TS33000 SEMTECH | Alldatasheet

Document overview

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Technical content

Features

  • Fixed Output option has automatic low power PFM mode for reduced quiescent current at light loads
  • 2.25MHz +/- 10% fixed switching frequency
  • 2.5V, and 3.3V with +/- 2% output tolerance
  • Input voltage range: 2.0V to 5.5V
  • Voltage mode PWM control with input voltage feed-
  • forward compensation
  • Voltage supervisor for VOUT reported at the PG pin
  • Input supply under voltage lockout
  • Soft start for controlled startup with no overshoot
  • Full protection for over-current, over-temperature,
  • and VOUT overvoltage
  • Less than 100nA in shutdown mode
  • Multiple enable pins for flexible system sequencing
  • Low external component count
  • Junction operating temperature -40C to 125C
  • Packaged in a 16 pin QFN (3x3)

Applications

  • Point of load
  • Systems with deep submicron ASICs/FPGAs
  • Set-top box
  • Communications equipment
  • Portable and handheld equipment

Description

The TS33000 is a DC/DC synchronous switching regulator with fully integrated power switches, internal compensation, and full fault protection. The switching frequency of 2.25MHz enables the use of extremely small filter components, resulting in smaller board space and reduced BOM costs. When the input current is greater than approximately 50mA, the TS33000 utilizes PWM voltage mode feedback with input voltage feed-forward to provide a wide input voltage range without the need for external compensation. For the Fixed Output option, when the input current is less than 50mA, the device uses a PFM mode to provide increased efficiency at light loads. The cross over between PFM mode and PWM is automatic and has hysteresis to prevent oscillation between the modes. Additionally, the nLP mode pin can be used to force the device into PWM mode to reduce the output ripple, if needed (Fixed Output only). The TS33000 integrates a wide range of protection circuitry; including input supply under-voltage lockout, output under- voltage, output over-voltage, soft start, high side FET and low side FET current limits, and thermal shutdown. Typical Applications TS33000 VOUT 4.7uF 1.5uH Fixed Output EN PGND VSWVCC FB GND VOUT Sense 2x4.7uF VCC EN PG PG 10 kohm (optional) VCC or VOUT nLPnLP

Final Datasheet Rev 1.9 May 1, 2015 www.semtech.com 2 of 17 Semtech Pinout Pin Description Pin # Pin Name Pin Function Description 1 VSW Switching Voltage Node Connect to 1.5uH inductor. Short to Pins 12, 14, & 15 2 VCC Input Voltage Input voltage supply. Short to Pins 3 & 11 3 VCC Input Voltage Input voltage supply. Short to Pins 2 & 11

4 GND GND Ground for the internal circuitry of the device

5 FB Feedback Input

Feedback voltage for the regulator when used in adjustable mode. Connect to the output voltage resistor divider for adjustable mode and No Connection for fixed output modes 6 VOUT Sense Output Voltage Sense Output Voltage Sense. Requires kelvin connection to 4.7uF output capacitor 7 nLP nLP Input Forcing this pin high prevents the device from going into Low Power PFM mode operation 8 PG PG Output Power Good indicator Open-drain output. 9 EN Enable Input Input high voltage enables the device. Input low disables the device. 10 TEST OUT Test Mode Output Connect to GND. For internal testing use only. 11 VCC Input Voltage Input voltage supply. Short to Pins 2 & 3 12 VSW Switching Voltage Node Connect to 1.5uH inductor. Short to Pins 1, 14, & 15 13 PGND Power GND GND supply for internal low-side FET/integrated diode. Short to Pin 16 14 VSW Switching Voltage Node Connect to 1.5uH inductor. Short to Pins 1, 12, & 15 15 VSW Switching Voltage Node Connect to 1.5uH inductor. Short to Pins 1, 12, & 14 16 PGND Power GND GND supply for internal low-side FET/integrated diode. Short to Pin 13 TS33000 VCC VCC GND VSW VCC TEST OUT EN VSW VSW VSW PGND PGND nLP VOUT Sense FB PG

