A27518E SCDS260F – MARCH 2009 – REVISED DECEMBER 2021 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.

12.2 Receiving Notification of Documentation Updates..22

13 Mechanical, Packaging, and Orderable

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision E (May 2019) to Revision F (December 2021) Page Changes from Revision D (May 2016) to Revision E (March 2019) Page Changes from Revision C (December 2015) to Revision D (May 2016) Page Changes from Revision B (May 2009) to Revision C (December 2015) Page

• Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Changes from Revision A (March 2009) to Revision B (May 2009) Page TS3A27518E SCDS260F – MARCH 2009 – REVISED DECEMBER 2021 www.ti.com

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5 Pin Configuration and Functions

24 N.C.7COM5 1COM1 18 NC4

23 NC18NO1

22 NC29COM6

21 IN110NO2

20 NC311IN2

19 NC612NO3

Figure 5-1. RTW Package 24-Pin WQFN Top View 1NC2 24 IN1 2NC1 23 NC3 3N.C. 22 NC6 4COM1 21 NC4 5GND 20 EN 6COM2 19 NC5 7COM3 18 NO5 8VCC 17 NO4 9COM4 16 NO6 10COM5 15 NO3 11NO1 14 IN2 12COM6 13 NO2 Not to scale Figure 5-2. PW Package 24-Pin TSSOP Top View 1 2 3 4 5 A B C D E Not to scale COM1 NC2 N.C. NC3 NC6 COM2 NC1 IN1 NC4 COM3 VCC GND EN NC5 COM4 COM6 IN2 NO5 NO4 COM5 NO1 NO2 NO3 NO6 Figure 5-3. ZQS Package 24-Pin BGA MICROSTAR JUNIOR Top View www.ti.com TS3A27518E SCDS260F – MARCH 2009 – REVISED DECEMBER 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 3 Product Folder Links: TS3A27518E

Table 5-1. Pin Functions PIN I/O DESCRIPTION NAME RTW ZQS PW COM1 1 A1 4 I/O Common-signal path COM2 3 B1 6 I/O Common-signal path COM3 4 C1 7 I/O Common-signal path COM4 6 D1 9 I/O Common-signal path COM5 7 E1 10 I/O Common-signal path COM6 9 D2 12 I/O Common-signal path EN 17 C4 20 I Digital control to enable or disable all signal paths GND 2 C3 5 — Ground. IN1 21 B4 24 I Digital control to connect COM to NC or NO IN2 11 D3 14 I Digital control to connect COM to NC or NO N.C. 24 A3 3 — Not connected NC1 23 B3 2 I/O Normally closed-signal path NC2 22 A2 1 I/O Normally closed-signal path NC3 20 A4 23 I/O Normally closed-signal path NC4 18 B5 21 I/O Normally closed-signal path NC5 16 C5 19 I/O Normally closed-signal path NC6 19 A5 22 I/O Normally closed-signal path NO1 8 E2 11 I/O Normally open-signal path NO2 10 E3 13 I/O Normally open-signal path NO3 12 E4 15 I/O Normally open-signal path NO4 14 D5 17 I/O Normally open-signal path NO5 15 D4 18 I/O Normally open-signal path NO6 13 E5 16 I/O Normally open-signal path VCC 5 C2 8 — Voltage supply TS3A27518E SCDS260F – MARCH 2009 – REVISED DECEMBER 2021 www.ti.com

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT VCC Supply voltage (3) –0.5 4.6 V VNC VNO VCOM Analog signal voltage (3) –0.5 4.6 V IK Analog port diode current (4) VCC < VNC, VNO, VCOM < 0 –50 mA INC INO ICOM ON-state switch current (5) VNC, VNO, VCOM = 0 to VCC –50 50 mA VI Digital input voltage (3) –0.5 4.6 V IIK Digital input clamp current (3) VIO < VI < 0 –50 mA ICC Continuous current through VCC 100 mA IGND Continuous current through GND –100 mA Tstg Storage temperature –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum. (3) All voltages are with respect to ground, unless otherwise specified. (4) Requires clamp diodes on analog port to VCC. (5) Pulse at 1-ms duration < 10% duty cycle.

6.2 ESD Ratings

V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) ±2500 VCharged-device model (CDM), per JEDEC specification JESD22-C101 or ANSI/ESDA/JEDEC JS-002 (2) ±1500 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT Supply voltage VCC 1.65 3.6 V Analog signal voltage VNC 0 3.6 VVNO VCOM Digital input voltage VI 0 3.6 V www.ti.com TS3A27518E SCDS260F – MARCH 2009 – REVISED DECEMBER 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 5 Product Folder Links: TS3A27518E

6.4 Thermal Information

THERMAL METRIC (1) TS3A27518E UNITPW (TSSOP) RTW (WQFN) ZQS (BGA MICROSTAR JUNIOR)

