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Technical content

Features

  • Fixed output option has automatic low power PFM mode for reduced quiescent current at light loads
  • 2.25MHz +/- 10% fixed switching frequency 2.5V, and 3.3V with +/- 2% output tolerance
  • Input voltage range: 2.0V to 5.5V
  • Voltage mode PWM control with input voltage feed- forward compensation
  • Voltage supervisor for VOUT reported at the PG pin
  • Input supply under voltage lockout
  • Soft start for controlled startup with no overshoot
  • Full protection for over-current, over-temperature, and VOUT overvoltage
  • Less than 200nA in shutdown mode
  • Multiple enable pins for flexible system sequencing
  • Low external component count
  • Junction operating temperature -40°C to 125°C
  • Packaged in a 16 pin QFN (3x3)
  • Product is lead-free, Halogen Free, RoHS / WEEE compliant

Applications

  • Point of load
  • Systems with deep submicron ASICs/FPGAs
  • Set-top box
  • Communications equipment
  • Portable and handheld equipment

Description

The TS33010 is a DC/DC synchronous switching regulator with fully integrated power switches, internal compensation, and full fault protection. The switching frequency of 2.25MHz enables the use of extremely small filter components, resulting in smaller board space and reduced BOM costs. When the input current is greater than approximately 50mA, the TS33010 utilizes PWM voltage mode feedback with input voltage feed-forward to provide a wide input voltage range without the need for external compensation. When the input current is less than 50mA, the device uses a PFM mode to provide increased efficiency at light loads. The cross over between PFM and PWM modes is automatic and has hysteresis to prevent oscillation between the modes. Additionally, the nLP mode pin can be used to force the device into PWM mode to reduce the output ripple, if needed. The TS33010 integrates a wide range of protection circuitry; including input supply under-voltage lockout, output under- voltage, output over-voltage, soft start, high side FET and low side FET current limits. Typical Applications VCC VCC Fixed Output VSW 1.5μH VOUT 22μF VOUT Sense 10μF FB VCC or VOUT nLP nLP 10 kohm (optional) EN EN PG PG

June 2, 2016 2o f Pinout (Top View) Pin Description Pin # Pin Name Pin Function Description 1 VSW Switching Voltage Node Connect to 1.5 μH inductor. Short to Pins 12, 14, & 15 2 VCC Input Voltage Input voltage supply. Short to Pins 3 & 11 3 VCC Input Voltage Input voltage supply. Short to Pins 2 & 11

4 GND GND Ground for the internal circuitry of the device

5 FB Feedback Input

Feedback voltage for the regulator when used in adjustable mode. Connect to the output voltage resistor divider for adjustable mode and No Connection for fixed output modes 6 VOUT Sense Output Voltage Sense Output Voltage Sense. Requires kelvin connection to 10μF output capacitor 7 nLP nLP Input Forcing this pin high prevents the device from going into Low Power PFM mode operation 8 PG PG Output Power Good indicator Open-drain output. 9 EN Enable Input Input high voltage enables the device. Input low disables the device. 10 TEST OUT Test Mode Output Connect to GND. For internal testing use only. 11 VCC Input Voltage Input voltage supply. Short to Pins 2 & 3 12 VSW Switching Voltage Node Connect to 1.5 μH inductor. Short to Pins 1, 14, & 15 13 PGND Power GND GND supply for internal low-side FET/integrated diode. Short to Pin 16 14 VSW Switching Voltage Node Connect to 1.5 μH inductor. Short to Pins 1, 12, & 15 15 VSW Switching Voltage Node Connect to 1.5 μH inductor. Short to Pins 1, 12, & 14 16 PGND Power GND GND supply for internal low-side FET/integrated diode. Short to Pin 13

June 2, 2016 3o f Functional Block Diagram nLP PG EN VCC MONITOR CONTROL Under Voltage Protection VCC Oscillator Ramp Generator Thermal Protection Over Current Protection Vref Softstart Error Amp Comparator Gate Drive Control Gate Drive Gate Drive VSW 1.5μH VOUT 10μF Compensation Network PGND RTOP (Adjustable) GND FB (Adjustable) Vout Sense (Adjustable) RBOT (Adjustable) Figure 1: TS33010 Block Diagram for fixed and adjustable mode devices