Final Datasheet Rev 1.9 May 1, 2015 www.semtech.com 3 of 17 Semtech Functional Block Diagram Figure 1: TS33000 Block Diagram for fixed and adjustable mode devices Over Current Protection Gate Drive Gate Drive Gate Drive Control Vout Sense Vref Softstart Oscillator Ramp Generator Comparator Error Amp GND Under Voltage Protection MONITOR CONTROL Thermal Protection VCC VSW EN PGND nLP 4.7uF 1.5uH RTOP (Adjustable) Compensation Network PG VCC FB (Adjustable) VOUT RBOT (Adjustable) (Adjustable)

Final Datasheet Rev 1.9 May 1, 2015 www.semtech.com 4 of 17 Semtech Absolute Maximum Ratings Over operating free–air temperature range unless otherwise noted(1, 2) Parameter Value Unit VCC -0.3 to 6.0 V VSW -1 to 6.0 V EN, PG,FB, nLP , TEST OUT, VOUT Sense -0.3 to 6 V Electrostatic Discharge – Human Body Model ±2k V Electrostatic Discharge – Charge Device Model ±500 V Lead Temperature (soldering, 10 seconds) 260 °C Notes: (1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating con- ditions” is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to network ground terminal. Thermal Characteristics Symbol Parameter Value Unit θJA Thermal Resistance Junction to Air (Note 1) 50 °C/W Note 1: Assumes QFN16 1 in2 area of 2 oz copper and 25°C ambient temperature. Recommended Operating Conditions Symbol Parameter Min Typ Max Unit VCC Input Operating Voltage 2.0 3.3 5.5 V TSTG Storage Temperature Range -65 150 °C TJ MAX Maximum Junction Temperature 150 °C TJ Operating Junction Temperature Range -40 125 °C LOUT Output Filter Inductor Typical Value (Note 1,3) 1.2 1.5 1.8 uH COUT Output Filter Capacitor Typical Value (Note 2,3) 3.76 4.7 5.64 uF COUT-ESR Output Filter Capacitor ESR 0 5 20 mΩ CBYPASS Input Supply Bypass Capacitor Typical Value (Note 2) 2x4.7 uF Note 1: For best performance, an inductor with a saturation current rating higher than the maximum VOUT load requirement plus the inductor current ripple. See the inductor current ripple calculations in inductor calculations sections. Note 2: For best performance, a low ESR ceramic capacitor should be used – X7R or X5R types should be used. Y5V should be avoided. Note 3: Min and max listed are to account for +/-20% variation of the typical value. Typical values of 4.7uF and 1.5uH are recommended.

Final Datasheet Rev 1.9 May 1, 2015 www.semtech.com 5 of 17 Semtech Characteristics Electrical characteristics, TJ = -40C to 125C, VCC = 12V (unless otherwise noted) Symbol Parameter Condition Min Typ Max Unit VCC Supply Voltage VCC Input Supply Voltage 2.0 5.5 V ICC-NORM Quiescent current Normal Mode VCC = 3.3V, ILOAD = 0A, VEN=3.3V, nLP=3.3V 12 mA ICC-LPM Quiescent current Low Power PFM Mode VCC = 3.3V, ILOAD = 0A, VEN=3.3V, nLP=0V 45 mA ICC-SHUTDOWN Quiescent current Shutdown Mod VCC = 3.3V, EN=0V 0.1 uA VCC Under Voltage Lockout VCC-UV Input Supply Under Voltage Threshold VCC Increasing 1.9 2.0 V VCC-UV_HYST Input Supply Under Voltage Threshold Hysteresis 100 mV OSC fOSC Oscillator Frequency 2.0 2.25 2.5 MHz PG Open Drain Output tPG PG Release Timer 10 ms IOH-PG High-Level Output Leakage VPG=5V VCC=5V 0.1 uA VOL-PG Low-Level Output Voltage IPG = -0.3mA 0.01 V EN/nLP Input Voltage Thresholds VIH-EN/nLP High Level Input Voltage VCC=2V to 5V 1.0 V VIL-EN/nLP Low Level Input Voltage VCC=2V to 5V 0.4 V VHYST-EN/nLP Input Hysteresis VCC=2V to 5V 100 mV IIN-EN EN Input Leakage VEN=5V VCC=5V 0.1 uA VEN=0V VCC=5V 0.1 uA nLPPD nLP Pulldown Resistor Pulldown to GND 100 KΩ Thermal Shutdown TSD Thermal Shutdown Junction Temperature 150 170 190 C TSDHYST TSD Hysteresis 10 C