24 PINS 24 PINS 24 PINS

RθJA Junction-to-ambient thermal resistance 104 40.7 155.7 °C/W RθJC(top) Junction-to-case (top) thermal resistance 51.6 42.9 69.9 °C/W RθJB Junction-to-board thermal resistance 57.5 19.2 94.6 °C/W ψJT Junction-to-top characterization parameter 9.9 1 9 °C/W ψJB Junction-to-board characterization parameter 57.1 19.3 92.2 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance — 8 — °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.5 Electrical Characteristics for 3.3-V Supply VCC = 3 V to 3.6 V, TA = –40°C to +85°C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT ANALOG SWITCH VCOM, VNO, VNC Analog signal voltage 0 3.6 V ron ON-state resistance VCC = 3 V 0 ≤ (VNC or VNO) ≤ VCC, ICOM = –32 mA Switch ON, see Figure 7-1 TA = 25°C 4.4 6.2 ΩTA = –40°C to +85°C 7.6 Δron ON-state resistance match between channels VCC = 3 V VNC or VNO = 2.1 ICOM = –32 mA Switch ON, see Figure 7-1 TA = 25°C 0.3 0.7 ΩTA = –40°C to +85°C 0.8 ron(flat) ON-state resistance flatness VCC = 3 V 0 ≤ (VNC or VNO) ≤ VCC, ICOM = –32 mA Switch ON, see Figure 7-2 TA = 25°C 0.95 2.1 ΩTA = –40°C to +85°C 2.3 INC(OFF), INO(OFF) NC, NO OFF leakage current VCC = 3.6 V VNC or VNO = 1 VCOM = 3 V, or VNC or VNO = 3 VCOM = 1 V Switch OFF, see Figure 7-2 μA TA = –40°C to +85°C –7 7 INC(PWROFF), INO(PWROFF) VCC = 0 V VNC or VNO = 0 to 3.6 V, VCOM = 3.6 V to or VNC or VNO = 3.6 V to 0, VCOM = 0 to 3.6 V TA = 25°C –1 0.05 1 TA = –40°C to +85°C –12 12 ICOM(OFF) COM OFF leakage current VCC = 3.6 V VNC or VNO = 3 VCOM = 1 V, or VNC or VNO = 1 VCOM = 3 V Switch OFF, see Figure 7-2 TA = 25°C –1 0.01 1 μA TA = –40°C to +85°C –2 2 ICOM(PWROFF) VCC = 0 V VNC or VNO = 3.6 V to 0, VCOM = 0 to 3.6 or VNC or VNO = 0 to 3.6 V, VCOM = 3.6 V to TA = 25°C –1 0.02 1 TA = –40°C to +85°C –12 1 TS3A27518E SCDS260F – MARCH 2009 – REVISED DECEMBER 2021 www.ti.com

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6.5 Electrical Characteristics for 3.3-V Supply (continued) VCC = 3 V to 3.6 V, TA = –40°C to +85°C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT INO(ON), INC(ON) NC, NO ON leakage current VCC = 3.6 V VNC or VNO = 1 VCOM = open, or VNC or VNO = 3 VCOM = open Switch ON, see Figure 7-3 μATA = –40°C to +85°C –7 7 ICOM(ON) COM ON leakage current VCC = 3.6 V VNC or VNO = open, VCOM = 1 V, or VNC or VNO = open, VCOM = 3 V Switch ON, see Figure 7-3 TA = 25°C –2 0.03 2 μATA = –40°C to +85°C –7 7 DIGITAL CONTROL INPUTS (IN1, IN2, EN) (1) VIH Input logic high VCC = 3.6 V TA = –40°C to +85°C 1.2 3.6 V VIL Input logic low VCC = 3.6 V TA = –40°C to +85°C 0 0.65 V IIH, IIL Input leakage current VCC = 3.6 V VI = VCC or 0 μATA = –40°C to +85°C –2.5 2.5 DYNAMIC tON Turnon time VCC = 3.3 V VCOM = VCC, RL = 50 Ω CL = 35 pF, see Figure 7-5 TA = 25°C 18.1 59 nsVCC = 3 V to 3.6 V TA = –40°C to +85°C 60 tOFF Turnoff time VCC = 3.3 V VCOM = VCC, RL = 50 Ω CL = 35 pF, see Figure 7-5 TA = 25°C 25.4 60.6 nsVCC = 3 V to 3.6 V TA = –40°C to +85°C 61 tBBM Break-before- make time VCC = 3.3 V VNC = VNO = VCC/2, RL = 50 Ω CL = 35 pF, see Figure 7-6 TA = 25°C 4 11.1 22.7 nsVCC = 3 V to 3.6 V TA = –40°C to +85°C 28 QC Charge injection VCC = 3.3 V VGEN = 0, RGEN = 0 CL = 0.1 nF, see Figure 7-10 TA = 25°C 0.81 pC CNC(OFF), CNO(OFF) NC, NO OFF capacitance VCC = 3.3 V VNC or VNO = VCC or GND, Switch OFF See Figure 7-4 TA = 25°C 13 pF CCOM(OFF) COM OFF capacitance VCC = 3.3 V VNC or VNO = VCC or GND, Switch OFF See Figure 7-4 TA = –40°C to +85°C 8.5 pF CNC(ON), CNO(ON) NC, NO ON capacitance VCC = 3.3 V VNC or VNO = VCC or GND, Switch OFF See Figure 7-4 21.5 pF CCOM(ON) COM ON capacitance VCC = 3.3 V VCOM = VCC or GND, Switch ON See Figure 7-4 21.5 pF CI Digital input capacitance VCC = 3.3 V VI = VCC or GND See Figure 7-4 2 pF BW Bandwidth VCC = 3.3 V RL = 50 Ω, Switch ON, see Figure 7-6 240 MHz OISO OFF isolation VCC = 3.3 V RL = 50 Ω, f = 10 MHz Switch OFF, see Figure 7-8 –62 dB XTALK Crosstalk VCC = 3.3 V RL = 50 Ω, f = 10 MHz Switch ON, see Figure 7-9 –62 dB XTALK(ADJ) Crosstalk adjacent VCC = 3.3 V RL = 50 Ω, f = 10 MHz Switch ON, see Figure 7-9 –71 dB THD Total harmonic distortion VCC = 3.3 V RL = 600 Ω, CL = 50 pF f = 20 Hz to 20 kHz, see Figure 7-11 0.05% www.ti.com TS3A27518E SCDS260F – MARCH 2009 – REVISED DECEMBER 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 7 Product Folder Links: TS3A27518E