June 2, 2016 4o f Absolute Maximum Rating Over operating free–air temperature range unless otherwise noted(1, 2) Parameter Value Unit VCC -0.3 to 6.0 V VSW -1 to 6.0 V EN, PG,FB, nLP , TEST OUT, VOUT Sense -0.3 to 6.0 V Electrostatic Discharge – Human BodyModel ±2k V Electrostatic Discharge – Charge Device Model ±500 V Lead Temperature (soldering, 10 seconds) 260 °C Notes: (1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating con- ditions” is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to network ground terminal. Thermal Characteristics Symbol Parameter Value Unit șJA Thermal Resistance Junction to Air (Note 1) 50 °C/W șJC Thermal Resistance Junction to Case (Note 1) 3.9 °C/W Note 1: Assumes QFN16 1 in2 area of 2 oz copper and 25°C ambient temperature. Recommended Operating Conditions Symbol Parameter Min Typ Max Unit VCC Input Operating Voltage 2.0 3.6 5.5 V TSTG Storage TemperatureRange -65 150 °C TJ MAX Maximum Junction Temperature 150 °C TJ Operating Junction TemperatureRange -40 125 °C LOUT Output Filter Inductor Typical Value (Note1,3) 1.5 μH COUT Output Filter Capacitor Typical Value (Note2,3) 3.3 10 13 μF COUT-ESR Output Filter Capacitor ESR 05 2 0 Pȍ CBYPAS S Input Supply Bypass Capacitor Typical Value (Note 2) 22 μF Note 1: For best performance, an inductor with a saturation current rating higher than the maximum Vout load requirement plus the inductor current ripple. See the inductor current ripple calculations in inductor calculations sections. Note 2: For best performance, a low ESR ceramic capacitor– X7R or X5R types should be used. Y5V should be avoided. Note 3: Min and max listed are to account for +/-20% variation of the typical value. Typical values of 10μF and 1.5μH are recommended.

June 2, 2016 5o f Characteristics Electrical characteristics, TJ = -40°C to 125°C, VCC = 3.6V (unless otherwise noted) Symbol Parameter Condition Min Typ Max Unit VCC Supply Voltage ICC-NORM Quiescent current Normal Mode ILOAD = 0A, EN=VCC, nLP=5V, VOUT=1.8V 7m A ICC-LPM Quiescent current Low Power PFM Mode ILOAD=0A, EN=VCC, nLP=0V, VOUT=1.8V 25 45 μA ICC-SHUTDOWN Quiescent current Shutdown Mode EN=0V 0.1 5 μA VCC Under VoltageLockout VCCUV Input Supply Under Voltage Threshold VCC Increasing 1.6 1.75 V VCCUV_HYST Input Supply Under Voltage Threshold Hysteresis 50 mV OSC FOSC Oscillator Frequency 2 2.25 2.5 MHz PG Open Drain Output TPG PG Release Timer 14 ms IOH-PG High-Level Output Leakage VPG=5V VCC=5V 0.1 μA VOL-PG Low-Level Output Voltage IPG =- 0 . 3 m A 0.1 V EN / nLP Input Voltage Thresholds VIH-EN/nLP High Level Input Voltage VCC=2V to 5V 1.5 V VIL-EN/nLP Low Level Input Voltage VCC=2V to 5V 0.4 V VHYST-EN/nLP Input Hysteresis VCC=2V to 5V 200 mV IIN-EN EN Input Leakage VEN=5V, VCC=5V 0.1 μA VEN=0V, VCC=5V 0.1 μA nLPPD nLP Pulldown Resistor Pulldown to GND 65 .ȍ Thermal Shutdown TSD Thermal Shutdown Junction Temperature Voltage 190 °C TSDHYST TSD Hysteresis 15 °C