Final Datasheet Rev 1.9 May 1, 2015 www.semtech.com 6 of 17 Semtech Regulator Characteristics Electrical characteristics, TJ = -40C to 125C, VCC = 12V (unless otherwise noted) Symbol Parameter Condition Min Typ Max Unit Switch Mode Regulator: L=1.5uH and C=4.7uF VOUT-PWM Output Voltage Tolerance in Mode VOUT – VOUT VOUT + 2% V RDSON High Side Switch On Resistance IVSW = -300mA 110 mΩ Low Side Switch On Resistance IVSW = 300mA 75 mΩ IOUT Output Current 600 mA IOCDHS Over Current Detect HS 900 mA IOCDLS Over Current Detect LS 900 mA VOUT-LINE Output Line Regulation VCC = 2.5V to 5V, VOUT = 1.8V, ILOAD = 300mA -10 10 mV VOUT-LOAD Output Load Regulation ILOAD = 10mA to 300mA, VCC = 5V, VOUT = 1.8V VOUT - 0.5% VOUT VOUT + 0.5% V FBTH Feedback Reference FB Switch Point 0.6 V FBTH-TOL Feedback Reference Tolerance -1.5 1.5 % IFB Feedback Input Current 100nA nA tSS Softstart Ramp Time 500 us VOUT-PG VOUT Power Good Threshold 85% VOUT VOUT-PG_HYST VOUT Power Good Hysteresis 2% VOUT VOUT-OV VOUT Over Voltage Threshold 106% VOUT VOUT-OV_HYST VOUT Over Voltage Hysteresis 2% VOUT

Final Datasheet Rev 1.9 May 1, 2015 www.semtech.com 7 of 17 Semtech Functional Description This voltage-mode Point of Load (POL) synchronous step- down power supply product can be used in the consumer, industrial, and automotive market segments. It includes flexibility to be used for a wide range of output voltages and is optimized for high efficiency power conversion with low RDSON integrated synchronous switches. A 2.25MHz internal switching frequency facilitates low cost LC filter combinations and improved transient response. Additionally, the fixed output version, with integrated Power on Reset and Fault circuitry enables a minimal external component count to provide a complete power supply solution for a variety of applications. Detailed Pin Description Unregulated input, VCC This terminal is the unregulated input voltage source for the IC. It is recommended that 2 4.7uF bypass capacitors be placed close as possible to the VCC pins for best performance. Since this is the main supply for the IC, good layout practices need to be followed for this connection. Feedback, FB This is the voltage feedback input terminal for the adjustable version. For the fixed mode versions, this pin should be left floating and not connected. The connection on the PCB should be kept as short as possible from the feedback resistors, kept away from the VSW connections or other switching/high frequency nodes, and should not be shared with any other connection. This should minimize stray coupling, reduce noise injection, and minimize voltage shift cause by output load. To choose the resistors for the adjustable version, use the following equation: V OUT = 0.6 (1 + RTOP/RBOT) For stability, RTOP should be 270K Ohms to 330K Ohms. Output Voltage Sense, VOUT Sense This is the input terminal for the voltage output feedback and is needed for both adjustable and fixed voltage versions. This should be connected to the main output capacitor, and the same good layout practices should be followed as for the FB connection. Keep this line as short as possible, keep it away from the VSW and other switching or high frequency traces, and do not share this connection with any other connection on the PCB. Switching output, VSW This is the switching node of the regulator. It should be connected directly to the 1.5uH inductor with a wide, short trace. It is switching between VCC and PGND at the switching frequency. Ground, GND This ground is used for the majority of the device including the analog reference, control loop, and other circuits. Power Ground, PGND This is a separate ground connection used for the low side synchronous FET to isolate switching noise from the rest of the device. Enable, EN This is an input terminal to activate the entire device. This will enable the internal reference, oscillator, TSD, etc, and allow the fault detection circuitry to work correctly. Notice that the EN needs to low for the part to exhibit 100nA quiescent current. Power Good Output, PG This is an open drain, active high output. The switched mode output voltage is monitored and the PG line will remain low until the output voltage reaches the V OUT-UV threshold, approximately 85% of the final regulation output. Once the internal comparator detects the output voltage is above the desired threshold, an internal 10mSec delay timer is activated and the PG line is de-asserted to high when this delay timer expires. In the event the output voltage decreases below V OUT- UV, the PG line will be asserted low immediately and remain low until the output rises above VOUT-UV and the delay timer times out again. If EN is pulled low, the VCC input undervoltage trips, or Thermal Shutdown is reached, the PG pin will immediately be pulled low. nLow Power Mode Output, nLP This is an input to force the PWM mode when light load is on the output. The PFM low power mode has higher output voltage ripple, which is some applications may be unacceptable. If low ripple is needed on the output this pin can be tied to VCC input, or switched above 1.0V during operation to force the device into normal PWM mode.

