TS321 TI | Alldatasheet

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D□(SOIC)□PACKAGE (TOP VIEW) 3 6 4 5 OUT VCC+IN– IN+ VCC– NC NCNC DBV□(SOT-23-5)□PACKAGE (TOP VIEW) 5OUT VCC+ 3 4IN+ IN– VCC– NC – No□internal□connection DESCRIPTION/ORDERING INFORMATION TS321 LOW-POWER SINGLE OPERATIONAL AMPLIFIER SLOS489A DECEMBER 2005 REVISED MARCH 2007 Wide Power-Supply Range Single Supply V to V Dual Supply 1.5 V to V Large Output Voltage Swing V to 3.5 V (Min) CC Low Supply Current 500 µ A (Typ) Low Input Bias Current nA (Typ) Low Input Offset Voltage mV (Max) Stable With High Capacitive Loads The TS321 is a bipolar operational amplifier for cost-sensitive

applications

important. ORDERING INFORMATION T A PACKAGE (1) ORDERABLE PART NUMBER TOP-SIDE MARKING (2) Tube of TS321ID SOIC D SR321I Reel of 2500 TS321IDR C to 125 C Reel of 3000 TS321IDBVR SOT-23-5 DBV 9C1_ Reel of 250 TS321IDBVT (1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. (2) DBV: The actual top-side marking has one additional character that designates the assembly/test site. Please be aware that an important notice concerning availability, standard warranty, and use in critical sheet. PRODUCTION DATA information is current as of publication date. Copyright 2005 2007, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

www.ti.com VCC IN– IN+ OUT TS321 LOW-POWER SINGLE OPERATIONAL AMPLIFIER SLOS489A DECEMBER 2005 REVISED MARCH 2007 SCHEMATIC DIAGRAM Submit Documentation Feedback

www.ti.com Absolute Maximum Ratings (1) Recommended Operating Conditions TS321 LOW-POWER SINGLE OPERATIONAL AMPLIFIER SLOS489A DECEMBER 2005 REVISED MARCH 2007 over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT Single V CC Supply voltage (2) V Dual V ID Differential input voltage (3) V V I Input voltage range (2) (4) 0.3 V I I Input current (4) mA t short Duration of output short circuit to ground Unlimited D package θ JA Package thermal impedance, junction to free air (5) (6) C/W DBV package 206 T J Operating virtual junction temperature 150 C T stg Storage temperature range 150 C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) These voltage values are with respect to the midpoint between V CC+ and V CC (3) Differential voltages are at IN+ with respect to IN (4) Neither input must ever be more positive than V CC+ or more negative than V CC (5) Maximum power dissipation is a function of T J (max), θ JA and T A The maximum allowable power dissipation at any allowable ambient temperature is P D J (max) T A θ JA Selecting the maximum of 150 C can affect reliability. (6) The package thermal impedance is calculated in accordance with JESD 51-7. MIN MAX UNIT Single supply V CC Supply voltage V Dual supply 1.5 T A Operating free-air temperature 125 C Submit Documentation Feedback

www.ti.com Electrical Characteristics TS321 LOW-POWER SINGLE OPERATIONAL AMPLIFIER SLOS489A DECEMBER 2005 REVISED MARCH 2007 V CC+ V CC GND, V O 1.4 V (unless otherwise noted) PARAMETER TEST CONDITIONS T A MIN TYP MAX UNIT C 0.5 R S V V CC+ V IO Input offset voltage mV V IC CC+ 1.5 Full range C I IO Input offset current nA Full range C 150 I IB Input bias current (1) nA Full range 200 C 100 Large-signal differential voltage V CC R L k Ω A VD V/mV amplification V O 1.4 V to 11.4 V Full range C V CC+ 1.5 V ICR Common-mode input voltage (2) V CC V V Full range V CC+ C R L k Ω Full range 25.5 V CC V C V OH High-level output voltage R L k Ω V Full range 26.5 C 3.5 V CC V R L k Ω Full range C V OL Low-level output voltage R L k Ω V Full range V CC V I mV, R L k Ω GBP Gain bandwidth product C 0.8 MHz f 100 kHz, C L 100 pF V CC V I 0.5 V to SR Slew rate C 0.4 µ s R L k Ω C L 100 pF, unity gain φ m Phase margin C CMRR Common-mode rejection ratio R S k Ω C dB I SOURCE Output source current V CC V O V ID V C mA V O V C mA I SINK Output sink current V CC V ID V V O 0.2 V C µ A I O Short-circuit to GND V CC V C mA SVR Supply-voltage rejection ratio V CC V to V C 110 dB V CC V 500 800 C V CC V 600 900 I CC Total supply current No load µ A V CC V 600 900 Full range V CC V 1000 V CC V O V pp A V dB, THD Total harmonic distortion C 0.015 R L k Ω f kHz, C L 100 pF e N Equivalent input noise voltage V CC f kHz, R S 100 Ω C nV/ Hz (1) The direction of the input current is out of the device. This current essentially is constant, independent of the state of the output, so no loading change exists on the input lines. (2) The input common-mode voltage of either input signal should not be allowed to go negative by more than 0.3 The upper end of the common-mode voltage range is V CC+ 1.5 but either or both inputs can go to V without damage. Submit Documentation Feedback

Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) TS321ID ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS321IDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS321IDBVRE4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS321IDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS321IDBVTE4 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS321IDE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS321IDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS321IDRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (1)The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2)Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontentfor the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS):TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br):TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. PACKAGE OPTION ADDENDUM www.ti.com 28-Feb-2007 Addendum-Page 1

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