June 2, 2016 6o f Regulator Characteristics Electrical characteristics, TJ = -40C to 125C, VCC = 3.6V (unless otherwise noted) Symbol Parameter Condition Min Typ Max Unit Switch Mode Regulator: L=1.5μHa n dC=10μF VOUT-PWM Output Voltage Tolerance in PWM Mode VOUT –2 % VOUT VOUT + 2% V RDSON High Side Switch On Resistance IVSW = -500mA (Note 1) 150 Pȍ Low Side Switch On Resistance IVSW = 500mA (Note 1) 95 Pȍ IOUT Output Current VCC • 2.5V 500 mA IOUT Output Current VCC < 2.5V 300 mA IOCDHS Over Current Detect HS 0.7 0.9 A IOCDLS Over Current Detect LS 0.7 0.9 A VOUT-LINE Output Line Regulation VCC = 2.5V to 5V, VOUT =1 . 8 V ,ILOAD =3 0 0 m A -15 (Note 2) 15 mV VOUT-LOAD Output Load Regulation ILOAD = 10mA to 300mA, VCC = 5V, VOUT =1 . 8 V 1.791 1.8 1.809 V FBTH Feedback Reference FB Switch Point (Note 3) 0.6 V FBTH-TOL Feedback Reference Tolerance -1.5 1.5 % IFB Feedback Input Current 100 nA TSS Softstart Ramp Time 1.2 ms VOUT-PG VOUT Power Good Threshold 85% VOUT VOUT-PG_HYST VOUT Power Good Hysteresis 2% VOUT VOUT-OV VOUT Over Voltage Threshold 106% VOUT VOUT-OV_HYST VOUT Over Voltage Hysteresis 2% VOUT Note 1: R Note 2: Note 3: is characterized at 500mA and tested at lower current in production. Specified Output Line Reg is relative to nominal VCC. FB is for adjustable part only.

June 2, 2016 7o f Functional Description This voltage-mode Point of Load (POL) synchronous step-down power supply product can be used in the consumer, and industrial market segments. It includes flexibility to be used for a wide range of output voltages and is optimized for high efficiency power conversion with low RDSON integrated synchronous switches. A 2.25MHz internal switching frequency facilitates low cost LC filter combinations and improved transient response. Additionally, the fixed output version, with integrated Power on Reset and Fault circuitry enables a minimal external component count to provide a complete power supply solution for a variety of applications. Detailed Pin Description Unregulated input, VCC This terminal is the unregulated input voltage source for the IC. It is recommended that a 22μF bypass capacitor be placed close as possible to the VCC pins for best performance. Since this is the main supply for the IC, good layout practices need to be followed for this connection. Feedback, FB This is the voltage feedback input terminal for the adjustable version. For the fixed mode versions, this pin should be left floating and not connected. The connection on the PCB should be kept as short as Switching output, VSW This is the switching node of the regulator. It should be connected directly to the 1.5μH inductor with a wide, short trace. It is switching between VCC and PGND at the switching frequency. Ground, GND This ground is used for the majority of the device including the analog reference, control loop, and other circuits. Power Ground,PGND This is a separate ground connection used for the low side synchronous FET to isolate switching noise from the rest of the device. Enable, EN This is an input terminal to activate the entire device. This will enable the internal reference, oscillator, etc, and allow the fault detection circuitry to work correctly. Notice that the EN needs to be low for the part to exhibit less than 200nA quiescent current. The input threshold is TTL/CMOS compatible. Power Good Output, PG This is an open drain, active high output. The switched mode output voltage is monitored and the PG line will remain possible from the feedback resistors, kept away from the VSW threshold,connections or other switching/high frequency nodes, and should not be shared with any other connection. This should minimize stray coupling, reduce noise injection, and minimize voltage shift cause by output load. To choose the resistors for the adjustable version, use the following equation: V OUT = 0.6 (1 + RTOP/RBOT) For stability, RTOP should be 270K Ohms to 330K Ohms. Output Voltage Sense, VOUT Sense This is the input terminal for the voltage output feedback and is needed for both adjustable and fixed voltage versions. This should be connected to the main output capacitor, and the same good layout practices should be followed as for the FB connection. Keep this line as short as possible, keep it away from the VSW and other switching or high frequency traces, and do not share this connection with any other connection on the PCB. low until the output voltage reaches the V OUT-UV approximately 85% of the final regulation output. Once the internal comparator detects the output voltage is above the desired threshold, an internal 14ms delay timer is activated and the PG line is de-asserted to high when this delay timer expires. In the event the output voltage decreases below V OUT- UV the PG line will be asserted low immediately and remain low until the output rises above VOUT-UV and the delay timer times out again. If EN is pulled low and the VCC input undervoltage trips, the PG pin will immediately be pulled low. nLow Power ModeOutput, nLP This is an input to force the PWM mode when light load is on the output. The PFM low power mode has higher output voltage ripple, which is some applications may be unacceptable. If low ripple is needed on the output this pin can be tied to VCC input, or switched above 1.5V during operation to force the device into normal PWM mode.