Final Datasheet Rev 1.9 May 1, 2015 www.semtech.com 8 of 17 Semtech Internal Protection Details Internal Current Limit Current limit is always active when the regulator is enabled. High side current limit will shorten the high side on time and tri-state the high side. Additionally, low side current limit will protect the low side FET and turn off the switch if current limit is sensed on the low side switch. Since the output is fully synchronous, the current limit is protected on the low side in both the positive and negative direction. Soft Start Soft start ensures current limit does not prevent regulator startup and minimize overshoot at startup. The typical startup time is 925us. These values do not change with output voltage, current limit settings, or adjustable/fixed mode. The soft start is re-triggered with the any rising edge that enables the regulator, including the EN input pins, thermal shutdown, VCC Undervoltage, or a VCC Power cycle. Thermal Shutdown If the temperature of the die exceeds 170C, the VSW outputs will tri-state to protect the device from damage. The PG and all other protection circuitry will stay active to inform the system of the failure mode. Once the device cools to 160C, the device will attempt to start up again, following the normal soft start sequence with 10ms delay on PG. If the device reaches 170C, the shutdown/restart sequence will repeat. Output Overvoltage If the output of the regulator exceeds 106% of the regulation voltage, the VSW outputs will tri-state to protect the device from damage. This check occurs at the start of each switching cycle. If it occurs during the middle of a cycle, the switching for that cycle will complete, and the VSW outputs will tri-state at the beginning of the next cycle. VCC Under-Voltage Lockout The device is held in the off state until VCC reaches 1.9V. There is a 100mV hysteresis on this input, which requires the input to fall below 1.8V before the device will disable.

Final Datasheet Rev 1.9 May 1, 2015 www.semtech.com 9 of 17 Semtech Specifications subject to change WWW.TRIUNESYSTEMS.COM Copyright © 2012, Triune Systems, LLC TS33000 Version 1. 9 PERFORMANCE RESULTS 2V/div 2V/div 100mV/div 200mA/div 50mV/div 200mA/div Enable VOUT 100mV/div 200mV/div Typical Performance Characteristics TJ = -40C to 125C, VCC = 12V (unless otherwise noted) Fig.1 Startup Response Fig.3 10mA to 300mA Load Step (VCC=4V, VOUT=0.8V) Fig.2 10mA to 300mA Load Step (VCC=4V, VOUT=3.3V) Fig.4 Line Transient Response (VCC=4V, VOUT=0.8V)