6.5 Electrical Characteristics for 3.3-V Supply (continued) VCC = 3 V to 3.6 V, TA = –40°C to +85°C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT SUPPLY ICC Positive supply current VCC = 3.6 V VI = VCC or GND Switch ON or OFF TA = 25°C 0.04 0.3 μATA = –40°C to +85°C 3 (1) All unused digital inputs of the device must be held at VCC or GND to ensure proper device operation. See the TI application report, Implications of Slow or Floating CMOS Inputs, SCBA004. 6.6 Electrical Characteristics for 2.5-V Supply VCC = 2.3 V to 2.7 V, TA = –40°C to +85°C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT ANALOG SWITCH VCOM, VNO, VNC Analog signal voltage 0 3.6 V ron ON-state resistance VCC = 2.3 V 0 ≤ (VNC or VNO) ≤ VCC, ICOM = –32 mA Switch ON, see Figure 7-1 TA = 25°C 5.5 9.6 ΩTA = –40°C to +85°C 11.5 Δron ON-state resistance match between channels VCC = 2.3 V VNC or VNO = 1.6 V, ICOM = –32 mA Switch ON, see Figure 7-1 TA = 25°C 0.3 0.8 ΩTA = –40°C to +85°C 0.9 ron(flat) ON-state resistance flatness VCC = 2.3 V 0 ≤ (VNC or VNO) ≤ VCC, ICOM = –32 mA Switch ON, see Figure 7-2 TA = 25°C 0.91 2.2 ΩTA = –40°C to +85°C 2.3 INC(OFF), INO(OFF) NC, NO OFF leakage current VCC = 2.7 V VNC or VNO = 0.5 V, VCOM = 2.3 V, or VNC or VNO = 2.3 V, VCOM = 0.5 V Switch OFF, see Figure 7-2 μA TA = –40°C to +85°C –6 6 INC(PWROFF), INO(PWROFF) VCC = 0 V VNC or VNO = 0 to 2.7 V, VCOM =2.7 V to 0, or VNC or VNO = 2.7 V to 0, VCOM = 0 to 2.7 V TA = –40°C to +85°C –10 10 ICOM(OFF) COM OFF leakage current VCC = 2.7 V VNC or VNO = 0.5 V, VCOM = 2.3 V, or VNC or VNO = 2.3 V, VCOM = 0.5 V Switch OFF, see Figure 7-2 μA TA = –40°C to +85°C –1 1 ICOM(PWROFF VCC = 0 V VNC or VNO = 2.7 V to 0, VCOM = 0 to 2.7 V, or VNC or VNO = 0 to 2.7 V, VCOM = 2.7 V to 0 TA = –40°C to +85°C –7.2 7.2 INO(ON) INC(ON) NC, NO ON leakage current VCC = 2.7 V VNC or VNO = 0.5 V or 2.3 V, VCOM = open Switch ON, see Figure 7-3 μATA = –40°C to +85°C –6 6 ICOM(ON) COM ON leakage current VCC = 2.7 V VNC or VNO = open, VCOM = 0.5 V, or VNC or VNO = open, VCOM = 2.3 V Switch ON, see Figure 7-3 TA = 25°C –2 0.02 2 μATA = –40°C to +85°C –5.7 5.7 DIGITAL CONTROL INPUTS (IN1, IN2, EN) (1) VIH Input logic high VCC = 2.7 V VI = VCC or GND TA = –40°C to +85°C 1.15 3.6 V VIL Input logic low VCC = 2.7 V 0 0.55 V IIH, IIL Input leakage current VCC = 2.7 V VI = VCC or 0 μATA = –40°C to +85°C –2.1 2.1 TS3A27518E SCDS260F – MARCH 2009 – REVISED DECEMBER 2021 www.ti.com