June 2, 2016 8o f Internal Protection Details Internal Current Limit Current limit is always active when the regulator is enabled. High side current limit will shorten the high side on time and tri-state the high side. Additionally, low side current limit will protect the low side FET and turn off the switch if current limit is sensed on the low side switch. Since the output is fully synchronous, the current limit is protected on the low side in both the positive and negative direction. Soft Start Soft start ensures current limit does not prevent regulator startup and minimize overshoot at startup. The typical startup time is 1.2ms. These values do not change with output voltage, current limit settings, or adjustable/fixed mode. The soft start is re-triggered with the any rising edge that enables the regulator, including the EN input pins, thermal shutdown, VCC Undervoltage, or a VCC Power cycle. Output Overvoltage If the output of the regulator exceeds 106% of the regulation voltage, the VSW outputs will tri-state to protect the device from damage. This check occurs at the start of each switching cycle. If it occurs during the middle of a cycle, the switching for that cycle will complete, and the VSW outputs will tri-state at the beginning of the next cycle. VCC Under-Voltage Lockout The device is held in the off state until VCC reaches 1.60V. There is a 50mV hysteresis on this input, which requires the input to fall below 1.55V before the device will disable.

June 2, 2016 9o f External Component Selection The internal compensation is optimized for a 10μF output capacitor and a 1.5μH inductor. To keep the output ripple low, a low ESR (less than 20mOhm) ceramic is recommended. For optimal over-current protection, the inductor should be able to handle 1A without saturation. Application Using A Multi-Layer PCB To maximize the efficiency of this package for application on a single layer or multi-layer PCB, certain guidelines must be followed when laying out this part on the PCB. The following are guidelines for mounting the exposed pad IC on a Multi-Layer PCB with ground ap l a n e . Solder Pad (Land Pattern) Package Thermal Pad Thermal Via's Package Outline Package and PCB Land Configuration For a Multi-Layer PCB JEDEC standard FR4 PCB Cross-section: (square) Package Solder Pad Component Traces

4 Plane

1.5748mm Thermal Via 1.5038 - 1.5748 mm Component Trace (2oz Cu) 1.0142 - 1.0502 mm Ground Plane (1oz Cu) Thermal Isolation Power plane only Package Solder Pad (bottom trace) 0.5246 - 0.5606 mm Power Plane (1oz Cu) 0.0 - 0.071 mm Board Base &B o t t o mP a d Multi-Layer Board (Cross-sectional View) In a multi-layer board application, the thermal vias are the primary method of heat transfer from the package thermal pad to the internal ground plane. The efficiency of this method depends on several factors, including die area, number of thermal vias, thickness of copper, etc.

June 2, 2016 10 of Mold compound Die Epoxy Die attach Exposed pad Solder 5% - 10% Cu coverage Single Layer, 2oz Cu Ground Layer, 1oz Cu Signal Layer, 1oz Cu Bottom Layer, 2oz Cu Thermal Vias with Cu plating 90% Cu coverage 20% Cu coverage Note: NOT to Scale The above drawing is a representation of how the heat can be conducted away from the die using an exposed pad package. Each application will have different requirements and limitations and therefore the user should use sufficient copper to dissipate the power in the system. The output current rating for the linear regulators may have to be de-rated for ambient temperatures above 85°C. The de-rate value will depend on calculated worst case power dissipation and the thermal management implementation in the application. Application Using A Single Layer PCB Use as much Copper Area as possible for heat spread Package Thermal Pad Package Outline Layout recommendations for a Single Layer PCB: utilize as much Copper Area for Power Management. In a single layer board application the thermal pad is attached to a heat spreader (copper areas) by using low thermal impedance attachment method (solder paste or thermal conductive epoxy). In both of the methods mentioned above it is advisable to use as much copper traces as possible to dissipate the heat. IMPORTANT: If the attachment method is NOT implemented correctly, the functionality of the product is not guaranteed. Power dissipation capability will be adversely affected if the device is incorrectly mounted onto the circuit board.