Final Datasheet Rev 1.9 May 1, 2015 www.semtech.com 10 of 17 Semtech Specifications subject to change WWW.TRIUNESYSTEMS.COM Copyright © 2012, Triune Systems, LLC TS33000 Version 1. 9 3.23 3.24 3.25 3.26 3.27 3.28 3.29 3.3 0 100 200 300 400 500 600 VOUT(V) IOUT(mA) VCC=5.5VVCC=4V -­‐0.0005 0.0005 0.001 0.0015 0.002 0.0025 0.003 0.0035 0.004 0.0045 4 4.5 5 5.5 Delta (V) Input Voltage (V) VOUT=3.3V VOUT=1.8V VOUT=0.8V 30% 40% 50% 60% 70% 80% 90% 100% 0 100 200 300 400 500 600 Efficiency IOUT (mA) VCC=5.5VVCC=4V VCC=2V 10% 20% 30% 40% 50% 60% 70% 80% 90% 0 100 200 300 400 500 600 Efficiency IOUT(mA) VCC=2V VCC=4V VCC=5.5V 30% 40% 50% 60% 70% 80% 90% 100% 0 100 200 300 400 500 600 Efficiency IOUT(mA) VCC=2V VCC=5.5VVCC=4V Typical Performance Characteristics TJ = -40C to 125C, VCC = 12V (unless otherwise noted) Fig.5 Load Regulation Fig.7 Efficiency vs. Output Current (VOUT=1.8V) Fig.9 Efficiency vs. Output Current (VOUT=0.8V) Fig.6 Line Regulation (IOUT=300mA) Fig.8 Efficiency vs. Output Current (VOUT=3.3V) Fig.10 Efficiency vs. Input Voltage (VOUT=3.3V)