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6.6 Electrical Characteristics for 2.5-V Supply (continued) VCC = 2.3 V to 2.7 V, TA = –40°C to +85°C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT DYNAMIC tON Turnon time VCC = 2.5 V VCOM = VCC, RL = 50 Ω CL = 35 pF, see Figure 7-5 TA = 25°C 17.2 36.8 nsVCC = 2.3 V to 2.7 V TA = –40°C to +85°C 42.5 tOFF Turnoff time VCC = 2.5 V VCOM = VCC, RL = 50 Ω CL = 35 pF, see Figure 7-5 TA = 25°C 17.1 29.8 nsVCC = 2.3 V to 2.7 V TA = –40°C to +85°C 34.4 tBBM Break-before- make time VCC = 2.5 V VNC = VNO = VCC/2, RL = 50 Ω CL = 35 pF, see Figure 7-6 TA = 25°C 4.5 13 30 nsVCC = 2.3 V to 2.7 V TA = –40°C to +85°C 33.3 QC Charge injection VCC = 2.5 V VGEN = 0, RGEN = 0 CL = 0.1 nF, see Figure 7-10 0.47 pC CNC(OFF), CNO(OFF) NC, NO OFF capacitance VCC = 2.5 V VNC or VNO = VCC or GND, switch OFF See Figure 7-4 13.5 pF CCOM(OFF) COM OFF capacitance VCC = 2.5 V VNC or VNO = VCC or GND, switch OFF See Figure 7-4 TA = –40°C to +85°C 9 pF CNC(ON), CNO(ON) NC, NO ON capacitance VCC = 2.5 V VNC or VNO = VCC or GND, switch OFF See Figure 7-4 22 pF CCOM(ON) COM ON capacitance VCC = 2.5 V VCOM = VCC or GND, switch ON See Figure 7-4 22 pF CI Digital input capacitance VCC = 2.5 V VI = VCC or GND See Figure 7-4 2 pF BW Bandwidth VCC = 2.5 V RL = 50 Ω Switch ON, see Figure 7-6 240 MHz OISO OFF isolation VCC = 2.5 V RL = 50 Ω, f = 10 MHz Switch OFF, see Figure 7-8 –62 dB XTALK Crosstalk VCC = 2.5 V RL = 50 Ω, f = 10 MHz Switch ON, see Figure 7-9 –62 dB XTALK(ADJ) Crosstalk adjacent VCC = 2.5 V RL = 50 Ω, f = 10 MHz Switch ON, see Figure 7-9 –71 dB THD Total harmonic distortion VCC = 2.5 V RL = 600 Ω, CL = 50 pF f = 20 Hz to 20 kHz, see Figure 7-11 0.06% SUPPLY ICC Positive supply current VCC = 2.7 V VI = VCC or GND Switch ON or OFF TA = 25°C 0.01 0.1 μATA = –40°C to +85°C 2 (1) All unused digital inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, SCBA004. 6.7 Electrical Characteristics for 1.8-V Supply VCC = 1.65 V to 1.95 V, TA = –40°C to 85°C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT ANALOG SWITCH VCOM, VNO, VNC Analog signal voltage 0 3.6 V ron ON-state resistance VCC = 1.65 V 0 ≤ (VNC or VNO) ≤ VCC, ICOM = –32 mA Switch ON, see Figure 7-1 TA = 25°C 7.1 14.4 Ω TA = –40°C to +85°C 16.3 www.ti.com TS3A27518E SCDS260F – MARCH 2009 – REVISED DECEMBER 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 9 Product Folder Links: TS3A27518E

6.7 Electrical Characteristics for 1.8-V Supply (continued) VCC = 1.65 V to 1.95 V, TA = –40°C to 85°C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Δron ON-state resistance match between channels VCC = 1.65 V VNC or VNO = 1.5 V, ICOM = –32 mA Switch ON, see Figure 7-1 TA = 25°C 0.3 1 Ω TA = –40°C to +85°C 1.2 ron(flat) ON-state resistance flatness VCC = 1.65 V 0 ≤ (VNC or VNO) ≤ VCC, ICOM = –32 mA Switch ON, see Figure 7-2 TA = 25°C 2.7 5.5 Ω TA = –40°C to +85°C 7.3 INC(OFF), INO(OFF) NC, NO OFF leakage current VCC = 1.95 V VNC or VNO = 0.3 V, VCOM = 1.65 V, or VNC or VNO = 1.65 V, VCOM = 0.3 V Switch OFF, see Figure 7-2 TA = 25°C –0.25 0.03 0.25 μA TA = –40°C to +85°C –5 5 INC(PWROFF), INO(PWROFF) VCC = 0 V VNC or VNO = 1.95 V to 0, VCOM = 0 to 1.95 V, or VNC or VNO = 0 to 1.95 V, VCOM = 1.95 V to 0 μA ICOM(OFF) COM OFF leakage current VCC = 1.95 V VNC or VNO = 0.3 V, VCOM = 1.65 V, or VNC or VNO = 1.65 V, VCOM = 0.3 V Switch OFF, see Figure 7-2 μA ICOM(PWROFF) VCC = 0 V VNC or VNO = 1.95 V to 0, VCOM = 0 to 1.95 V, or VNC or VNO = 0 to 1.95 V, VCOM = 1.95 V to 0 μA TA = –40°C to +85°C –5 5 INO(ON), INC(ON) NC, NO ON leakage current VCC = 1.95 V VNC or VNO = 0.3 V, VCOM = open, or VNC or VNO = 1.65 V, VCOM = open Switch ON, see Figure 7-3 TA = 25°C –2 0.02 2 μA ICOM(ON) COM ON leakage current VCC = 1.95 V VNC or VNO = open, VCOM = 0.3 V, or VNC or VNO = open, VCOM = 1.65 V Switch ON, see Figure 7-3 TA = 25°C –2 0.02 2 μA DIGITAL CONTROL INPUTS (IN1, IN2, EN) (1) VIH Input logic high VCC = 1.95 V VI = VCC or GND TA = –40°C to +85°C 1 3.6 V VIL Input logic low VCC = 1.95 V TA = –40°C to +85°C 0 0.4 V IIH, IIL Input leakage current VCC = 1.95 V VI = VCC or 0 μA DYNAMIC tON Turnon time VCC = 1.8 V VCOM = VCC, RL = 50 Ω CL = 35 pF, see Figure 7-5 TA = 25°C 14.1 49.3 nsVCC = 1.65 V to 1.95 V TA = –40°C to +85°C 56.7 tOFF Turnoff time VCC = 1.8 V VCOM = VCC, RL = 50 Ω CL = 35 pF, see Figure 7-5 TA = 25°C 16.1 26.5 nsVCC = 1.65 V to 1.95 V TA = –40°C to +85°C 31.2 tBBM Break- before- make time VCC = 1.8 V VNC = VNO = VCC/2, RL = 50 Ω CL = 35 pF, see Figure 7-6 TA = 25°C 5.3 18.4 58 nsVCC = 1.65 V to 1.95 V TA = –40°C to +85°C 58 QC Charge injection VCC = 1.8 V VGEN = 0, RGEN = 0 CL = 1 nF, see Figure 7-10 0.21 pC TS3A27518E SCDS260F – MARCH 2009 – REVISED DECEMBER 2021 www.ti.com

