TS321-Q1 TI | Alldatasheet
Document overview
- Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
- PDF pages: 12
Technical content
FEATURES
DBV□(SOT-23-5)□PACKAGE (TOP VIEW) 5OUT VCC+ 3 4IN+ IN– VCC– DESCRIPTION/ORDERING INFORMATION TS321-Q1 www.ti.com SLOS647 AUGUST 2009 LOW-POWER SINGLE OPERATIONAL AMPLIFIER Qualified for Automotive
Applications
Supply: V to V Dual Supply: 1.5 V to V Large Output Voltage Swing: V to 3.5 V (Min) CC Low Supply Current: 500 µ A (Typ) Low Input Bias Current: nA (Typ) Stable With High Capacitive Loads The TS321 is a bipolar operational amplifier for cost-sensitive important. ORDERING INFORMATION (1) T A PACKAGE (2) ORDERABLE PART NUMBER TOP-SIDE MARKING C to 125 C SOT-23-5 DBV Reel of 3000 TS321QDBVRQ1 9CNS (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com (2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging Please be aware that an important notice concerning availability, standard warranty, and use in critical sheet. PRODUCTION DATA information is current as of publication date. Copyright 2009, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
IN– IN+ OUT TS321-Q1 SLOS647 AUGUST 2009 www.ti.com SCHEMATIC DIAGRAM Submit Documentation Feedback Copyright 2009, Texas Instruments Incorporated Product Folder Link(s): TS321-Q1
(1) RECOMMENDED OPERATING CONDITIONS TS321-Q1 www.ti.com SLOS647 AUGUST 2009 over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT Single V CC Supply voltage (2) V Dual V ID Differential input voltage (3) V V I Input voltage range (2) (4) 0.3 V I I Input current (4) mA t short Duration of output short circuit to ground Unlimited θ JA Package thermal impedance, junction to free air (5) (6) DBV package 206 C/W T J Operating virtual junction temperature 150 C T stg Storage temperature range 150 C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) These voltage values are with respect to the midpoint between V CC+ and V CC (3) Differential voltages are at IN+ with respect to IN (4) Neither input must ever be more positive than V CC+ or more negative than V CC (5) Maximum power dissipation is a function of T J (max), θ JA and T A The maximum allowable power dissipation at any allowable ambient temperature is P D J (max) T A θ JA Selecting the maximum of 150 C can affect reliability. (6) The package thermal impedance is calculated in accordance with JESD 51-7. MIN MAX UNIT Single supply V CC Supply voltage V Dual supply 1.5 T A Operating free-air temperature 125 C Copyright 2009, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TS321-Q1
www.ti.com V CC+ V CC GND, V O 1.4 V (unless otherwise noted) PARAMETER TEST CONDITIONS T A MIN TYP MAX UNIT C 0.5 R S V V CC+ V IO Input offset voltage mV V IC CC+ 1.5 Full range C I IO Input offset current nA Full range C 150 I IB Input bias current (1) nA Full range 200 C 100 Large-signal differential voltage V CC R L k Ω A VD V/mV amplification V O 1.4 V to 11.4 V Full range C V CC+ 1.5 V ICR Common-mode input voltage (2) V CC V V Full range V CC+ C R L k Ω Full range 25.5 V CC V C V OH High-level output voltage R L k Ω V Full range 26.5 C 3.5 V CC V R L k Ω Full range C V OL Low-level output voltage R L k Ω mV Full range V CC V I mV, R L k Ω GBP Gain bandwidth product C 0.8 MHz f 100 kHz, C L 100 pF V CC V I 0.5 V to SR Slew rate C 0.4 µ s R L k Ω C L 100 pF, unity gain φ m Phase margin C CMRR Common-mode rejection ratio R S k Ω C dB I SOURCE Output source current V CC V O V ID V C mA V O V C mA I SINK Output sink current V CC V ID V V O 0.2 V C µ A I O Short-circuit to GND V CC V C mA SVR Supply-voltage rejection ratio V CC V to V C 110 dB V CC V 500 800 C V CC V 600 900 I CC Total supply current No load µ A V CC V 600 900 Full range V CC V 1000 V CC V O V pp A V dB, THD Total harmonic distortion C 0.015 R L k Ω f kHz, C L 100 pF e N Equivalent input noise voltage V CC f kHz, R S 100 Ω C nV/ Hz (1) The direction of the input current is out of the device. This current essentially is constant, independent of the state of the output, so no loading change exists on the input lines. (2) The input common-mode voltage of either input signal should not be allowed to go negative by more than 0.3 The upper end of the common-mode voltage range is V CC+ 1.5 but either or both inputs can go to V without damage. Submit Documentation Feedback Copyright 2009, Texas Instruments Incorporated Product Folder Link(s): TS321-Q1
www.ti.com 23-May-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) TS321QDBVRQ1 Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 9CNS TS321QDBVRQ1.A Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 9CNS (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF TS321-Q1 :
- Catalog : TS321 Addendum-Page 1
www.ti.com 23-May-2025 NOTE: Qualified Version Definitions:
- Catalog - TI's standard catalog product Addendum-Page 2
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 3-Aug-2017 Pack Materials-Page 1
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TS321QDBVRQ1 SOT-23 DBV 5 3000 202.0 201.0 28.0 PACKAGE MATERIALS INFORMATION www.ti.com 3-Aug-2017 Pack Materials-Page 2
www.ti.com PACKAGE OUTLINE C 0.22
0.08 TYP
0.25 3.0 2.6 2X 0.95 1.9 1.45 0.90 0.15
0.00 TYP
5X 0.5 0.3 0.6
0.3 TYP
0 TYP
1.9 (0.1) (0.15) 4X 0 -15 4X 4 -15 A 3.05 2.75 B1.75 1.45 (1.1) SOT-23 - 1.45 mm max heightDBV0005A SMALL OUTLINE TRANSISTOR 4214839/K 08/2024 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Refernce JEDEC MO-178. 4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.25 mm per side. 5. Support pin may differ or may not be present.
0.2 C A B
0.1 C SCALE 4.000
www.ti.com EXAMPLE BOARD LAYOUT
0.07 MAX
0.07 MIN
5X (1.1) 5X (0.6) (2.6) (1.9) 2X (0.95) (R0.05) TYP 4214839/K 08/2024 SOT-23 - 1.45 mm max heightDBV0005A SMALL OUTLINE TRANSISTOR NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X PKG 3 4 SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL METALSOLDER MASK OPENING NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DETAILS EXPOSED METAL
www.ti.com EXAMPLE STENCIL DESIGN (2.6) (1.9) 2X(0.95) 5X (1.1) 5X (0.6) (R0.05) TYP SOT-23 - 1.45 mm max heightDBV0005A SMALL OUTLINE TRANSISTOR 4214839/K 08/2024 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:15X SYMM PKG 3 4
IMPORTANT NOTICE AND DISCLAIMER TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, regulatory or other requirements. These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources. TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products. TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2025, Texas Instruments Incorporated