Final Datasheet Rev 1.9 May 1, 2015 www.semtech.com 11 of 17 Semtech Specifications subject to change WWW.TRIUNESYSTEMS.COM Copyright © 2012, Triune Systems, LLC TS33000 Version 1. 9 0.05 0.1 0.15 0.2 0.25 2 2.5 3 3.5 4 4.5 5 5.5 Standby Current (μA) Input Voltage (V) 0.1 0.2 0.3 0.4 0.5 0.6 -­‐50 -­‐25 0 25 50 75 100 125 Standby Current (uA) Temperature(oC) 3.265 3.27 3.275 3.28 3.285 3.29 3.295 3.3 3.305 3.31 3.315 3.32 -­‐50 -­‐25 0 25 50 75 100 125 Vout (V) Temperature (oC) IOUT=10mA IOUT=300mA 0.03 0.035 0.04 0.045 0.05 0.055 0.06 -­‐50 -­‐25 0 25 50 75 100 125 Quesient Current(mA) Temperature (oC) 598 598.5 599 599.5 600 600.5 601 601.5 -­‐50 -­‐25 0 25 50 75 100 125 Oscillator Frequency Temperature (oC) 1.95 2.05 2.1 2.15 2.2 2.25 2.3 2.35 -­‐50 -­‐25 0 25 50 75 100 125 Input Current No SW (mA) Temperature (oC) Typical Performance Characteristics TJ = -40C to 125C, VCC = 12V (unless otherwise noted) Fig.11 Standby Current vs. Input Voltage Fig.13 Output Voltage vs. Temperature Fig.15 Oscillator Frequency vs. Temperature Fig.12 Standby Current vs. Temperature Fig.14 Quiescent Current vs. Temperature Fig.16 Input Current vs. Temperature (No load, No switching) Specifications subject to change WWW.TRIUNESYSTEMS.COM Copyright © 2012, Triune Systems, LLC TS33000 Version 1. 9 0.05 0.1 0.15 0.2 0.25 2 2.5 3 3.5 4 4.5 5 5.5 Standby Current (μA) Input Voltage (V) 0.1 0.2 0.3 0.4 0.5 0.6 -­‐50 -­‐25 0 25 50 75 100 125 Standby Current (uA) Temperature(oC) 3.265 3.27 3.275 3.28 3.285 3.29 3.295 3.3 3.305 3.31 3.315 3.32 -­‐50 -­‐25 0 25 50 75 100 125 Vout (V) Temperature (oC) IOUT=10mA IOUT=300mA 0.03 0.035 0.04 0.045 0.05 0.055 0.06 -­‐50 -­‐25 0 25 50 75 100 125 Quesient Current(mA) Temperature (oC) 598 598.5 599 599.5 600 600.5 601 601.5 -­‐50 -­‐25 0 25 50 75 100 125 Oscillator Frequency Temperature (oC) 1.95 2.05 2.1 2.15 2.2 2.25 2.3 2.35 -­‐50 -­‐25 0 25 50 75 100 125 Input Current No SW (mA) Temperature (oC) Specifications subject to change WWW.TRIUNESYSTEMS.COM Copyright © 2012, Triune Systems, LLC TS33000 Version 1. 9 0.05 0.1 0.15 0.2 0.25 2 2.5 3 3.5 4 4.5 5 5.5 Standby Current (μA) Input Voltage (V) 0.1 0.2 0.3 0.4 0.5 0.6 -­‐50 -­‐25 0 25 50 75 100 125 Standby Current (uA) Temperature(oC) 3.265 3.27 3.275 3.28 3.285 3.29 3.295 3.3 3.305 3.31 3.315 3.32 -­‐50 -­‐25 0 25 50 75 100 125 Vout (V) Temperature (oC) IOUT=10mA IOUT=300mA 0.03 0.035 0.04 0.045 0.05 0.055 0.06 -­‐50 -­‐25 0 25 50 75 100 125 Quesient Current(mA) Temperature (oC) 598 598.5 599 599.5 600 600.5 601 601.5 -­‐50 -­‐25 0 25 50 75 100 125 Oscillator Frequency Temperature (oC) 1.95 2.05 2.1 2.15 2.2 2.25 2.3 2.35 -­‐50 -­‐25 0 25 50 75 100 125 Input Current No SW (mA) Temperature (oC) Specifications subject to change WWW.TRIUNESYSTEMS.COM Copyright © 2012, Triune Systems, LLC TS33000 Version 1. 9 0.05 0.1 0.15 0.2 0.25 2 2.5 3 3.5 4 4.5 5 5.5 Standby Current (μA) Input Voltage (V) 0.1 0.2 0.3 0.4 0.5 0.6 -­‐50 -­‐25 0 25 50 75 100 125 Standby Current (uA) Temperature(oC) 3.265 3.27 3.275 3.28 3.285 3.29 3.295 3.3 3.305 3.31 3.315 3.32 -­‐50 -­‐25 0 25 50 75 100 125 Vout (V) Temperature (oC) IOUT=10mA IOUT=300mA 0.03 0.035 0.04 0.045 0.05 0.055 0.06 -­‐50 -­‐25 0 25 50 75 100 125 Quesient Current(mA) Temperature (oC) 598 598.5 599 599.5 600 600.5 601 601.5 -­‐50 -­‐25 0 25 50 75 100 125 Oscillator Frequency Temperature (oC) 1.95 2.05 2.1 2.15 2.2 2.25 2.3 2.35 -­‐50 -­‐25 0 25 50 75 100 125 Input Current No SW (mA) Temperature (oC) Specifications subject to change WWW.TRIUNESYSTEMS.COM Copyright © 2012, Triune Systems, LLC TS33000 Version 1. 9 0.05 0.1 0.15 0.2 0.25 2 2.5 3 3.5 4 4.5 5 5.5 Standby Current (μA) Input Voltage (V) 0.1 0.2 0.3 0.4 0.5 0.6 -­‐50 -­‐25 0 25 50 75 100 125 Standby Current (uA) Temperature(oC) 3.265 3.27 3.275 3.28 3.285 3.29 3.295 3.3 3.305 3.31 3.315 3.32 -­‐50 -­‐25 0 25 50 75 100 125 Vout (V) Temperature (oC) IOUT=10mA IOUT=300mA 0.03 0.035 0.04 0.045 0.05 0.055 0.06 -­‐50 -­‐25 0 25 50 75 100 125 Quesient Current(mA) Temperature (oC) 598 598.5 599 599.5 600 600.5 601 601.5 -­‐50 -­‐25 0 25 50 75 100 125 Oscillator Frequency Temperature (oC) 1.95 2.05 2.1 2.15 2.2 2.25 2.3 2.35 -­‐50 -­‐25 0 25 50 75 100 125 Input Current No SW (mA) Temperature (oC) Specifications subject to change WWW.TRIUNESYSTEMS.COM Copyright © 2012, Triune Systems, LLC TS33000 Version 1. 9 0.05 0.1 0.15 0.2 0.25 2 2.5 3 3.5 4 4.5 5 5.5 Standby Current (μA) Input Voltage (V) 0.1 0.2 0.3 0.4 0.5 0.6 -­‐50 -­‐25 0 25 50 75 100 125 Standby Current (uA) Temperature(oC) 3.265 3.27 3.275 3.28 3.285 3.29 3.295 3.3 3.305 3.31 3.315 3.32 -­‐50 -­‐25 0 25 50 75 100 125 Vout (V) Temperature (oC) IOUT=10mA IOUT=300mA 0.03 0.035 0.04 0.045 0.05 0.055 0.06 -­‐50 -­‐25 0 25 50 75 100 125 Quesient Current(mA) Temperature (oC) 598 598.5 599 599.5 600 600.5 601 601.5 -­‐50 -­‐25 0 25 50 75 100 125 Oscillator Frequency Temperature (oC) 1.95 2.05 2.1 2.15 2.2 2.25 2.3 2.35 -­‐50 -­‐25 0 25 50 75 100 125 Input Current No SW (mA) Temperature (oC) Input Voltage (V) Temperature (°C) Temperature (°C) Temperature (°C) Temperature (°C) Temperature (°C)