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6.7 Electrical Characteristics for 1.8-V Supply (continued) VCC = 1.65 V to 1.95 V, TA = –40°C to 85°C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT CNC(OFF), CNO(OFF) NC, NO OFF capacitance VCC = 1.8 V VNC or VNO = VCC or GND, switch OFF See Figure 7-4 9 pF CNC(ON), CNO(ON) NC, NO ON capacitance VCC = 1.8 V VNC or VNO = VCC or GND, switch OFF See Figure 7-4 22 pF CCOM(ON) COM ON capacitance VCC = 1.8 V VCOM = VCC or GND, switch ON See Figure 7-4 22 pF CI Digital input capacitance VCC = 1.8 V VI = VCC or GND See Figure 7-4 2 pF BW Bandwidth VCC = 1.8 V RL = 50 Ω Switch ON, see Figure 7-6 240 MHz OISO OFF isolation VCC = 1.8 V RL = 50 Ω, f = 10 MHz Switch OFF, see Figure 7-8 –60 dB XTALK Crosstalk VCC = 1.8 V RL = 50 Ω, f = 10 MHz Switch ON, see Figure 7-9 –60 dB XTALK(ADJ) Crosstalk adjacent VCC = 1.8 V RL = 50 Ω, f = 10 MHz Switch ON, see Figure 7-9 –71 dB THD Total harmonic distortion VCC = 1.8 V RL = 600 Ω, CL = 50 pF f = 20 Hz to 20 kHz, see Figure 7-11 0.1% SUPPLY ICC Positive supply current VCC = 1.95 V VI = VCC or GND Switch ON or OFF TA = 25°C 0.01 0.1 μA TA = –40°C to +85°C 1.5 (1) All unused digital inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, SCBA004. www.ti.com TS3A27518E SCDS260F – MARCH 2009 – REVISED DECEMBER 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 11 Product Folder Links: TS3A27518E

6.8 Typical Characteristics

COM Voltage,V (V)COM ON-State Resistance, r ( )ON /c87 85ºC 25ºC –40ºC Figure 6-1. ON-State Resistance vs COM Voltage (VCC = 3 V) COM Voltage,V (V)COM ON-State Resistance, r ( )ON /c87 85ºC 25ºC -–40ºC Figure 6-2. ON-State Resistance vs COM Voltage (VCC = 2.3 V) 0.0 1.8 COM Voltage,V (V)COM ON-State Resistance, r ( )ON /c87 85ºC 25ºC -–40ºC Figure 6-3. ON-State Resistance vs COM Voltage (VCC = 1.65 V) Temperature, TA (°C) Leakage Current, I (nA)I 600 100 150 200 250 300 350 400 450 500 550 –40 25 85 COM (OFF) COM (ON) NO (OFF) NO (ON) Figure 6-4. Leakage Current vs Temperature (VCC = 3.3 V) 0.0 4.0 Supply Voltage, V+ (V) Supply Current, I (nA)+ INx = High INx = Low Figure 6-5. Supply Current vs Supply Voltage 0.0 2.0 Input V oltage, VIN (V) Output V oltage, V (V)OUT 0.0 4.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 Figure 6-6. Control Input Thresholds (IN1, TA = 25°C) TS3A27518E SCDS260F – MARCH 2009 – REVISED DECEMBER 2021 www.ti.com

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6.8 Typical Characteristics (continued)

Frequency ( z)MH Magnitude (dB) –100 –10 –80 –90 –70 –60 –50 –40 –30 –20 0.1 1 10 100 1000 NO1TOCOM1-NO2 NO1TOCOM1-NO3 NO1TOCOM1-NO4 NO1TOCOM1-NO5 NO1TOCOM1-NO6 Figure 6-7. Crosstalk Adjacent Magnitude (dB) –100 –10 –80 –90 –70 –60 –50 –40 –30 –20 1.8 V 2.5 V 3.3 V Frequency ( z)MH 0.1 1 10 100 1000 Figure 6-8. Crosstalk 0.1 1000 Frequency (Hz) Total Harmonic Distortion, THD (%) 0.05 0.11 0.06 0.07 0.08 0.09 0.10 1 10 100 1.8 V 2.5 V 3.3 V Figure 6-9. Total Harmonic Distortion vs Frequency Magnitude (dB) –100 –10 –90 –80 –70 –60 –50 –40 –30 –20 1.8 V 2.5 V 3.3 V Frequency ( z)MH 0.1 1 10 100 1000 Figure 6-10. OFF Isolation Magnitude (dB) –20 –18 –16 –14 –12 –10 1.8 V 2.5 V 3.3 V Frequency ( z)MH 0.1 1 10 100 1000 Figure 6-11. Insertion Loss Bias Voltage (V) Charge Injection, Q (pC) C www.ti.com TS3A27518E SCDS260F – MARCH 2009 – REVISED DECEMBER 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 13 Product Folder Links: TS3A27518E

Bias Voltage (V) Charge Injection, Q (pC) C –10 Figure 6-13. Charge Injection vs Bias Voltage (2.5 V) Bias Voltage (V) Charge Injection, Q (pC) C –16 –14 –12 –10 2 Figure 6-14. Charge Injection vs Bias Voltage (3.3 V) TS3A27518E SCDS260F – MARCH 2009 – REVISED DECEMBER 2021 www.ti.com

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7 Parameter Measurement Information