June 2, 2016 11 of Package Mechanical Drawings (all dimensions in mm) Units MILLIMETERS Dimension Limits MIN NOM MAX Number of Pins N 16 Pitch e 0.50 BSC Overall Height A 0.80 0.90 1.00 Standoff A1 0.00 0.02 0.05 Contact Thickness A3 0.20 REF Overall Length D 3.00 BSC Exposed Pad Width E2 1.55 1.70 1.80 Overall Width E 3.00 BSC Exposed Pad Length D2 1.55 1.70 1.80 ContactWidth b 0.20 0.25 0.30 Contact Length L 0.20 0.30 0.40 Contact-to-Exposed Pad K 0.20 --

June 2, 2016 12 of PCB Board Land Pattern DIMENSIONS IN MILLIMETERS Units MILLIMETERS Dimension Limits MIN NOM MAX Contact Pitch E 0.50 BSC Optional Center Pad Width W2 -- 1.70 Optional Center Pad Length T2 -- 1.70 Contact Pad Spacing C1 - 3.00 - Contact Pad Spacing C2 - 3.00 - Contact Pad Width (X8) X1 -- 0.35 Contact Pad Length (X8) Y1 -- 0.65 Distance Between Pads G 0.15 -- Notes: Dimensions and tolerances per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact values shown without tolerances. REF: Reference Dimension, usually without tolerance, for information only.

June 2, 2016 13 of Product Ordering Information Part Number Description TS33010-M008QFNR 2.25MHz Sync Buck, 500mA -0 . 8 V TS33010-M009QFNR 2.25MHz Sync Buck, 500mA -0 . 9 V TS33010-M012QFNR 2.25MHz Sync Buck, 500mA -1 . 2 V TS33010-M015QFNR 2.25MHz Sync Buck, 500mA -1 . 5 V TS33010-M018QFNR 2.25MHz Sync Buck, 500mA -1 . 8 V TS33010-M025QFNR 2.25MHz Sync Buck, 500mA -2 . 5 V TS33010-M033QFNR 2.25MHz Sync Buck, 500mA -3 . 3 V TS33010-M000QFNR 2.25MHz Sync Buck, 500mA -A D J

June 2, 2016 14 of IMPORTANT NOTICE Information relating to this product and the application or design described herein is believed to be reliable, however such information is provided as a guide only and Semtech assumes no liability for any errors in this document, or for the application or design described herein. Semtech reserves the right to make changes to the product or this document at any time without notice. Buyers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. Semtech warrants performance of its productsto the specifications applicable at the time of sale, and all sales are made in accordance with Semtech’s standard terms and conditionsof sale. SEMTECH PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS, OR IN NUCLEAR APPLICATIONS IN WHICH THE FAILURE COULD BE REASONABLY EXPECTED TO RESULT IN PERSONAL INJURY, LOSS OF LIFE OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. INCLUSION OF SEMTECH PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE UNDERTAKEN SOLELY AT THE CUSTOMER’S OWN RISK. Should a customer purchase or use Semtech productsfor any such unauthorized application, the customer shall indemnify and hold Semtech and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs damages and attorney fees which couldarise. The Semtech name and logo are registered trademarks of the Semtech Corporation. Triune Systems, L.L.C. is now a wholly-owned subsidiary of Semtech and trade names mentioned may be marks and names of Semtech or their respective companies. Semtech reserves the right to make changes to, or discontinue any products described in this document without further notice. Semtech makes no warranty, representation or guarantee, express or implied, regardingthe suitability of its products for any particular purpose. All rightsreserved. © Semtech2015 Contact Information Semtech Corporation

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