Final Datasheet Rev 1.9 May 1, 2015 www.semtech.com 12 of 17 Semtech External Component Selection The internal compensation is optimized for a 4.7uF output capacitor and a 1.5uH inductor. To keep the output ripple low, a low ESR (less than 20mOhm) ceramic is recommended. For optimal over-current protection, inductor should be able to handle the 400mA without saturation. Functional Description (continued)Application Using A Multi-Layer PCB To maximize the efficiency of this package for application on a single layer or multi-layer PCB, certain guidelines must be followed when laying out this part on the PCB. The following are guidelines for mounting the exposed pad IC on a Multi-Layer PCB with ground a plane. Package Thermal Pad Solder Pad (Land Pattern) Thermal Via's Package Outline Package and PCB Land Configuration For a Multi-Layer PCB JEDEC standard FR4 PCB Cross-section: (square) Package Solder Pad Package Solder Pad (bottom trace) Thermal Via Component Traces Thermal Isolation Power plane only 1.5748mm 0.0 - 0.071 mm Board Base & Bottom Pad 0.5246 - 0.5606 mm Power Plane (1oz Cu) 1.0142 - 1.0502 mm Ground Plane (1oz Cu) 1.5038 - 1.5748 mm Component Trace (2oz Cu) 2 Plane

4 Plane

Multi-Layer Board (Cross-sectional View) In a multi-layer board application, the thermal vias are the primary method of heat transfer from the package thermal pad to the internal ground plane. The efficiency of this method depends on several factors, including die area, number of thermal vias, thickness of copper, etc.