Table 7-1. Parameter Description

DESCRIPTION

VCOM Voltage at COM. VNC Voltage at NC. VNO Voltage at NO. ron Resistance between COM and NC or NO ports when the channel is ON. Δron Difference of ron between channels in a specific device. ron(flat) Difference between the maximum and minimum value of ron in a channel over the specified range of conditions. INC(OFF) Leakage current measured at the NC port, with the corresponding channel (NC to COM) in the OFF state. INC(ON) Leakage current measured at the NC port, with the corresponding channel (NC to COM) in the ON state and the output (COM) open. INO(OFF) Leakage current measured at the NO port, with the corresponding channel (NO to COM) in the OFF state. INO(ON) Leakage current measured at the NO port, with the corresponding channel (NO to COM) in the ON state and the output (COM) open. ICOM(OFF) Leakage current measured at the COM port, with the corresponding channel (COM to NC or NO) in the OFF state. ICOM(ON) Leakage current measured at the COM port, with the corresponding channel (COM to NC or NO) in the ON state and the output (NC or NO) open. VIH Minimum input voltage for logic high for the control input (IN, EN). VIL Maximum input voltage for logic low for the control input (IN, EN). VI Voltage at the control input (IN, EN). IIH, IIL Leakage current measured at the control input (IN, EN). tON Turnon time for the switch. This parameter is measured under the specified range of conditions and by the propagation delay between the digital control (IN) signal and analog output (NC or NO) signal when the switch is turning ON. tOFF Turnoff time for the switch. This parameter is measured under the specified range of conditions and by the propagation delay between the digital control (IN) signal and analog output (NC or NO) signal when the switch is turning OFF. QC Charge injection is a measurement of unwanted signal coupling from the control (IN) input to the analog (NC or NO) output. This is measured in coulomb (C) and measured by the total charge induced due to switching of the control input. Charge injection, QC = CL × ΔVCOM, CL is the load capacitance, and ΔVCOM is the change in analog output voltage. CNC(OFF) Capacitance at the NC port when the corresponding channel (NC to COM) is OFF. CNC(ON) Capacitance at the NC port when the corresponding channel (NC to COM) is ON. CNO(OFF) Capacitance at the NC port when the corresponding channel (NO to COM) is OFF. CNO(ON) Capacitance at the NC port when the corresponding channel (NO to COM) is ON. CCOM(OFF) Capacitance at the COM port when the corresponding channel (COM to NC) is OFF. CCOM(ON) Capacitance at the COM port when the corresponding channel (COM to NC) is ON. CI Capacitance of control input (IN, EN). OISO OFF isolation of the switch is a measurement of OFF-state switch impedance. This is measured in dB in a specific frequency, with the corresponding channel (NC to COM) in the OFF state. XTALK Crosstalk is a measurement of unwanted signal coupling from an ON channel to an OFF channel (NC1 to NO1). Adjacent crosstalk is a measure of unwanted signal coupling from an ON channel to an adjacent ON channel (NC1 to NC2). This is measured in a specific frequency and in dB. BW Bandwidth of the switch. This is the frequency in which the gain of an ON channel is –3 dB below the DC gain. THD Total harmonic distortion describes the signal distortion caused by the analog switch. This is defined as the ratio of root mean square (RMS) value of the second, third, and higher harmonic to the absolute magnitude of the fundamental harmonic. ICC Static power-supply current with the control (IN) pin at VCC or GND. www.ti.com TS3A27518E SCDS260F – MARCH 2009 – REVISED DECEMBER 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 15 Product Folder Links: TS3A27518E

Ω IN VCC Figure 7-1. ON-State Resistance (rON) IN + OFF-State Leakage Current Channel OFF VCC Figure 7-2. OFF-State Leakage Current (ICOM(OFF), INC(OFF), ICOM(PWROFF), INC(PWROFF)) ON-State Leakage Current Channel ON IN VCC Figure 7-3. ON-State Leakage Current (ICOM(ON), INC(ON)) COMCOM NO VBIAS VNO Capacitance Meter V = V or GND andBIAS CC V = V or VI IH IL Capacitance is measured at NO, COM, and IN inputs during ON and OFF conditions. VCC Figure 7-4. Capacitance (CI, CCOM(OFF), CCOM(ON), CNC(OFF), CNC(ON)) 50 Ω 50 Ω 35 pF 90% 90%Switch Output Logic Intput TEST 35 pF IN VCC VCC All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr < 5 ns, tf < 5 ns. CL includes probe and jig capacitance. Figure 7-5. Turnon (tON) and Turnoff Time (tOFF) VOH NC or NO NC or NO V or VNC NO V or V = VNC NO CC R = 50L Ω C = 35 pFL VCC VCC CL includes probe and jig capacitance. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr < 5 ns, tf < 5 ns. Figure 7-6. Break-Before-Make Time (tBBM) Network Analyzer Setup Source Power = 0 dBM (632-mV P-P at 50- load)Ω DC Bias = 350 mV Channel ON: NO to COM V = V or VI IH IL 50 Ω Ω IN VCC Figure 7-7. Bandwidth (BW) Network Analyzer Setup Source Power = 0 dBM (632-mV P-P at 50- load)Ω DC Bias = 350 mV Channel OFF: NO to COM V = V or VI IH IL 50 Ω Ω Ω IN VCC Figure 7-8. OFF Isolation (OISO) Network Analyzer Setup Source Power = 0 dBM (632-mV P-P at 50- load)Ω DC Bias = 350 mV Channel ON: NC to COM Channel OFF: NO to COM V = V or VI IH IL 50 Ω NC NO Ω Ω IN VCC Figure 7-9. Crosstalk (XTALK) x Δ Δ IN VCC VCC All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr < 5 ns, tf < 5 ns. CL includes probe and jig capacitance. Figure 7-10. Charge Injection (QC) TS3A27518E SCDS260F – MARCH 2009 – REVISED DECEMBER 2021 www.ti.com

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Channel ON: COM to NO V = V or V R = 600I IH IL L Ω V = V P-P f = 20 Hz to 20 kHz C = 50 pFSOURCE CC SOURCE L 600 Ω 600 Ω COM NO VCC IN CL includes probe and jig capacitance. Figure 7-11. Total Harmonic Distortion (THD) www.ti.com TS3A27518E SCDS260F – MARCH 2009 – REVISED DECEMBER 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 17 Product Folder Links: TS3A27518E

8 Detailed Description

8.1 Overview

The TS3A27518E is a bidirectional, 6-channel, 1:2 multiplexer-demultiplexer designed to operate from 1.65 V to 3.6 V. This device can handle both digital and analog signals, and can transmit signals up to V CC in either direction. The TS3A27518E has two control pins, each controlling three 1:2 muxes at the same time, and an enable pin that puts all outputs in high-impedance mode. The control pins are compatible with 1.8-V logic thresholds and are backward compatible with 2.5-V and 3.3-V logic thresholds.

8.2 Functional Block Diagram

Copyright © 2016, Texas Instruments Incorporated

8.3 Feature Description

The isolation in power-down mode, V CC = 0 feature places all switch paths in high-impedance state (High-Z) when the supply voltage equals 0 V.

8.4 Device Functional Modes

The TS3A27518E is a bidirectional device that has two sets of three single-pole double-throw switches. Two digital signals control the 6 channels of the switch; one digital control for each set of three single-pole, double-throw switches. Digital input pin IN1 controls switches 1, 2, and 3, while pin IN2 controls switches 4, 5, and 6. The TS3A27518 has an EN pin that when set to logic high, it places all channels into a high-impedance or HIGH-Z state. Table 8-1 lists the functions of TS3A27518E. Table 8-1. Function Table EN IN1 IN2 NC1/2/3 TO COM1/2/3, COM1/2/3 TO NC1/2/3 NC4/5/6 TO COM4/5/6, COM4/5/6 TO NC4/5/6 NO1/2/3 TO COM1/2/3, COM1/2/3 TO NO1/2/3 NO4/5/6 TO COM4/5/6, COM4/5/6 TO NO4/5/6 H X X OFF OFF OFF OFF L L L ON ON OFF OFF L H L OFF ON ON OFF L L H ON OFF OFF ON L H H OFF OFF ON ON TS3A27518E SCDS260F – MARCH 2009 – REVISED DECEMBER 2021 www.ti.com

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9 Application and Implementation

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality.

9.1 Application Information

The switches are bidirectional, so the NO, NC, and COM pins can be used as either inputs or outputs. This functionality allows port expansion to support many different types of bidirectional signal inferfaces such as SD, SDIO, GPIO, MMC, and qSPI.

9.2 Typical Application

(Bluetooth, WLAN, DTV, etc) Digital Baseband or Apps Processor COM1 COM2 COM3 COM4 COM5 COM6 IN1, IN2, EN NC1 NO1 NC2 NC3 NC4 NC5 NC6 NO2 NO3 NO4 NO5 NO6 TS3A27518 VCC VCC VCC VCC SDIO Port Copyright © 2016, Texas Instruments Incorporated Figure 9-1. SDIO Expander Application Block Diagram www.ti.com TS3A27518E SCDS260F – MARCH 2009 – REVISED DECEMBER 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 19 Product Folder Links: TS3A27518E

DEBUG, SPI, GPIO COM1RAM CPU Peripherals 0.1µF EN NO1 NO2 NO3 NO4 qSPI Device #1 SIO0 SIO1 SIO2 SIO3NO5 NO6 SLCK CS NC1 NC2 NC3 NC4 qSPI Device #2 SIO0 SIO1 SIO2 SIO3NC5 NC6 SLCK CS COM2 COM3 COM4 COM5 COM6 IN1 Figure 9-2. qSPI Expander Application Block Diagram

9.2.1 Design Requirement

Ensure that all of the signals passing through the switch are within the recommended operating ranges to ensure proper performance, see Section 6.3.

9.2.2 Detailed Design Procedure

The TS3A27518E can be properly operated without any external components. However, TI recommends connecting unused pins to the ground through a 50- Ω resistor to prevent signal reflections back into the device. TI also recommends that the digital control pins (INX) be pulled up to V CC or down to GND to avoid undesired switch positions that could result from the floating pin. Refer to the Enabling SPI-Based Flash Memory Expansion by Using Multiplexers application brief for more information on using switches and multiplexers for SPI protocol expansion. For the RTW package, connect the thermal pad to ground.

9.2.3 Application Curve

COM Voltage,V (V)COM ON-State Resistance, r ( )ON /c87 85ºC 25ºC –40ºC Figure 9-3. ON-State Resistance vs COM Voltage (VCC = 3 V) TS3A27518E SCDS260F – MARCH 2009 – REVISED DECEMBER 2021 www.ti.com

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10 Power Supply Recommendations

TI recommends proper power-supply sequencing for all CMOS devices. Do not exceed the absolute maximum ratings, because stresses beyond the listed ratings can cause permanent damage to the device. Always sequence V CC on first, followed by NO, NC, or COM. Although it is not required, power-supply bypassing improves noise margin and prevents switching noise propagation from the V CC supply to other components. A 0.1-μF capacitor is adequate for most applications, if connected from VCC to GND.