Final Datasheet Rev 1.9 May 1, 2015 www.semtech.com 13 of 17 Semtech The above drawing is a representation of how the heat can be conducted away from the die using an exposed pad package. Each application will have different requirements and limitations and therefore the user should use sufficient copper to dissipate the power in the system. The output current rating for the linear regulators may have to be de-rated for ambient temperatures above 85C. The de-rate value will depend on calculated worst case power dissipation and the thermal management implementation in the application. Application Using A Single Layer PCB Use as much Copper Area as possible for heat spread Package Thermal Pad Package Outline Layout recommendations for a Single Layer PCB: utilize as much Copper Area for Power Management. In a single layer board application the thermal pad is attached to a heat spreader (copper areas) by using low thermal impedance attachment method (solder paste or thermal conductive epoxy). In both of the methods mentioned above it is advisable to use as much copper traces as possible to dissipate the heat. IMPORTANT: If the attachment method is NOT implemented correctly, the functionality of the product is not guaranteed. Power dissipation capability will be adversely affected if the device is incorrectly mounted onto the circuit board. Mold compound Die Epoxy Die attach Exposed pad Solder Thermal Vias with Cu plating Single Layer, 2oz Cu Ground Layer, 1oz Cu Signal Layer, 1oz Cu Bottom Layer, 2oz Cu 20% Cu coverage 90% Cu coverage 5% - 10% Cu coverage Note: NOT to Scale

Final Datasheet Rev 1.9 May 1, 2015 www.semtech.com 14 of 17 Semtech Units MILLIMETERS Dimension Limits MIN NOM MAX Number of Pins N 16 Pitch e 0.50 BSC Overall Height A 0.80 0.90 1.00 Standoff A1 0.00 0.02 0.05 Contact Thickness A3 0.20 REF Overall Length D 3.00 BSC Exposed Pad Width E2 1.55 1.70 1.80 Overall Width E 3.00 BSC Exposed Pad Length D2 1.55 1.70 1.80 Contact Width b 0.20 0.25 0.30 Contact Length L 0.20 0.30 0.40 Contact-to-Exposed Pad K 0.20 - - Package Mechanical Drawings (all dimensions in mm)

Final Datasheet Rev 1.9 May 1, 2015 www.semtech.com 15 of 17 Semtech Recommeded PCB Land Pattern DIMENSIONS IN MILLIMETERS Units MILLIMETERS Dimension Limits MIN NOM MAX Contact Pitch E 0.50 BSC Optional Center Pad Width W2 - - 1.70 Optional Center Pad Length T2 - - 1.70 Contact Pad Spacing C1 - 3.00 - Contact Pad Spacing C2 - 3.00 - Contact Pad Width (X8) X1 - - 0.35 Contact Pad Length (X8) Y1 - - 0.65 Distance Between Pads G 0.15 - - Notes: Dimensions and tolerances per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact values shown without tolerances. REF: Reference Dimension, usually without tolerance, for information only.

Final Datasheet Rev 1.9 May 1, 2015 www.semtech.com 16 of 17 Semtech

Ordering Information

TS33000-M008QFNR 2.25MHz Sync Buck, 600mA - 0.8V TS33000-M012QFNR 2.25MHz Sync Buck, 600mA - 1.2V TS33000-M015QFNR 2.25MHz Sync Buck, 600mA - 1.5V TS33000-M018QFNR 2.25MHz Sync Buck, 600mA - 1.8V TS33000-M025QFNR 2.25MHz Sync Buck, 600mA - 2.5V TS33000-M033QFNR 2.25MHz Sync Buck, 600mA - 3.3V RoHS and Reach Compliance Triune Systems is fully committed to environmental quality. All Triune Systems materials and suppliers are fully compliant with RoHS (European Union Directive 2011/65/EU), REACH SVHC Chemical Restrictions (EC 1907/2006), IPC-1752 Level 3 materials declarations, and their subsequent amendments. Triune Systems maintains certified laboratory reports for all product materials, from all suppliers, which show full compliance to restrictions on the following:

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  • Perfluorocarbons (PFCs)
  • Polybrominated biphenyls (PBB)
  • Polybrominated Diphenyl Ethers (PBDEs)

Final Datasheet Rev 1.9 May 1, 2015 17 of 17 Semtech Contact Information Semtech Corporation

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