11 Layout

11.1 Layout Guidelines

To ensure reliability of the device, TI recommends following these common printed-circuit board layout guidelines:

• Bypass capacitors should be used on power supplies, and should be placed as close as possible to the VCC pin
• Short trace-lengths should be used to avoid excessive loading
• For the RTW package, connect the thermal pad to ground

11.2 Layout Example

0603 Cap

= VIA to GND Plane NO2 To System You may ground the N.C pin or not include a trace IN2 NO3COM5 NO1 COM6 IN1 NC3 NC6N.C. NC1 NC2 COM3 Vcc COM4 COM1 GND COM2 NO5 NO4 NO6 NC4 EN NC5 Figure 11-1. WQFN Layout Recommendation www.ti.com TS3A27518E SCDS260F – MARCH 2009 – REVISED DECEMBER 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 21 Product Folder Links: TS3A27518E

12 Device and Documentation Support

12.1 Documentation Support

12.1.1 Related Documentation

For related documentation, see the following:

• Texas Instruments, Enabling SPI-Based Flash Memory Expansion by Using Multiplexers application brief

12.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Subscribe to updates to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

12.3 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

12.4 Trademarks

TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners.

12.5 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

12.6 Glossary

TI Glossary This glossary lists and explains terms, acronyms, and definitions.

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. TS3A27518E SCDS260F – MARCH 2009 – REVISED DECEMBER 2021 www.ti.com

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www.ti.com 9-Nov-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) TS3A27518EPWR Active Production TSSOP (PW) | 24 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 YL518E TS3A27518EPWR.B Active Production TSSOP (PW) | 24 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 YL518E TS3A27518EPWRG4 Active Production TSSOP (PW) | 24 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 YL518E TS3A27518EPWRG4.B Active Production TSSOP (PW) | 24 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 YL518E TS3A27518ERTWR Active Production WQFN (RTW) | 24 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 85 YL518E TS3A27518ERTWR.B Active Production WQFN (RTW) | 24 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 85 YL518E TS3A27518ERTWRG4 Active Production WQFN (RTW) | 24 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 85 YL518E TS3A27518ERTWRG4.B Active Production WQFN (RTW) | 24 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 85 YL518E (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1

www.ti.com 9-Nov-2025 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF TS3A27518E :

• Automotive : TS3A27518E-Q1 NOTE: Qualified Version Definitions:
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 9-Oct-2025 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 9-Oct-2025 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TS3A27518EPWR TSSOP PW 24 2000 353.0 353.0 32.0 TS3A27518EPWRG4 TSSOP PW 24 2000 353.0 353.0 32.0 TS3A27518ERTWR WQFN RTW 24 3000 353.0 353.0 32.0 TS3A27518ERTWRG4 WQFN RTW 24 3000 353.0 353.0 32.0 Pack Materials-Page 2

www.ti.com PACKAGE OUTLINE C 22X 0.65 7.15 24X 0.30 0.19 TYP6.6 6.2

1.2 MAX

0.15 0.05 0.25 GAGE PLANE -80 B NOTE 4 4.5 4.3 A NOTE 3 7.9 7.7 0.75 0.50 (0.15) TYP TSSOP - 1.2 mm max heightPW0024A SMALL OUTLINE PACKAGE 4220208/A 02/2017

0.1 C A B

0.1 C NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO-153. SEATING PLANE A 20 DETAIL A TYPICAL SCALE 2.000

www.ti.com EXAMPLE BOARD LAYOUT

0.05 MAX

0.05 MIN

24X (1.5) 24X (0.45) 22X (0.65) (5.8) (R0.05) TYP TSSOP - 1.2 mm max heightPW0024A SMALL OUTLINE PACKAGE 4220208/A 02/2017 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 10X SYMM SYMM 12 13 15.000 METALSOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK OPENING EXPOSED METALEXPOSED METAL SOLDER MASK DETAILS NON-SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED

www.ti.com EXAMPLE STENCIL DESIGN 24X (1.5) 24X (0.45) 22X (0.65) (5.8) (R0.05) TYP TSSOP - 1.2 mm max heightPW0024A SMALL OUTLINE PACKAGE 4220208/A 02/2017 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE: 10X SYMM SYMM 12 13

www.ti.com GENERIC PACKAGE VIEW This image is a representation of the package family, actual package may vary. Refer to the product data sheet for package details. WQFN - 0.8 mm max heightRTW 24 PLASTIC QUAD FLATPACK - NO LEAD4 x 4, 0.5 mm pitch 4224801/A

4219135/B 11/2016www.ti.com WQFN - 0.8 mm max heightPLASTIC QUAD FLATPACK-NO LEADRTW0024B A 0.08C0.1CAB0.05C B SYMMSYMM

NOTES: (continued)3.For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). EXAMPLE BOARD LAYOUT 4219135/B 11/2016www.ti.com WQFN - 0.8 mm max heightRTW0024B PLASTIC QUAD FLATPACK-NO LEADSYMMSYMM LAND PATTERN EXAMPLESCALE: 20X

NOTES: (continued)4.Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternatedesign recommendations. EXAMPLE STENCIL DESIGN 4219135/B 11/2016www.ti.com WQFN - 0.8 mm max heightRTW0024B PLASTIC QUAD FLATPACK-NO LEADSYMMSYMMSOLDER PASTE EXAMPLEBASED ON 0.125 mm THICK STENCILEXPOSED PAD 25:78% PRINTED COVERAGE BY AREA UNDER PACKAGESCALE: 20X METALTYP

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